DE60030688D1 - Elektronische geräte mit mikromechanischen schaltern - Google Patents

Elektronische geräte mit mikromechanischen schaltern

Info

Publication number
DE60030688D1
DE60030688D1 DE60030688T DE60030688T DE60030688D1 DE 60030688 D1 DE60030688 D1 DE 60030688D1 DE 60030688 T DE60030688 T DE 60030688T DE 60030688 T DE60030688 T DE 60030688T DE 60030688 D1 DE60030688 D1 DE 60030688D1
Authority
DE
Germany
Prior art keywords
electronic devices
micromechanical switches
micromechanical
switches
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60030688T
Other languages
English (en)
Inventor
D French
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB9929133.8A external-priority patent/GB9929133D0/en
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE60030688D1 publication Critical patent/DE60030688D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14689—MOS based technologies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14692—Thin film technologies, e.g. amorphous, poly, micro- or nanocrystalline silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H67/00—Electrically-operated selector switches
    • H01H67/22—Switches without multi-position wipers
DE60030688T 1999-12-10 2000-12-08 Elektronische geräte mit mikromechanischen schaltern Expired - Lifetime DE60030688D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB9929133.8A GB9929133D0 (en) 1999-12-10 1999-12-10 Integrated circuit device including micromechanical switches
GBGB0002445.5A GB0002445D0 (en) 1999-12-10 2000-02-04 Electronic devices including micromechanical switches
PCT/EP2000/012376 WO2001043153A1 (en) 1999-12-10 2000-12-08 Electronic devices including micromechanical switches

Publications (1)

Publication Number Publication Date
DE60030688D1 true DE60030688D1 (de) 2006-10-26

Family

ID=26243555

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60030688T Expired - Lifetime DE60030688D1 (de) 1999-12-10 2000-12-08 Elektronische geräte mit mikromechanischen schaltern

Country Status (7)

Country Link
US (1) US6495387B2 (de)
EP (1) EP1153405B1 (de)
JP (1) JP2003516629A (de)
CN (1) CN1197108C (de)
DE (1) DE60030688D1 (de)
TW (1) TW589741B (de)
WO (1) WO2001043153A1 (de)

