DE60129678D1 - Verfahren und vorrichtung für optische fasern und optoelektronische bauelemente passiver ausrichtung - Google Patents

Verfahren und vorrichtung für optische fasern und optoelektronische bauelemente passiver ausrichtung

Info

Publication number
DE60129678D1
DE60129678D1 DE60129678T DE60129678T DE60129678D1 DE 60129678 D1 DE60129678 D1 DE 60129678D1 DE 60129678 T DE60129678 T DE 60129678T DE 60129678 T DE60129678 T DE 60129678T DE 60129678 D1 DE60129678 D1 DE 60129678D1
Authority
DE
Germany
Prior art keywords
optical fibers
optoelectronic components
passive orientation
passive
orientation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60129678T
Other languages
English (en)
Other versions
DE60129678T2 (de
Inventor
Francois Marion
Regis Hamelin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE60129678D1 publication Critical patent/DE60129678D1/de
Application granted granted Critical
Publication of DE60129678T2 publication Critical patent/DE60129678T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE60129678T 2000-03-29 2001-03-27 Verfahren und vorrichtung für optische fasern und optoelektronische bauelemente passiver ausrichtung Expired - Lifetime DE60129678T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0003950A FR2807168B1 (fr) 2000-03-29 2000-03-29 Procede et dispositif d'alignement passif de fibres optiques et de composants optoelectroniques
FR0003950 2000-03-29
PCT/FR2001/000922 WO2001073492A1 (fr) 2000-03-29 2001-03-27 Procede et dispositif d'alignement passif de fibres optiques et de composants optoelectroniques

Publications (2)

Publication Number Publication Date
DE60129678D1 true DE60129678D1 (de) 2007-09-13
DE60129678T2 DE60129678T2 (de) 2008-04-30

Family

ID=8848598

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60129678T Expired - Lifetime DE60129678T2 (de) 2000-03-29 2001-03-27 Verfahren und vorrichtung für optische fasern und optoelektronische bauelemente passiver ausrichtung

Country Status (6)

Country Link
US (1) US6942396B2 (de)
EP (1) EP1269238B1 (de)
JP (1) JP4885399B2 (de)
DE (1) DE60129678T2 (de)
FR (1) FR2807168B1 (de)
WO (1) WO2001073492A1 (de)

