DE60035056D1 - Anlage zur behandlung von halbleitern mit durch strahlungsheizelementen geheizten keramischer auskleidung - Google Patents

Anlage zur behandlung von halbleitern mit durch strahlungsheizelementen geheizten keramischer auskleidung

Info

Publication number
DE60035056D1
DE60035056D1 DE60035056T DE60035056T DE60035056D1 DE 60035056 D1 DE60035056 D1 DE 60035056D1 DE 60035056 T DE60035056 T DE 60035056T DE 60035056 T DE60035056 T DE 60035056T DE 60035056 D1 DE60035056 D1 DE 60035056D1
Authority
DE
Germany
Prior art keywords
appendix
semiconductors
treatment
heating elements
radiator heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60035056T
Other languages
English (en)
Other versions
DE60035056T2 (de
Inventor
William S Kennedy
Robert A Maraschin
Thomas E Wicker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of DE60035056D1 publication Critical patent/DE60035056D1/de
Application granted granted Critical
Publication of DE60035056T2 publication Critical patent/DE60035056T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Ceramic Products (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
DE60035056T 1999-09-23 2000-09-11 Anlage zur behandlung von halbleitern mit durch strahlungsheizelementen geheizten keramischer auskleidung Expired - Lifetime DE60035056T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US401308 1999-09-23
US09/401,308 US6227140B1 (en) 1999-09-23 1999-09-23 Semiconductor processing equipment having radiant heated ceramic liner
PCT/US2000/024866 WO2001022478A1 (en) 1999-09-23 2000-09-11 Semiconductor processing equipment having radiant heated ceramic liner

Publications (2)

Publication Number Publication Date
DE60035056D1 true DE60035056D1 (de) 2007-07-12
DE60035056T2 DE60035056T2 (de) 2008-01-31

Family

ID=23587202

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60035056T Expired - Lifetime DE60035056T2 (de) 1999-09-23 2000-09-11 Anlage zur behandlung von halbleitern mit durch strahlungsheizelementen geheizten keramischer auskleidung

Country Status (8)

Country Link
US (1) US6227140B1 (de)
EP (1) EP1214732B1 (de)
JP (1) JP4837860B2 (de)
KR (1) KR100779885B1 (de)
AU (1) AU7368300A (de)
DE (1) DE60035056T2 (de)
TW (1) TW492101B (de)
WO (1) WO2001022478A1 (de)

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US7311797B2 (en) * 2002-06-27 2007-12-25 Lam Research Corporation Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor
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Also Published As

Publication number Publication date
WO2001022478A1 (en) 2001-03-29
AU7368300A (en) 2001-04-24
US6227140B1 (en) 2001-05-08
TW492101B (en) 2002-06-21
KR100779885B1 (ko) 2007-11-28
KR20020047183A (ko) 2002-06-21
EP1214732A1 (de) 2002-06-19
JP4837860B2 (ja) 2011-12-14
WO2001022478A9 (en) 2002-11-28
JP2003520418A (ja) 2003-07-02
DE60035056T2 (de) 2008-01-31
EP1214732B1 (de) 2007-05-30

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