DE60041428D1 - Neue Esterverbindungen, Polymere, Resistzusammensetzungen und Strukturierungsverfahren - Google Patents
Neue Esterverbindungen, Polymere, Resistzusammensetzungen und StrukturierungsverfahrenInfo
- Publication number
- DE60041428D1 DE60041428D1 DE60041428T DE60041428T DE60041428D1 DE 60041428 D1 DE60041428 D1 DE 60041428D1 DE 60041428 T DE60041428 T DE 60041428T DE 60041428 T DE60041428 T DE 60041428T DE 60041428 D1 DE60041428 D1 DE 60041428D1
- Authority
- DE
- Germany
- Prior art keywords
- polymers
- ester compounds
- resist compositions
- new ester
- structuring methods
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/74—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring
- C07C69/753—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring of polycyclic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F32/00—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
- C08F32/08—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having two condensed rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2602/00—Systems containing two condensed rings
- C07C2602/36—Systems containing two condensed rings the rings having more than two atoms in common
- C07C2602/42—Systems containing two condensed rings the rings having more than two atoms in common the bicyclo ring system containing seven carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2603/00—Systems containing at least three condensed rings
- C07C2603/56—Ring systems containing bridged rings
- C07C2603/58—Ring systems containing bridged rings containing three rings
- C07C2603/60—Ring systems containing bridged rings containing three rings containing at least one ring with less than six members
- C07C2603/66—Ring systems containing bridged rings containing three rings containing at least one ring with less than six members containing five-membered rings
- C07C2603/68—Dicyclopentadienes; Hydrogenated dicyclopentadienes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/55—Design of synthesis routes, e.g. reducing the use of auxiliary or protecting groups
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4740699 | 1999-02-25 | ||
JP17494599A JP3680920B2 (ja) | 1999-02-25 | 1999-06-22 | 新規なエステル化合物、高分子化合物、レジスト材料、及びパターン形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60041428D1 true DE60041428D1 (de) | 2009-03-12 |
Family
ID=26387563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60041428T Expired - Lifetime DE60041428D1 (de) | 1999-02-25 | 2000-02-25 | Neue Esterverbindungen, Polymere, Resistzusammensetzungen und Strukturierungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US6284429B1 (de) |
EP (1) | EP1031879B1 (de) |
JP (1) | JP3680920B2 (de) |
KR (1) | KR100461930B1 (de) |
DE (1) | DE60041428D1 (de) |
TW (1) | TWI225048B (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW457277B (en) * | 1998-05-11 | 2001-10-01 | Shinetsu Chemical Co | Ester compounds, polymers, resist composition and patterning process |
TWI228504B (en) * | 1998-11-02 | 2005-03-01 | Shinetsu Chemical Co | Novel ester compounds, polymers, resist compositions and patterning process |
KR100425442B1 (ko) * | 1999-08-24 | 2004-03-30 | 삼성전자주식회사 | 감광성 중합체 및 이를 포함하는 화학 증폭형포토레지스트 조성물 |
JP3969909B2 (ja) * | 1999-09-27 | 2007-09-05 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物 |
JP4269119B2 (ja) * | 1999-10-25 | 2009-05-27 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
US6524765B1 (en) * | 1999-11-15 | 2003-02-25 | Shin-Etsu Chemical Co., Ltd. | Polymer, resist composition and patterning process |
KR100498440B1 (ko) * | 1999-11-23 | 2005-07-01 | 삼성전자주식회사 | 백본이 환상 구조를 가지는 감광성 폴리머와 이를포함하는 레지스트 조성물 |
JP4529245B2 (ja) * | 1999-12-03 | 2010-08-25 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物 |
KR100389912B1 (ko) * | 1999-12-08 | 2003-07-04 | 삼성전자주식회사 | 지환식 감광성 폴리머 및 이를 포함하는 레지스트 조성물 |
KR20010054851A (ko) * | 1999-12-08 | 2001-07-02 | 윤종용 | 지환식 감광성 폴리머 및 이를 포함하는 레지스트조성물과 그 제조방법 |
EP1130468A3 (de) * | 2000-02-25 | 2003-07-30 | Shipley Company LLC | Polymer und Photolackzusammensetzungen |
EP1127870B1 (de) * | 2000-02-26 | 2003-11-05 | Shipley Company LLC | Monomere,Polymere,Verfahren zu ihrer Synthese und Photoresistcompositionen |
US6777157B1 (en) * | 2000-02-26 | 2004-08-17 | Shipley Company, L.L.C. | Copolymers and photoresist compositions comprising same |
US6538086B1 (en) * | 2000-02-28 | 2003-03-25 | Industrial Technology Research Institute | Polymer with a pericyclic protective group and resist composition containing the same |
US6808860B2 (en) * | 2000-04-17 | 2004-10-26 | Fuji Photo Film Co., Ltd. | Positive photoresist composition |
US6316159B1 (en) * | 2000-06-14 | 2001-11-13 | Everlight Usa, Inc. | Chemical amplified photoresist composition |
US6441115B1 (en) * | 2000-06-30 | 2002-08-27 | Everlight Usa, Inc. | Photosensitive polymer |
JP3589160B2 (ja) * | 2000-07-07 | 2004-11-17 | 日本電気株式会社 | レジスト用材料、化学増幅型レジスト及びそれを用いたパターン形成方法 |
AU2001279056A1 (en) * | 2000-07-28 | 2002-02-13 | Goodrich Corporation | Optical waveguides and methods for making the same |
US6391521B1 (en) * | 2000-08-16 | 2002-05-21 | International Business Machines Corporation | Resist compositions containing bulky anhydride additives |
KR100557555B1 (ko) * | 2001-06-21 | 2006-03-03 | 주식회사 하이닉스반도체 | 불소가 치환된 벤질 카르복실레이트 그룹을 포함하는단량체 및 이를 함유한 포토레지스트 중합체 |
US7192681B2 (en) | 2001-07-05 | 2007-03-20 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
US6946233B2 (en) * | 2001-07-24 | 2005-09-20 | Shin-Etsu Chemical Co., Ltd. | Polymer, resist material and patterning method |
DE10224217A1 (de) * | 2002-05-31 | 2003-12-18 | Infineon Technologies Ag | Photosensitiver Lack zur Beschichtung auf einem Halbleitersubstrat oder einer Maske |
US7341816B2 (en) * | 2003-02-24 | 2008-03-11 | Promerus, Llc | Method of controlling the differential dissolution rate of photoresist compositions, polycyclic olefin polymers and monomers used for making such polymers |
US7601479B2 (en) * | 2003-09-12 | 2009-10-13 | Shin-Etsu Chemical Co., Ltd. | Polymer, resist composition and patterning process |
US7101654B2 (en) * | 2004-01-14 | 2006-09-05 | Promerus Llc | Norbornene-type monomers and polymers containing pendent lactone or sultone groups |
JP5269311B2 (ja) | 2004-05-20 | 2013-08-21 | 三菱レイヨン株式会社 | (メタ)アクリル酸エステル、重合体、およびレジスト組成物 |
JP2006104378A (ja) * | 2004-10-07 | 2006-04-20 | Mitsubishi Rayon Co Ltd | レジスト用単量体およびレジスト用重合体 |
TWI332122B (en) | 2005-04-06 | 2010-10-21 | Shinetsu Chemical Co | Novel sulfonate salts and derivatives, photoacid generators, resist compositions and patterning process |
EP1780199B1 (de) | 2005-10-31 | 2012-02-01 | Shin-Etsu Chemical Co., Ltd. | Neuartige Fluorohydroxyalkylsulfonsäuresalze und Derivate, Generatoren von Photosäure, Resistzusammensetzungen, sowie Musterübertragungsverfahren |
EP1780198B1 (de) | 2005-10-31 | 2011-10-05 | Shin-Etsu Chemical Co., Ltd. | Neuartige Fluorosulfonyloxyalkylsulfonatsalze und Derivate, Generatoren von Photosäure, Resistzusammensetzungen, sowie Musterübertragungsverfahren |
JP4801477B2 (ja) * | 2006-03-24 | 2011-10-26 | 富士通株式会社 | レジスト組成物、レジストパターンの形成方法、半導体装置及びその製造方法 |
JP5124806B2 (ja) | 2006-06-27 | 2013-01-23 | 信越化学工業株式会社 | 光酸発生剤並びにこれを用いたレジスト材料及びパターン形成方法 |
KR101035742B1 (ko) | 2006-09-28 | 2011-05-20 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 신규 광산 발생제 및 이것을 이용한 레지스트 재료 및 패턴형성 방법 |
KR101175818B1 (ko) * | 2006-11-27 | 2012-08-24 | 코오롱인더스트리 주식회사 | 노보넨계 중합체 또는 공중합체와 그 제조방법 |
US9872399B1 (en) * | 2016-07-22 | 2018-01-16 | International Business Machines Corporation | Implementing backdrilling elimination utilizing anti-electroplate coating |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5628257B2 (de) | 1973-09-27 | 1981-06-30 | ||
US4491628A (en) | 1982-08-23 | 1985-01-01 | International Business Machines Corporation | Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone |
US4603101A (en) | 1985-09-27 | 1986-07-29 | General Electric Company | Photoresist compositions containing t-substituted organomethyl vinylaryl ether materials |
KR900700923A (ko) | 1988-02-17 | 1990-08-17 | 야마구찌 도시아끼 | 포토레지스트 조성물 |
DE3817012A1 (de) | 1988-05-19 | 1989-11-30 | Basf Ag | Positiv und negativ arbeitende strahlungsempfindliche gemische sowie verfahren zur herstellung von reliefmustern |
JP2578646B2 (ja) | 1988-07-18 | 1997-02-05 | 三洋電機株式会社 | 非水系二次電池 |
JPH04215661A (ja) | 1990-12-14 | 1992-08-06 | Fujitsu Ltd | レジストパターンの形成方法 |
JP3000745B2 (ja) | 1991-09-19 | 2000-01-17 | 富士通株式会社 | レジスト組成物とレジストパターンの形成方法 |
JPH0588367A (ja) | 1991-09-30 | 1993-04-09 | Fujitsu Ltd | レジスト組成物とレジストパターンの形成方法 |
JP3804138B2 (ja) * | 1996-02-09 | 2006-08-02 | Jsr株式会社 | ArFエキシマレーザー照射用感放射線性樹脂組成物 |
ATE297562T1 (de) * | 1996-03-07 | 2005-06-15 | Sumitomo Bakelite Co | Photoresist zusammensetzungen mit polycyclischen polymeren mit säurelabilen gruppen am ende |
KR100211548B1 (ko) | 1996-12-20 | 1999-08-02 | 김영환 | 원자외선용 감광막 공중합체 및 그 제조방법 |
EP0918048A1 (de) | 1997-11-19 | 1999-05-26 | Wako Pure Chemical Industries, Ltd. | Monomer und davon erhaltener Polymer |
KR100281902B1 (ko) * | 1998-08-18 | 2001-03-02 | 윤종용 | 백본이 환상 구조를 가지는 감광성 폴리머 및 이를 포함하는 레지스트 조성물 |
KR100274119B1 (ko) * | 1998-10-08 | 2001-03-02 | 박찬구 | 감방사선성 레지스트 제조용 중합체 및 이를 함유하는 레지스트조성물 |
TWI228504B (en) | 1998-11-02 | 2005-03-01 | Shinetsu Chemical Co | Novel ester compounds, polymers, resist compositions and patterning process |
-
1999
- 1999-06-22 JP JP17494599A patent/JP3680920B2/ja not_active Expired - Fee Related
-
2000
- 2000-02-24 KR KR10-2000-0008963A patent/KR100461930B1/ko not_active IP Right Cessation
- 2000-02-24 US US09/512,108 patent/US6284429B1/en not_active Expired - Lifetime
- 2000-02-24 TW TW089103266A patent/TWI225048B/zh not_active IP Right Cessation
- 2000-02-25 DE DE60041428T patent/DE60041428D1/de not_active Expired - Lifetime
- 2000-02-25 EP EP00301523A patent/EP1031879B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1031879A1 (de) | 2000-08-30 |
TWI225048B (en) | 2004-12-11 |
JP2000309611A (ja) | 2000-11-07 |
JP3680920B2 (ja) | 2005-08-10 |
KR100461930B1 (ko) | 2004-12-17 |
EP1031879B1 (de) | 2009-01-21 |
KR20000058167A (ko) | 2000-09-25 |
US6284429B1 (en) | 2001-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |