FR2392577A1 - Dispositif de refroidissement par air pour circuits electroniques - Google Patents

Dispositif de refroidissement par air pour circuits electroniques

Info

Publication number
FR2392577A1
FR2392577A1 FR7815146A FR7815146A FR2392577A1 FR 2392577 A1 FR2392577 A1 FR 2392577A1 FR 7815146 A FR7815146 A FR 7815146A FR 7815146 A FR7815146 A FR 7815146A FR 2392577 A1 FR2392577 A1 FR 2392577A1
Authority
FR
France
Prior art keywords
cooling device
air cooling
electronic circuits
printed circuit
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7815146A
Other languages
English (en)
Other versions
FR2392577B1 (fr
Inventor
Tsuneaki Tajima
Yohichi Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of FR2392577A1 publication Critical patent/FR2392577A1/fr
Application granted granted Critical
Publication of FR2392577B1 publication Critical patent/FR2392577B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

Dispositif de refroidissement de composants électroniques fixés sur des plaquettes à circuits imprimés. Le dispositif prévoit un conduit à double paroi et l'introduction d'air perpendiculairement à la longueur de l'ensemble électronique, ce qui permet de réduire la résistance du dispositif au débit d'air traversant un conduit de façon à augmenter ce débit et à maintenir la température des composants électroniques aussi basse que possible. Application aux dispositifs électroniques à plaquettes à circuits imprimés.
FR7815146A 1977-05-24 1978-05-22 Dispositif de refroidissement par air pour circuits electroniques Granted FR2392577A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52060627A JPS6011830B2 (ja) 1977-05-24 1977-05-24 電子部品の冷却装置

Publications (2)

Publication Number Publication Date
FR2392577A1 true FR2392577A1 (fr) 1978-12-22
FR2392577B1 FR2392577B1 (fr) 1982-10-15

Family

ID=13147718

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7815146A Granted FR2392577A1 (fr) 1977-05-24 1978-05-22 Dispositif de refroidissement par air pour circuits electroniques

Country Status (3)

Country Link
US (1) US4158875A (fr)
JP (1) JPS6011830B2 (fr)
FR (1) FR2392577A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2570920A1 (fr) * 1984-09-26 1986-03-28 Nec Corp Appareil de refroidissement par air de dispositifs electroniques
EP0281404A2 (fr) * 1987-03-04 1988-09-07 Nec Corporation Système de refroidissement pour équipement électronique

