DE60042983D1 - Aufschmelzlötvorrichtung und aufschmelzlötverfahren - Google Patents

Aufschmelzlötvorrichtung und aufschmelzlötverfahren

Info

Publication number
DE60042983D1
DE60042983D1 DE60042983T DE60042983T DE60042983D1 DE 60042983 D1 DE60042983 D1 DE 60042983D1 DE 60042983 T DE60042983 T DE 60042983T DE 60042983 T DE60042983 T DE 60042983T DE 60042983 D1 DE60042983 D1 DE 60042983D1
Authority
DE
Germany
Prior art keywords
soldering process
lubricating device
melting soldering
dispensing lubricating
dispensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60042983T
Other languages
English (en)
Inventor
Naoaki Nakamura
Osamu Higashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE60042983D1 publication Critical patent/DE60042983D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60042983T 2000-12-21 2000-12-21 Aufschmelzlötvorrichtung und aufschmelzlötverfahren Expired - Lifetime DE60042983D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/009108 WO2002051221A1 (fr) 2000-12-21 2000-12-21 Dispositif de soudage par refusion et procede de soudage par refusion

Publications (1)

Publication Number Publication Date
DE60042983D1 true DE60042983D1 (de) 2009-10-29

Family

ID=11736825

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60042983T Expired - Lifetime DE60042983D1 (de) 2000-12-21 2000-12-21 Aufschmelzlötvorrichtung und aufschmelzlötverfahren

Country Status (5)

Country Link
US (1) US6971571B2 (de)
EP (1) EP1345481B1 (de)
JP (1) JP3974525B2 (de)
DE (1) DE60042983D1 (de)
WO (1) WO2002051221A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007077727A1 (ja) * 2006-01-06 2007-07-12 Tamura Corporation リフロー装置
US7681776B2 (en) * 2006-08-01 2010-03-23 Raytheon Company Methods and apparatus for efficiently generating profiles for circuit board work/rework
JP5064307B2 (ja) * 2008-06-05 2012-10-31 本田技研工業株式会社 液体リフロー装置
JP2011077129A (ja) 2009-09-29 2011-04-14 Fujitsu Ltd ハンダ付け方法
JP5310634B2 (ja) * 2010-04-09 2013-10-09 千住金属工業株式会社 はんだ付け装置
JP2014011231A (ja) * 2012-06-28 2014-01-20 Hitachi Ltd ハンダボール印刷搭載装置
BR102012032031A2 (pt) * 2012-12-14 2014-09-09 Air Liquide Brasil Ltda Equipamento portátil para monitoramento e controle do nível de oxigênio em atmosfera de fornos de refusão
DE102019213511A1 (de) * 2019-09-05 2021-03-11 Rehm Thermal Systems Gmbh Reflow-Lötanlage zum kombinierten Konvektionslöten und Kondensationslöten
US11445650B2 (en) 2019-10-22 2022-09-13 International Business Machines Corporation Localized rework using liquid media soldering

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4155965A (en) * 1977-01-07 1979-05-22 The Dow Chemical Company Continuous submerged foaming of thermoplastic resin
FR2556083B1 (fr) * 1983-10-11 1986-04-25 Piezo Ceram Electronique Machine perfectionnee de chauffage d'un article ou produit par condensation de vapeur sur celui-ci
JPS6182965A (ja) 1984-09-28 1986-04-26 Ginya Ishii 噴流はんだ装置のはんだ酸化防止方法
IT1184362B (it) * 1985-03-06 1987-10-28 Montefluos Spa Procedimento per effittuare la saldatura di componenti elettronici su un supporto
US4830263A (en) * 1985-05-09 1989-05-16 Basf Corporation Thermally stable polyoxyalkylene heat transfer fluids
JPS6264475A (ja) 1985-09-17 1987-03-23 Kenji Kondo 物品の融着接合装置
JPS6330172A (ja) * 1986-07-24 1988-02-08 Nec Corp リフロ−はんだ付け装置
JPH01112721A (ja) 1987-10-27 1989-05-01 Matsushita Electric Ind Co Ltd 電子部品のリード線取付方法
JP2625918B2 (ja) 1988-06-30 1997-07-02 松下電器産業株式会社 半田付装置の液浄化装置
JPH03125897A (ja) * 1989-10-12 1991-05-29 R I Denshi Kogyo:Kk 酸素濃度極低下雰囲気炉
FR2661189B1 (fr) 1990-04-19 1994-11-18 Pernod Ricard Production de vanilline par bioconversion de precurseurs benzeniques.
JPH0621644A (ja) 1992-07-02 1994-01-28 Osaka Asahi Kagaku Kk 温度制御の良いリフロー炉
JPH0679447A (ja) 1992-07-03 1994-03-22 Fujitsu Ltd はんだ付け装置
JP3404768B2 (ja) 1992-08-07 2003-05-12 松下電器産業株式会社 リフロー装置
JPH06188556A (ja) 1992-12-17 1994-07-08 Matsushita Electric Ind Co Ltd リフロー装置
WO1994015533A2 (en) * 1993-01-18 1994-07-21 John Crowe Endoscope forceps
JPH06320260A (ja) 1993-05-14 1994-11-22 Tokuyama Soda Co Ltd 蒸気相はんだ付け方法及び装置
JPH0744824A (ja) 1993-07-29 1995-02-14 Sanyo Electric Co Ltd 磁気抵抗効果型磁気ヘッド及びその製造方法
JPH07212028A (ja) * 1994-01-13 1995-08-11 Matsushita Electric Ind Co Ltd リフロー装置
JPH07273442A (ja) 1994-03-31 1995-10-20 Kazuo Sotono バッチ式気相はんだ付装置
JPH0744824U (ja) * 1995-02-03 1995-11-28 有限会社アール・アイ電子工業 酸素濃度極低下雰囲気炉
US6386422B1 (en) * 2001-05-03 2002-05-14 Asm Assembly Automation Limited Solder reflow oven

Also Published As

Publication number Publication date
WO2002051221A1 (fr) 2002-06-27
EP1345481B1 (de) 2009-09-16
EP1345481A4 (de) 2006-06-21
JP3974525B2 (ja) 2007-09-12
JPWO2002051221A1 (ja) 2004-04-22
EP1345481A1 (de) 2003-09-17
US20030213833A1 (en) 2003-11-20
US6971571B2 (en) 2005-12-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE