DE60104556D1 - Selbstabstimmender millimeterwellen-sende-empfängermodul - Google Patents

Selbstabstimmender millimeterwellen-sende-empfängermodul

Info

Publication number
DE60104556D1
DE60104556D1 DE60104556T DE60104556T DE60104556D1 DE 60104556 D1 DE60104556 D1 DE 60104556D1 DE 60104556 T DE60104556 T DE 60104556T DE 60104556 T DE60104556 T DE 60104556T DE 60104556 D1 DE60104556 D1 DE 60104556D1
Authority
DE
Germany
Prior art keywords
self
transmitter receiver
tuning
shaft transmitter
millimeter shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60104556T
Other languages
English (en)
Other versions
DE60104556T2 (de
Inventor
F Ammar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xytrans Inc
Original Assignee
Xytrans Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xytrans Inc filed Critical Xytrans Inc
Publication of DE60104556D1 publication Critical patent/DE60104556D1/de
Application granted granted Critical
Publication of DE60104556T2 publication Critical patent/DE60104556T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165Containers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
DE60104556T 2000-09-11 2001-08-29 Selbstabstimmender millimeterwellen-sende-empfängermodul Expired - Fee Related DE60104556T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US863052 1986-05-14
US23192600P 2000-09-11 2000-09-11
US231926P 2000-09-11
US09/863,052 US7027789B2 (en) 2000-09-11 2001-05-22 Self-tuned millimeter wave RF transceiver module
PCT/US2001/041936 WO2002023718A2 (en) 2000-09-11 2001-08-29 Self-tuned millimeter wave rf transceiver module

Publications (2)

Publication Number Publication Date
DE60104556D1 true DE60104556D1 (de) 2004-09-02
DE60104556T2 DE60104556T2 (de) 2005-01-05

Family

ID=26925546

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60104556T Expired - Fee Related DE60104556T2 (de) 2000-09-11 2001-08-29 Selbstabstimmender millimeterwellen-sende-empfängermodul

Country Status (8)

Country Link
US (2) US7027789B2 (de)
EP (1) EP1317802B1 (de)
JP (1) JP2004519118A (de)
KR (1) KR20030081304A (de)
CN (1) CN1476679A (de)
AU (2) AU2001293230A1 (de)
DE (1) DE60104556T2 (de)
WO (1) WO2002023718A2 (de)

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US7076201B2 (en) * 2002-09-05 2006-07-11 Xytrans, Inc. Low cost VSAT MMIC transceiver with automatic power control
US7149496B2 (en) * 2003-03-27 2006-12-12 Kyocera Corporation High-frequency module and radio communication apparatus
US7167688B2 (en) * 2003-07-30 2007-01-23 Chi Mei Communication Systems, Inc. RF transceiver module formed in multi-layered ceramic
CN100407587C (zh) * 2003-09-27 2008-07-30 中兴通讯股份有限公司 一种毫米波接收模块
JP4087803B2 (ja) * 2004-02-10 2008-05-21 三菱電機株式会社 ミリ波送受信モジュールおよびバイアス調整方法
US20060160500A1 (en) * 2005-01-14 2006-07-20 Xytrans, Inc. VSAT block up converter (BUC) chip
CN101138259A (zh) * 2005-03-10 2008-03-05 Posdata株式会社 用于处理基于车辆的终端的射频信号的装置
KR100751065B1 (ko) * 2005-12-07 2007-08-22 한국전자통신연구원 Rf 송수신 모듈 및 이를 이용한 밀리미터파 fmcw레이더 센서
JP2008064577A (ja) * 2006-09-06 2008-03-21 Mitsutoyo Corp ノギス
EP2070278B1 (de) * 2006-10-06 2012-02-22 Skyworks Solutions, Inc. Ausgangsleistungskorrekturmodul für verstärker in sendern
US7492313B1 (en) * 2006-10-31 2009-02-17 Lockheed Martin Corporation Digital processing radar system
US8175545B2 (en) * 2007-05-17 2012-05-08 Broadcom Corporation Communication devices with integrated thermal sensing circuit and methods for use therewith
US8345716B1 (en) 2007-06-26 2013-01-01 Lockheed Martin Corporation Polarization diverse antenna array arrangement
US20090144458A1 (en) * 2007-12-03 2009-06-04 Broadcom Corporation Dongle device and host device with millimeter wave host inerface and method for use therewith
US8143654B1 (en) * 2008-01-16 2012-03-27 Triquint Semiconductor, Inc. Monolithic microwave integrated circuit with diamond layer
JP4755657B2 (ja) * 2008-01-18 2011-08-24 三菱電機株式会社 ミリ波送受信モジュール
DE102008016154B4 (de) * 2008-03-28 2013-08-08 Eads Deutschland Gmbh Verfahren zur Kompensation von Verstärkungsänderungen bei einer Verstärkerschaltung
JP2010008273A (ja) * 2008-06-27 2010-01-14 Maspro Denkoh Corp ミリ波撮像装置
JP2009180737A (ja) * 2009-04-17 2009-08-13 Mitsubishi Electric Corp ミリ波送受信モジュール
KR101101545B1 (ko) * 2010-06-11 2012-01-02 삼성전기주식회사 씨모스 전력 증폭장치 및 그 온도 보상 회로
US8422969B2 (en) * 2010-08-20 2013-04-16 Microelectronics Technology Inc. Radio frequency transceiver
FR2964811B1 (fr) * 2010-09-09 2013-10-04 Bluwan Systeme radio tres haut debit sans fil et multi-formes d'ondes
WO2014067100A1 (zh) 2012-10-31 2014-05-08 华为技术有限公司 一种发射机、接收机及射频收发方法
JP5719461B1 (ja) * 2014-03-27 2015-05-20 日本電信電話株式会社 コヒーレント光通信用増幅器
CN111543005A (zh) * 2017-12-19 2020-08-14 瑞典爱立信有限公司 功率放大器和包括功率放大器的射频设备
WO2019146284A1 (ja) * 2018-01-25 2019-08-01 株式会社村田製作所 高周波モジュールおよび通信装置
CN112187309A (zh) * 2019-06-13 2021-01-05 中兴通讯股份有限公司 一种毫米波收发信机
KR20210026776A (ko) 2019-09-02 2021-03-10 삼성전자주식회사 전자 장치