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EP1760036B1 (de) 2001-11-09 2012-06-13 WiSpry, Inc. MEMS-Bauteil mit Kontakt und Abstandshöckern und Verfahren zum Betätigen
JP3770158B2 (ja) * 2001-12-26 2006-04-26 ソニー株式会社 Ｍｅｍｓ素子の製造方法
US7053967B2 (en) 2002-05-23 2006-05-30 Planar Systems, Inc. Light sensitive display
WO2003073159A1 (en) 2002-02-20 2003-09-04 Planar Systems, Inc. Light sensitive display
US7009663B2 (en) 2003-12-17 2006-03-07 Planar Systems, Inc. Integrated optical light sensitive active matrix liquid crystal display
US6990539B2 (en) * 2002-04-15 2006-01-24 Hewlett-Packard Development Company, L.P. Apparatus and method of implementing BREQ routing to allow functionality with 2 way or 4 way processors
EP1556877B1 (de) * 2002-10-25 2007-01-24 Analog Devices, Inc. Mikromechanisches relais mit anorganischer isolierung
US20080084374A1 (en) * 2003-02-20 2008-04-10 Planar Systems, Inc. Light sensitive display
US7199498B2 (en) * 2003-06-02 2007-04-03 Ambient Systems, Inc. Electrical assemblies using molecular-scale electrically conductive and mechanically flexible beams and methods for application of same
US20040238907A1 (en) * 2003-06-02 2004-12-02 Pinkerton Joseph F. Nanoelectromechanical transistors and switch systems
US6841411B1 (en) * 2003-06-30 2005-01-11 Agilent Technologies, Inc. Method of utilizing a top conductive layer in isolating pixels of an image sensor array
US7709285B2 (en) * 2003-10-31 2010-05-04 Epcos Ag Method of manufacturing a MEMS device and MEMS device
ES2246693B1 (es) * 2003-11-18 2006-11-01 Baolab Microsystems S.L. Circuito integrado con matriz de conexion analogica.
US7084000B2 (en) * 2003-12-16 2006-08-01 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device and method for manufacturing the same
US7773139B2 (en) 2004-04-16 2010-08-10 Apple Inc. Image sensor with photosensitive thin film transistors
DE602005011420D1 (de) * 2004-04-19 2009-01-15 Baolab Microsystems Sl Integrierte schaltung mit analoger verbindungsmatrix
JP2007538483A (ja) * 2004-05-19 2007-12-27 バオラブ マイクロシステムズ エス エル レギュレータ回路及びその使用法
JP4604561B2 (ja) * 2004-06-03 2011-01-05 株式会社ニコン マイクロアクチュエータアレー、光学装置及び光スイッチアレー
DE102004055939B4 (de) * 2004-11-19 2007-05-03 Siemens Ag Schaltmatrix
US20070048160A1 (en) * 2005-07-19 2007-03-01 Pinkerton Joseph F Heat activated nanometer-scale pump
US7875483B2 (en) 2005-08-10 2011-01-25 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of microelectromechanical system
KR100651825B1 (ko) * 2005-11-29 2006-12-01 한국과학기술원 기계적인 스위치를 이용한 메모리 어레이, 그의 제어 방법,기계적인 스위치를 이용한 표시 장치 및 그의 제어 방법
US7602261B2 (en) * 2005-12-22 2009-10-13 Intel Corporation Micro-electromechanical system (MEMS) switch
FR2895986B1 (fr) * 2006-01-06 2008-09-05 Centre Nat Rech Scient Preparation de microcomposants multicouches par la methode de la couche epaisse sacrificielle
CN101438366B (zh) * 2006-03-08 2011-10-26 维斯普瑞公司 微机电系统（mems）可变电容器、激励部件及相关方法
US7554421B2 (en) * 2006-05-16 2009-06-30 Intel Corporation Micro-electromechanical system (MEMS) trampoline switch/varactor
US7605675B2 (en) * 2006-06-20 2009-10-20 Intel Corporation Electromechanical switch with partially rigidified electrode
US7642114B2 (en) * 2006-07-19 2010-01-05 Semiconductor Energy Laboratory Co., Ltd. Micro electro mechanical device and manufacturing method thereof
JP4265630B2 (ja) 2006-08-04 2009-05-20 セイコーエプソン株式会社 Ｍｅｍｓスイッチ、電圧分割回路、利得調整回路、減衰器及びｍｅｍｓスイッチの製造方法
US7573040B2 (en) * 2007-03-23 2009-08-11 General Electric Company Energy discriminating detector different materials direct conversion layers
CN101569530B (zh) * 2008-04-30 2013-03-27 Ge医疗系统环球技术有限公司 X-射线检测器和x-射线ct设备
US8804295B2 (en) * 2009-10-15 2014-08-12 Altera Corporation Configurable multi-gate switch circuitry
US9029719B2 (en) 2010-03-30 2015-05-12 International Business Machines Corporation Integrated electro-mechanical actuator
US9310923B2 (en) 2010-12-03 2016-04-12 Apple Inc. Input device for touch sensitive devices
US8638320B2 (en) 2011-06-22 2014-01-28 Apple Inc. Stylus orientation detection
US8928635B2 (en) 2011-06-22 2015-01-06 Apple Inc. Active stylus
US9329703B2 (en) 2011-06-22 2016-05-03 Apple Inc. Intelligent stylus
US8629036B2 (en) * 2011-11-11 2014-01-14 International Business Machines Corporation Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure
US9557845B2 (en) 2012-07-27 2017-01-31 Apple Inc. Input device for and method of communication with capacitive devices through frequency variation
US9176604B2 (en) 2012-07-27 2015-11-03 Apple Inc. Stylus device
US9652090B2 (en) 2012-07-27 2017-05-16 Apple Inc. Device for digital communication through capacitive coupling
US10048775B2 (en) 2013-03-14 2018-08-14 Apple Inc. Stylus detection and demodulation
US10845901B2 (en) 2013-07-31 2020-11-24 Apple Inc. Touch controller architecture
US9936147B2 (en) * 2014-03-28 2018-04-03 Varex Imaging Corporation Low power standby mode in wireless imagers
US10067618B2 (en) 2014-12-04 2018-09-04 Apple Inc. Coarse scan and targeted active mode scan for touch
JP6575241B2 (ja) * 2015-09-02 2019-09-18 Tdk株式会社 圧電型ｍｅｍｓスイッチ及び圧電型ｍｅｍｓスイッチの製造方法
US10474277B2 (en) 2016-05-31 2019-11-12 Apple Inc. Position-based stylus communication
CN113037221A (zh) * 2021-01-28 2021-06-25 明峰医疗系统股份有限公司 用于SiPM读出系统的共基极前置放大网络电路及其读出方法
DE102021213664A1 (de) 2021-12-02 2023-06-07 Robert Bosch Gesellschaft mit beschränkter Haftung Mikromechanische Vorrichtung mit einem Relais und einem Sensor

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Publication number Priority date Publication date Assignee Title
DE4414968A1 (de) * 1994-04-28 1995-11-02 Siemens Ag Mikrosystem mit integrierter Schaltung und mikromechanischem Bauteil und Herstellverfahren
US5659195A (en) * 1995-06-08 1997-08-19 The Regents Of The University Of California CMOS integrated microsensor with a precision measurement circuit
US5638946A (en) * 1996-01-11 1997-06-17 Northeastern University Micromechanical switch with insulated switch contact
US6046659A (en) * 1998-05-15 2000-04-04 Hughes Electronics Corporation Design and fabrication of broadband surface-micromachined micro-electro-mechanical switches for microwave and millimeter-wave applications
FI106894B (fi) * 1998-06-02 2001-04-30 Nokia Mobile Phones Ltd Resonaattorirakenteita
US6069540A (en) * 1999-04-23 2000-05-30 Trw Inc. Micro-electro system (MEMS) switch

Also Published As

Publication number Publication date
TW589741B (en) 2004-06-01
US20010004548A1 (en) 2001-06-21
US6495387B2 (en) 2002-12-17
JP2003516629A (ja) 2003-05-13
EP1153405B1 (de) 2006-09-13
CN1346503A (zh) 2002-04-24
EP1153405A1 (de) 2001-11-14
WO2001043153A1 (en) 2001-06-14
CN1197108C (zh) 2005-04-13

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Legal Events

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8332 No legal effect for de