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US4417295A (en) * 1977-06-30 1983-11-22 International Business Machines Corporation Air jet powered cooling system for electronic assemblies
GB2033668B (en) * 1978-11-11 1983-01-06 Ferranti Ltd Circuit assemblies
CA1164578A (fr) * 1980-10-24 1984-03-27 Yoshihiro Takahashi Logement pour dispositifs electroniques de communication
JPS5780068A (en) * 1980-11-07 1982-05-19 Hitachi Ltd Printing apparatus
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
US4449164A (en) * 1982-09-27 1984-05-15 Control Data Corporation Electronic module cooling system using parallel air streams
DE3585447D1 (de) * 1984-11-15 1992-04-02 Fujitsu Ltd Kuehlungsstruktur eines gestells fuer elektronische geraete.
US4682268A (en) * 1985-02-07 1987-07-21 Nec Corporation Mounting structure for electronic circuit modules
US4672509A (en) * 1986-08-07 1987-06-09 Ncr Corporation Air cooling assembly in an electronic system enclosure
US4942497A (en) * 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
CA1283225C (fr) * 1987-11-09 1991-04-16 Shinji Mine Systeme de refroidissement pour bloc de circuit integre tridimensionnel
CA1327710C (fr) * 1987-12-07 1994-03-15 Kazuhiko Umezawa Systeme de refroidissement pour boitier de circuit integre
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nippon Electric Co Flache Kühlungsstruktur für integrierte Schaltung.
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
JP2708495B2 (ja) * 1988-09-19 1998-02-04 株式会社日立製作所 半導体冷却装置
US5014777A (en) * 1988-09-20 1991-05-14 Nec Corporation Cooling structure
US4956746A (en) * 1989-03-29 1990-09-11 Hughes Aircraft Company Stacked wafer electronic package
CA2053055C (fr) * 1990-10-11 1997-02-25 Tsukasa Mizuno Systeme de refroidissement par liquide pour boitiers lsi
US5237484A (en) * 1991-07-08 1993-08-17 Tandem Computers Incorporated Apparatus for cooling a plurality of electronic modules
US5207613A (en) * 1991-07-08 1993-05-04 Tandem Computers Incorporated Method and apparatus for mounting, cooling, interconnecting, and providing power and data to a plurality of electronic modules
JP2748732B2 (ja) * 1991-07-19 1998-05-13 日本電気株式会社 液体冷媒循環システム
DE4211759C2 (de) * 1992-04-08 1997-04-03 Schroff Gmbh Lüftereinschub
US5335144A (en) * 1992-11-02 1994-08-02 Samar Enterprises Company, Ltd. Modular stacked housing arrangement
US5787971A (en) * 1996-03-25 1998-08-04 Dodson; Douglas A. Multiple fan cooling device
US5638895A (en) * 1996-03-25 1997-06-17 Dodson; Douglas A. Twin fan cooling device
US6034873A (en) * 1998-06-02 2000-03-07 Ericsson Inc System and method for separating air flows in a cooling system
JP2000022373A (ja) * 1998-07-03 2000-01-21 Toshiba Corp 電子機器
JP3408424B2 (ja) * 1998-07-28 2003-05-19 日本電気株式会社 電子機器の冷却構造
US6198628B1 (en) 1998-11-24 2001-03-06 Unisys Corporation Parallel cooling of high power devices in a serially cooled evironment
US6151210A (en) * 1999-05-06 2000-11-21 Lucent Technologies Inc. Modular design of electronic equipment systems
US7630198B2 (en) 2006-03-08 2009-12-08 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US6412292B2 (en) 2000-05-09 2002-07-02 Toc Technology, Llc Computer rack heat extraction device
AU2001237034A1 (en) 2000-02-18 2001-08-27 Rtkl Associates Inc. Computer rack heat extraction device
US6574970B2 (en) 2000-02-18 2003-06-10 Toc Technology, Llc Computer room air flow method and apparatus
US6557357B2 (en) 2000-02-18 2003-05-06 Toc Technology, Llc Computer rack heat extraction device
US6459579B1 (en) * 2001-01-03 2002-10-01 Juniper Networks, Inc. Apparatus and method for directing airflow in three dimensions to cool system components
US6535382B2 (en) * 2001-04-12 2003-03-18 Johnson Controls Technology Company Cooling system for electronic equipment cabinets
DE10128367A1 (de) * 2001-06-12 2003-01-02 Fujitsu Siemens Computers Gmbh Computerschrank sowie Anordnung eines Computerschrankes
US6668565B1 (en) 2002-04-12 2003-12-30 American Power Conversion Rack-mounted equipment cooling
US6867967B2 (en) * 2002-12-16 2005-03-15 International Business Machines Corporation Method of constructing a multicomputer system
US7046514B2 (en) 2003-03-19 2006-05-16 American Power Conversion Corporation Data center cooling
US6859366B2 (en) * 2003-03-19 2005-02-22 American Power Conversion Data center cooling system
JP4322637B2 (ja) * 2003-11-20 2009-09-02 株式会社日立製作所 ディスクアレイ装置