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DE3723360A1 (de) 1987-07-15 1989-01-26 Nukem Gmbh Verfahren und vorrichtung zur zerstoerungsfreien pruefung ferromagnetischer koerper mittels magnetisierung
US4924191A (en) * 1989-04-18 1990-05-08 Erbtec Engineering, Inc. Amplifier having digital bias control apparatus
FI83717C (fi) * 1989-09-25 1991-08-12 Nokia Mobile Phones Ltd Foerfarande foer intrimning och kompensation av effektnivaoer i en radiotelefon.
US5101173A (en) * 1990-11-28 1992-03-31 The United States Of America As Represented By The Secretary Of The Air Force Stored program controlled module amplifier bias and amplitude/phase compensation apparatus
US5192919A (en) * 1991-10-03 1993-03-09 Motorola, Inc. Transmitter having a temperature adjusted power amplifier
US5162657A (en) * 1991-11-06 1992-11-10 The United States Of America As Represented By The Secretary Of The Army Optical control of a microwave switch
FI93159C (fi) * 1992-09-23 1995-02-27 Nokia Mobile Phones Ltd Menetelmä radiopuhelimen radiotaajuusvahvistimen ohjaamiseksi ja menetelmän mukainen ohjausjärjestelmä
US5545924A (en) 1993-08-05 1996-08-13 Honeywell Inc. Three dimensional package for monolithic microwave/millimeterwave integrated circuits
JP3158833B2 (ja) * 1994-01-27 2001-04-23 三菱電機株式会社 移動無線装置
JPH08204587A (ja) * 1995-01-23 1996-08-09 Fujitsu Ltd 携帯電話機
GB2301248B (en) 1995-05-25 2000-08-09 Motorola Gmbh Amplifying circuit and method for determining optimal bias voltages therein
US5873029A (en) * 1997-02-19 1999-02-16 Motorola, Inc. High dynamic range millimeter wave power detector with temperature compensation
US6072995A (en) 1997-02-26 2000-06-06 Ericsson Inc. Flexible current control in power amplifiers
KR19990040843A (ko) * 1997-11-20 1999-06-15 윤종용 코드분할 다중접속 디지털 이동통신 시스템의 기지국 송신출력측정 및 기지국 호 시험을 위한 전력 검출 및 시험 단말장치
JP3013831B2 (ja) 1998-01-26 2000-02-28 日本電気株式会社 Mmicパッケージ
US5977826A (en) * 1998-03-13 1999-11-02 Behan; Scott T. Cascaded error correction in a feed forward amplifier
JPH11266129A (ja) * 1998-03-16 1999-09-28 Toshiba Corp 高周波半導体装置
US5994965A (en) * 1998-04-03 1999-11-30 Cbs Corporation Silicon carbide high frequency high power amplifier
US6615028B1 (en) * 1998-12-29 2003-09-02 Skyworks Solutions, Inc. System and method for selecting amplifiers in a communications device
US6327462B1 (en) 1998-12-29 2001-12-04 Conexant Systems, Inc. System and method for dynamically varying operational parameters of an amplifier
US6118342A (en) * 1999-04-13 2000-09-12 Space Systems/Loral, Inc. System and method for providing precise RF amplifier gain control over temperature
US6194968B1 (en) * 1999-05-10 2001-02-27 Tyco Electronics Logistics Ag Temperature and process compensating circuit and controller for an RF power amplifier
US6430403B1 (en) * 1999-06-10 2002-08-06 Lucent Technologies Inc. Temperature compensated, zero bias RF detector circuit
US6799020B1 (en) * 1999-07-20 2004-09-28 Qualcomm Incorporated Parallel amplifier architecture using digital phase control techniques
US6684065B2 (en) * 1999-12-20 2004-01-27 Broadcom Corporation Variable gain amplifier for low voltage applications
US6351189B1 (en) * 2000-07-31 2002-02-26 Nokia Networks Oy System and method for auto-bias of an amplifier
US6678507B1 (en) * 2000-08-31 2004-01-13 Hitachi, Ltd. Power amplifier system and mobile communication terminal device
US6525603B1 (en) * 2001-01-05 2003-02-25 Remec, Inc. Feedforward amplifier linearization adapting off modulation

Also Published As

Publication number Publication date
AU2001293230A1 (en) 2002-03-26
EP1317802A2 (de) 2003-06-11
WO2002023718A2 (en) 2002-03-21
CN1476679A (zh) 2004-02-18
WO2002023718A3 (en) 2002-10-17
US7027789B2 (en) 2006-04-11
WO2002023718A8 (en) 2002-11-21
US20020055349A1 (en) 2002-05-09
US20060135103A1 (en) 2006-06-22
JP2004519118A (ja) 2004-06-24
AU9323001A (en) 2002-03-26
EP1317802B1 (de) 2004-07-28
DE60104556T2 (de) 2005-01-05
KR20030081304A (ko) 2003-10-17
US7257381B2 (en) 2007-08-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee