JP5003875B2 - 冷却機構 - Google Patents
冷却機構 Download PDFInfo
- Publication number
- JP5003875B2 JP5003875B2 JP2007051026A JP2007051026A JP5003875B2 JP 5003875 B2 JP5003875 B2 JP 5003875B2 JP 2007051026 A JP2007051026 A JP 2007051026A JP 2007051026 A JP2007051026 A JP 2007051026A JP 5003875 B2 JP5003875 B2 JP 5003875B2
- Authority
- JP
- Japan
- Prior art keywords
- duct
- fan
- cooling
- diameter portion
- cooling mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/2019—Fan safe systems, e.g. mechanical devices for non stop cooling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Description
前記電子部品に冷却用の流体を導く為に前記電子部品に出口側が対向するように設けら
れ、小口径部と大口径部とが繋がった断面略凸形状の管で構成される第1のダクトと、
前記第1のダクトにおける大口径部の管の中に設けられ、該大口径部より口径が小さな第2のダクトと、
前記第1のダクトの小口径部の入口側に対応して設けられた第1のファンと、
前記第2のダクトの出口側に対応して設けられた第2のファンと、
前記第1のダクトの小口径部の出口側であって、前記第2のダクトの入口側に対応して設けられた第3のファンと、
前記第1のファンによって第1のダクトの小口径部の入口側から供給されて来た冷却用の流体の一部が、第2のダクトの外側であって、かつ、第1のダクトの大口径部の内側を介して排出可能に構成され、冷却用の流体の一部を前記電子部品に導くバイパス流路
とを具備することを特徴とする冷却機構によって解決される。
図1〜図3は本発明になる冷却機構の実施形態を説明するもので、図1は冷却機構の概略説明図、図2(1),(2),(3)は本発明の冷却機構の特徴を本発明外の冷却機構と対比して説明するものであり、図3は本発明の冷却機構の特長を説明するグラフである。
図2(1)は、一つのパイプの両端部(入口側と出口側)にファンを設けたものである。図2(3)が三つ以上のファンを設けた本発明になるものである。図2(2)は本発明の場合と同じ数のファンを設けたものの、菅が一つの口径になるもので、本発明の如く、流路にバイパス経路を持たないものである。
1a 小口径からなる菅
1b 大口径からなる菅
2 第2ダクト
3 第3ダクト
4 第1ファン(吸気用ファン)
5 第2ファン(排気用ファン)
6 第3ファン
7 第4ファン
特許出願人 日本電気株式会社
代 理 人 宇 高 克 己
Claims (1)
- 電子部品を冷却する為の冷却機構であって、
前記電子部品に冷却用の流体を導く為に前記電子部品に出口側が対向するように設けられ、小口径部と大口径部とが繋がった断面略凸形状の管で構成される第1のダクトと、
前記第1のダクトにおける大口径部の管の中に設けられ、該大口径部より口径が小さな第2のダクトと、
前記第1のダクトの小口径部の入口側に対応して設けられた第1のファンと、
前記第2のダクトの出口側に対応して設けられた第2のファンと、
前記第1のダクトの小口径部の出口側であって、前記第2のダクトの入口側に対応して設けられた第3のファンと、
前記第1のファンによって第1のダクトの小口径部の入口側から供給されて来た冷却用の流体の一部が、第2のダクトの外側であって、かつ、第1のダクトの大口径部の内側を介して排出可能に構成され、冷却用の流体の一部を前記電子部品に導くバイパス流路
とを具備することを特徴とする冷却機構。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007051026A JP5003875B2 (ja) | 2007-03-01 | 2007-03-01 | 冷却機構 |
US12/036,719 US8998689B2 (en) | 2007-03-01 | 2008-02-25 | Cooling mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007051026A JP5003875B2 (ja) | 2007-03-01 | 2007-03-01 | 冷却機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008218543A JP2008218543A (ja) | 2008-09-18 |
JP5003875B2 true JP5003875B2 (ja) | 2012-08-15 |
Family
ID=39838271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007051026A Expired - Fee Related JP5003875B2 (ja) | 2007-03-01 | 2007-03-01 | 冷却機構 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8998689B2 (ja) |
JP (1) | JP5003875B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008013850B8 (de) * | 2008-03-12 | 2010-02-11 | Nft Nanofiltertechnik Gmbh | Klimatisierungseinrichtung für in einem Schaltschrank angeordnete elektronische Bauelemente und Anordnung zur Klimatisierung eines Schaltschrankes |
JP4558821B2 (ja) | 2008-08-27 | 2010-10-06 | ジヤトコ株式会社 | 自動変速機 |
EP2469086A1 (en) * | 2009-08-18 | 2012-06-27 | Mitsubishi Heavy Industries, Ltd. | Wind power generator |
US10653033B1 (en) * | 2018-10-30 | 2020-05-12 | Micron Technology, Inc. | Kits for enhanced cooling of components of computing devices and related computing devices, systems and methods |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
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US4068471A (en) * | 1975-06-16 | 1978-01-17 | General Electric Company | Variable cycle engine with split fan section |
JPS58102548A (ja) * | 1981-12-14 | 1983-06-18 | Fuji Electric Co Ltd | 風冷式半導体変換装置 |
JPS59178798A (ja) * | 1983-03-30 | 1984-10-11 | 株式会社日立製作所 | 車載用密閉形電子装置の冷却構造 |
JPS59152791U (ja) * | 1983-03-31 | 1984-10-13 | 三菱電機株式会社 | 電子機器筐体 |
JPS6237992U (ja) * | 1985-08-23 | 1987-03-06 | ||
JPH0292991A (ja) * | 1988-09-30 | 1990-04-03 | Uop Inc | サワー炭化水素留分の非酸化的接触スウィートニング方法 |
JPH0292991U (ja) * | 1989-01-11 | 1990-07-24 | ||
JP2934493B2 (ja) * | 1990-10-24 | 1999-08-16 | 株式会社日立製作所 | 電子機器の冷却装置 |
JPH04328898A (ja) * | 1991-04-26 | 1992-11-17 | Sharp Corp | 電子機器の空冷装置 |
US5297005A (en) * | 1992-09-28 | 1994-03-22 | Energy Innovations, Inc. | Apparatus and method for cooling heat generating electronic components in a cabinet |
US5796580A (en) * | 1993-04-13 | 1998-08-18 | Hitachi, Ltd. | Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels |
US5559673A (en) * | 1994-09-01 | 1996-09-24 | Gagnon; Kevin M. | Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control panel |
US5572403A (en) * | 1995-01-18 | 1996-11-05 | Dell Usa, L.P. | Plenum bypass serial fan cooling subsystem for computer systems |
US5745041A (en) * | 1995-07-11 | 1998-04-28 | Dell U.S.A., L.P. | System for dissipating heat from a power supply |
US6086476A (en) * | 1998-07-31 | 2000-07-11 | Compaq Computer Corporation | Method and apparatus for cooling and acoustic noise reduction in a computer |
US6031717A (en) * | 1999-04-13 | 2000-02-29 | Dell Usa, L.P. | Back flow limiting device for failed redundant parallel fan |
US6538881B1 (en) * | 2000-06-12 | 2003-03-25 | Alcatel Canada Inc. | Cooling of electronic equipment |
JP3080470U (ja) | 2000-09-05 | 2001-09-28 | 游 明銓 | 中央処理装置用の冷却装置 |
US6407918B1 (en) * | 2001-03-30 | 2002-06-18 | General Electric Company | Series-parallel fan system |
US6877551B2 (en) * | 2002-07-11 | 2005-04-12 | Avaya Technology Corp. | Systems and methods for weatherproof cabinets with variably cooled compartments |
US6901739B2 (en) | 2003-10-07 | 2005-06-07 | General Electric Company | Gas turbine engine with variable pressure ratio fan system |
JP2005183651A (ja) * | 2003-12-19 | 2005-07-07 | Fujitsu Ltd | 筐体および付加装置 |
US20060217055A1 (en) * | 2005-03-25 | 2006-09-28 | Minel Kupferberg | Fan control system |
US7788940B2 (en) * | 2005-08-04 | 2010-09-07 | Liebert Corporation | Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation |
US7251136B2 (en) * | 2005-12-29 | 2007-07-31 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having a ventilating duct |
US20070178822A1 (en) * | 2006-01-31 | 2007-08-02 | Lanus Mark S | Method and apparatus for maintaining a cooling air path |
JP4898598B2 (ja) * | 2007-08-28 | 2012-03-14 | 株式会社日立製作所 | ラックマウント型制御装置の冷却構造及びラック型記憶制御装置 |
-
2007
- 2007-03-01 JP JP2007051026A patent/JP5003875B2/ja not_active Expired - Fee Related
-
2008
- 2008-02-25 US US12/036,719 patent/US8998689B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008218543A (ja) | 2008-09-18 |
US20080295999A1 (en) | 2008-12-04 |
US8998689B2 (en) | 2015-04-07 |
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