US7184267B2 (en) * 2003-12-12 2007-02-27 Hewlett-Packard Development Company, Lp. Longitudinally cooled electronic assembly
US7074123B2 (en) * 2004-01-13 2006-07-11 Power Of 4, L.L.C. Cabinet for computer devices with air distribution device
US20060011326A1 (en) * 2004-07-15 2006-01-19 Yassour Yuval Heat-exchanger device and cooling system
US7361081B2 (en) * 2004-07-23 2008-04-22 Hewlett-Packard Development Company, L.P. Small form factor air jet cooling system
US7259963B2 (en) * 2004-12-29 2007-08-21 American Power Conversion Corp. Rack height cooling
US7841199B2 (en) * 2005-05-17 2010-11-30 American Power Conversion Corporation Cold aisle isolation
US7762373B2 (en) * 2005-05-25 2010-07-27 Sony Corporation Fan noise control apparatus
US7434412B1 (en) * 2005-10-27 2008-10-14 Sun Microsystems, Inc. Computer equipment temperature control system and methods for operating the same
US7319596B2 (en) * 2006-03-24 2008-01-15 Fujitsu Limited Electronic apparatus
US7604535B2 (en) 2006-04-27 2009-10-20 Wright Line, Llc Assembly for extracting heat from a housing for electronic equipment
US8764528B2 (en) * 2006-04-27 2014-07-01 Wright Line, Llc Systems and methods for closed loop heat containment with cold aisle isolation for data center cooling
US20090239460A1 (en) * 2006-04-27 2009-09-24 Wright Line, Llc Assembly for Extracting Heat from a Housing for Electronic Equipment
US20080291625A1 (en) * 2007-05-21 2008-11-27 Rathbun Ii Dale Direct cooling system
US20090061755A1 (en) * 2007-08-28 2009-03-05 Panduit Corp. Intake Duct
US8139358B2 (en) * 2007-09-25 2012-03-20 International Business Machines Corporation Apparatus for externally changing the direction of air flowing through electronic equipment
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
JP5130960B2 (ja) * 2008-03-06 2013-01-30 日本電気株式会社 電子機器搭載用ラック及びその冷却機構
US7898799B2 (en) 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
US7903403B2 (en) 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
US8845403B2 (en) 2010-05-18 2014-09-30 International Business Machines Corporation Individually cooling one or more computers in a rack of computers in a data center
US8233274B2 (en) * 2010-07-21 2012-07-31 International Business Machines Corporation Computer chassis cooling sidecar
US8270161B2 (en) 2010-08-06 2012-09-18 International Business Machines Corporation Hot or cold aisle computer chassis
US8626346B2 (en) 2010-08-06 2014-01-07 International Business Machines Corporation Dynamically adjustable floor tile for a data center
US8812275B2 (en) 2010-09-18 2014-08-19 International Business Machines Corporation Modeling movement of air under a floor of a data center
CA2819890C (fr) 2010-12-22 2019-01-15 Cooper Technologies Company Systeme de distribution concu pour reguler un flux d'air dans une enceinte antideflagrante
US9668385B2 (en) 2010-12-22 2017-05-30 Cooper Technologies Company Controlling airflow within an explosion-proof enclosure
FR2989861A1 (fr) 2012-04-20 2013-10-25 No Rack Baie de serveurs informatiques
US9839155B2 (en) 2012-05-16 2017-12-05 Panduit Corp. Thermal ducting system
CA2882527C (fr) 2012-08-24 2021-02-16 Cooper Technologies Company Regulateur de temperature programmable d'enceintes d'emplacements dangereux
US11102910B2 (en) * 2017-08-01 2021-08-24 Dell Products L.P. Flexible service air baffle

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US3387648A (en) * 1967-02-23 1968-06-11 Navy Usa Cabinet enclosed recirculation cooling system carried on extensible chassis mountingelectronic modules
US3749981A (en) * 1971-08-23 1973-07-31 Controlled Power Corp Modular power supply with indirect water cooling
CA997049A (en) * 1973-10-05 1976-09-14 William F. Olashaw Heat dissipation means for electric devices mounted in switchboards, especially circuit breakers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2570920A1 (fr) * 1984-09-26 1986-03-28 Nec Corp Appareil de refroidissement par air de dispositifs electroniques
EP0281404A2 (fr) * 1987-03-04 1988-09-07 Nec Corporation Système de refroidissement pour équipement électronique
EP0281404A3 (fr) * 1987-03-04 1989-11-23 Nec Corporation Système de refroidissement pour équipement électronique

Also Published As

Publication number Publication date
JPS6011830B2 (ja) 1985-03-28
US4158875A (en) 1979-06-19
JPS53145054A (en) 1978-12-16
FR2392577B1 (fr) 1982-10-15

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