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JP4532688B2 (ja) * 2000-07-19 2010-08-25 キヤノン株式会社 面型光素子を備えた装置
JP3800135B2 (ja) 2002-06-18 2006-07-26 セイコーエプソン株式会社 光通信モジュール、光通信モジュールの製造方法および電子機器
WO2004038473A1 (en) * 2002-10-22 2004-05-06 Firecomms Limited Connection of optical waveguides to optical devices
CA2569265C (en) 2003-07-24 2012-10-09 Reflex Photonique Inc./Reflex Photonics Inc. Encapsulated optical package
US20050077129A1 (en) * 2003-10-06 2005-04-14 Joel Sloan Multi-axis shock and vibration relay isolator
GB0505824D0 (en) * 2005-03-22 2005-04-27 Conductive Inkjet Tech Ltd Treatment of items
US7859071B2 (en) * 2005-03-31 2010-12-28 Finisar Corporation Power and communication interface for sensors using a single tethered fiber
US8154414B2 (en) * 2005-03-31 2012-04-10 Finisar Corporation Systems and methods for collecting data with sensors
JP2006293019A (ja) * 2005-04-11 2006-10-26 Denso Corp 光ファイバセンサ
FR2885701B1 (fr) * 2005-05-10 2009-01-16 Commissariat Energie Atomique Dispositif emetteur et recepteur optoelectronique
GB2428103B (en) * 2005-07-07 2009-06-17 Agilent Technologies Inc An optical device
JP2007310083A (ja) * 2006-05-17 2007-11-29 Fuji Xerox Co Ltd 光伝送モジュールおよびその製造方法
JP2008109048A (ja) * 2006-10-27 2008-05-08 Toshiba Corp 光半導体装置及び光伝送装置
DE102008022793B4 (de) * 2008-05-08 2010-12-16 Universität Ulm Vollständig selbstjustierter oberflächenemittierender Halbleiterlaser für die Oberflächenmontage mit optimierten Eigenschaften
DE102008050000A1 (de) * 2008-09-30 2010-04-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum gleichzeitigen mechanischen und elektrischen Verbinden von zwei Teilen
FR2938704B1 (fr) * 2008-11-19 2011-03-04 Commissariat Energie Atomique Systeme et procede de positionnement et d'alignement passif d'un element optique au plus pres d'un detecteur de rayonnement electromagnetique
US9882073B2 (en) 2013-10-09 2018-01-30 Skorpios Technologies, Inc. Structures for bonding a direct-bandgap chip to a silicon photonic device
US11181688B2 (en) 2009-10-13 2021-11-23 Skorpios Technologies, Inc. Integration of an unprocessed, direct-bandgap chip into a silicon photonic device
EP2626752B1 (de) * 2012-02-08 2014-11-19 The Swatch Group Research and Development Ltd. Vorrichtung zur Erfassung und Synchronisation der Position eines Rades in einem Uhrwerkmechanismus
JP2016503516A (ja) * 2012-11-15 2016-02-04 ４２３３９９９ カナダ インコーポレイテッド マイクロ発光ダイオードを使用する高速短距離光通信のための方法および装置
US9443835B2 (en) 2014-03-14 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods for performing embedded wafer-level packaging (eWLP) and eWLP devices, packages and assemblies made by the methods
US9209142B1 (en) 2014-09-05 2015-12-08 Skorpios Technologies, Inc. Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removal
US9541717B2 (en) * 2015-01-30 2017-01-10 Avago Technologies General IP (Singapore) Pta. Ltd. Optoelectronic assembly incorporating an optical fiber alignment structure
US20190129108A1 (en) 2017-10-31 2019-05-02 Versalume LLC Modular Laser Connector Packaging System and Method
US10551542B1 (en) 2018-12-11 2020-02-04 Corning Incorporated Light modules and devices incorporating light modules
EP4147876A1 (de) 2021-09-10 2023-03-15 Carl Zeiss Vision International GmbH Computerimplementiertes verfahren zur bestimmung von druckparameterwerten einer tintenstrahldruckvorrichtung, datenverarbeitungssystem, verfahren zum tintenstrahldrucken und tintenstrahldruckvorrichtung

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US4152713A (en) * 1977-12-05 1979-05-01 Bell Telephone Laboratories, Incorporated Unidirectional optical device and regenerator
US4225213A (en) * 1977-12-23 1980-09-30 Texas Instruments Incorporated Connector apparatus
JPH06237016A (ja) * 1993-02-09 1994-08-23 Matsushita Electric Ind Co Ltd 光ファイバモジュールおよびその製造方法
FR2704691B1 (fr) 1993-04-30 1995-06-02 Commissariat Energie Atomique Procédé d'enrobage de composants électroniques hybrides par billes sur un substrat.
US5555333A (en) 1993-07-12 1996-09-10 Ricoh Company, Ltd. Optical module and a fabrication process thereof
JP3166564B2 (ja) * 1995-06-27 2001-05-14 松下電器産業株式会社 半導体レーザ実装体およびその製造方法
KR100441810B1 (ko) * 1995-09-29 2004-10-20 모토로라 인코포레이티드 광전달구조물을정렬하기위한전자장치
US6328482B1 (en) * 1998-06-08 2001-12-11 Benjamin Bin Jian Multilayer optical fiber coupler
JP2000019357A (ja) * 1998-06-30 2000-01-21 Toshiba Corp 光アレイモジュール及び反射鏡アレイ

Also Published As

Publication number Publication date
US20040037514A1 (en) 2004-02-26
FR2807168A1 (fr) 2001-10-05
US6942396B2 (en) 2005-09-13
JP2003529213A (ja) 2003-09-30
EP1269238A1 (de) 2003-01-02
EP1269238B1 (de) 2007-08-01
DE60129678T2 (de) 2008-04-30
JP4885399B2 (ja) 2012-02-29
WO2001073492A1 (fr) 2001-10-04
FR2807168B1 (fr) 2002-11-29

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