DE60100329D1 - Polyimidfilm sowie Verfahren zu dessen Herstellung und dessen Verwendung als Substrat für Metallverbindungsplatten - Google Patents

Polyimidfilm sowie Verfahren zu dessen Herstellung und dessen Verwendung als Substrat für Metallverbindungsplatten

Info

Publication number
DE60100329D1
DE60100329D1 DE60100329T DE60100329T DE60100329D1 DE 60100329 D1 DE60100329 D1 DE 60100329D1 DE 60100329 T DE60100329 T DE 60100329T DE 60100329 T DE60100329 T DE 60100329T DE 60100329 D1 DE60100329 D1 DE 60100329D1
Authority
DE
Germany
Prior art keywords
substrate
production
polyimide film
connecting plates
metal connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60100329T
Other languages
English (en)
Other versions
DE60100329T2 (de
Inventor
Kenji Uhara
Kouichi Sawasaki
Naofumi Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Du Pont Toray Co Ltd
Original Assignee
Du Pont Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont Toray Co Ltd filed Critical Du Pont Toray Co Ltd
Publication of DE60100329D1 publication Critical patent/DE60100329D1/de
Application granted granted Critical
Publication of DE60100329T2 publication Critical patent/DE60100329T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE2001600329 2000-08-24 2001-08-24 Polyimidfilm sowie Verfahren zu dessen Herstellung und dessen Verwendung als Substrat für Metallverbindungsplatten Expired - Lifetime DE60100329T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000253421 2000-08-24
JP2000253421 2000-08-24

Publications (2)

Publication Number Publication Date
DE60100329D1 true DE60100329D1 (de) 2003-07-10
DE60100329T2 DE60100329T2 (de) 2004-05-13

Family

ID=18742520

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2001600329 Expired - Lifetime DE60100329T2 (de) 2000-08-24 2001-08-24 Polyimidfilm sowie Verfahren zu dessen Herstellung und dessen Verwendung als Substrat für Metallverbindungsplatten

Country Status (5)

Country Link
US (1) US6548179B2 (de)
EP (1) EP1182222B1 (de)
KR (1) KR100733105B1 (de)
DE (1) DE60100329T2 (de)
TW (1) TW593435B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI283253B (en) * 2000-08-11 2007-07-01 Mitsui Chemicals Inc Novel polyimide and circuit substrate comprising the same
US6908685B2 (en) * 2000-08-24 2005-06-21 E. I. Du Pont De Nemours And Company Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
US7766956B2 (en) * 2000-09-22 2010-08-03 Boston Scientific Scimed, Inc. Intravascular stent and assembly
CN100344444C (zh) * 2001-05-24 2007-10-24 东丽株式会社 带金属层的耐热性树脂膜与布线板及其制作方法
US7285321B2 (en) * 2003-11-12 2007-10-23 E.I. Du Pont De Nemours And Company Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
JP4544913B2 (ja) * 2004-03-24 2010-09-15 富士フイルム株式会社 表面グラフト形成方法、導電性膜の形成方法、金属パターン形成方法、多層配線板の形成方法、表面グラフト材料、及び導電性材料
US20090011231A1 (en) * 2004-10-05 2009-01-08 Hisayasu Kaneshiro Adhesive Sheet and Copper-Clad Laminate
KR20070035683A (ko) * 2005-09-28 2007-04-02 삼성전자주식회사 액정 표시 장치 및 그 제조 방법
US8932706B2 (en) * 2005-10-27 2015-01-13 Multi-Color Corporation Laminate with a heat-activatable expandable layer
US20070149001A1 (en) * 2005-12-22 2007-06-28 Uka Harshad K Flexible circuit
KR100845328B1 (ko) 2006-01-20 2008-07-10 주식회사 코오롱 폴리이미드 필름
US20090214837A1 (en) * 2008-02-21 2009-08-27 Multi-Color Corporation Insulating Label
TWI401252B (zh) 2010-06-22 2013-07-11 Chi Mei Corp 液晶配向劑，以及以其製得的液晶配向膜與液晶顯示元件
US8664817B2 (en) 2010-09-13 2014-03-04 Baker Hughes Incorporated Electrical submersible pump system having high temperature insulation materials and buffered lubricant
TWI427104B (zh) * 2010-10-26 2014-02-21 Chi Mei Corp 液晶配向劑，液晶配向膜，及含有該液晶配向膜的液晶顯示元件
US9155191B2 (en) * 2013-05-31 2015-10-06 Qualcomm Incorporated Substrate comprising inorganic material that lowers the coefficient of thermal expansion (CTE) and reduces warpage
CN106691519A (zh) * 2015-11-13 2017-05-24 刘智佳 一种手术器械及该手术器械用rfid标签的安装方法
CN106810692B (zh) * 2015-12-02 2020-02-11 株洲时代新材料科技股份有限公司 聚酰胺酸溶液的制备方法和聚酰亚胺薄膜
TWI802775B (zh) * 2019-12-18 2023-05-21 新揚科技股份有限公司 聚醯亞胺前驅物的製作方法及聚醯亞胺
CN113201136B (zh) * 2021-04-29 2022-01-07 上海瑞暨新材料科技有限公司 一种聚酰亚胺树脂的制备方法及其薄膜
CN115260492B (zh) * 2022-06-14 2024-04-26 安徽国风新材料股份有限公司 一种低热膨胀系数的聚酰亚胺薄膜的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2625689B2 (ja) * 1985-11-18 1997-07-02 淑夫 今井 単分子又は単分子累積膜の製造方法
DE3789296T2 (de) 1986-11-29 1994-10-13 Kanegafuchi Chemical Ind Polyimid mit Formstabilität beim Erhitzen.
JP3026957B2 (ja) 1986-11-29 2000-03-27 鐘淵化学工業株式会社 熱的寸法安定性のすぐれたポリイミドの製法
JP2603928B2 (ja) 1987-01-14 1997-04-23 鐘淵化学工業株式会社 新規なポリアミド酸組成物
JP2744786B2 (ja) 1987-01-20 1998-04-28 鐘淵化学工業株式会社 熱的寸法安定性にすぐれたポリイミド及びそれに用いるポリアミド酸
JPH0346292A (ja) 1989-07-14 1991-02-27 Kanegafuchi Chem Ind Co Ltd フレキシブルプリント基板及びその製造方法
DE69700977T2 (de) 1996-06-07 2000-05-18 Unitika Ltd Polyimidvorläuferlösung, Verfahren zu ihrer Herstellung und Verfahren zur Herstellung einer Beschichtung oder eines Films daraus
US5859171A (en) 1997-05-21 1999-01-12 Dupont Toray Polyimide copolymer, polyimide copolymer resin molded products and their preparation

Also Published As

Publication number Publication date
KR100733105B1 (ko) 2007-06-27
US20020045033A1 (en) 2002-04-18
EP1182222A1 (de) 2002-02-27
TW593435B (en) 2004-06-21
KR20020016553A (ko) 2002-03-04
DE60100329T2 (de) 2004-05-13
US6548179B2 (en) 2003-04-15
EP1182222B1 (de) 2003-06-04

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