DE60029264D1 - Verfahren zur Herstellung von mehreren oberflächenmontierten Widerstände und oberflächenmontierter Widerstand - Google Patents

Verfahren zur Herstellung von mehreren oberflächenmontierten Widerstände und oberflächenmontierter Widerstand

Info

Publication number
DE60029264D1
DE60029264D1 DE60029264T DE60029264T DE60029264D1 DE 60029264 D1 DE60029264 D1 DE 60029264D1 DE 60029264 T DE60029264 T DE 60029264T DE 60029264 T DE60029264 T DE 60029264T DE 60029264 D1 DE60029264 D1 DE 60029264D1
Authority
DE
Germany
Prior art keywords
surface mounted
making multiple
resistors
resistor
multiple surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60029264T
Other languages
English (en)
Other versions
DE60029264T2 (de
Inventor
Joel J Smejkal
Steve E Hendricks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay Dale Electronics LLC
Original Assignee
Vishay Dale Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23872358&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60029264(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Vishay Dale Electronics LLC filed Critical Vishay Dale Electronics LLC
Publication of DE60029264D1 publication Critical patent/DE60029264D1/de
Application granted granted Critical
Publication of DE60029264T2 publication Critical patent/DE60029264T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/10—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration
    • H01C3/12—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration lying in one plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49089—Filling with powdered insulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49098—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
DE60029264T 1999-12-21 2000-02-25 Verfahren zur Herstellung von mehreren oberflächenmontierten Widerständen und oberflächenmontierter Widerstand Expired - Lifetime DE60029264T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US471622 1983-03-03
US09/471,622 US6401329B1 (en) 1999-12-21 1999-12-21 Method for making overlay surface mount resistor

Publications (2)

Publication Number Publication Date
DE60029264D1 true DE60029264D1 (de) 2006-08-17
DE60029264T2 DE60029264T2 (de) 2007-06-14

Family

ID=23872358

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60029264T Expired - Lifetime DE60029264T2 (de) 1999-12-21 2000-02-25 Verfahren zur Herstellung von mehreren oberflächenmontierten Widerständen und oberflächenmontierter Widerstand
DE60020736T Expired - Lifetime DE60020736T2 (de) 1999-12-21 2000-02-25 Oberflächenmontierter überzogener widerstand und methode zu seiner herstellung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60020736T Expired - Lifetime DE60020736T2 (de) 1999-12-21 2000-02-25 Oberflächenmontierter überzogener widerstand und methode zu seiner herstellung

Country Status (6)

Country Link
US (5) US6401329B1 (de)
EP (2) EP1240650B1 (de)
JP (1) JP2003518330A (de)
AU (1) AU3380100A (de)
DE (2) DE60029264T2 (de)
WO (1) WO2001046967A1 (de)

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US5999085A (en) * 1998-02-13 1999-12-07 Vishay Dale Electronics, Inc. Surface mounted four terminal resistor
DE10116531B4 (de) * 2000-04-04 2008-06-19 Koa Corp., Ina Widerstand mit niedrigem Widerstandswert
JP4780689B2 (ja) * 2001-03-09 2011-09-28 ローム株式会社 チップ抵抗器
US20030090360A1 (en) * 2001-11-13 2003-05-15 Steven Liu Leadframe resistance device and process for the same
US20050046543A1 (en) * 2003-08-28 2005-03-03 Hetzler Ullrich U. Low-impedance electrical resistor and process for the manufacture of such resistor
WO2005027150A1 (ja) * 2003-09-17 2005-03-24 Rohm Co.,Ltd. チップ抵抗器とその製造方法
JP4452196B2 (ja) * 2004-05-20 2010-04-21 コーア株式会社 金属板抵抗器
JP2006228980A (ja) * 2005-02-17 2006-08-31 Rohm Co Ltd 金属板製のチップ抵抗器とその製造方法
US20070001802A1 (en) * 2005-06-30 2007-01-04 Hsieh Ching H Electroplating method in the manufacture of the surface mount precision metal resistor
US20070159295A1 (en) * 2006-01-06 2007-07-12 Nan Juen International Co., Ltd. Laser-welded seamless chip resistor
US9655648B2 (en) * 2007-05-01 2017-05-23 Moximed, Inc. Femoral and tibial base components
EP2176927A4 (de) 2007-08-07 2011-05-04 Nanocomp Technologies Inc Elektrisch und thermisch leitende nichtmetallische adapter auf nanostrukturbasis
WO2009137722A1 (en) 2008-05-07 2009-11-12 Nanocomp Technologies, Inc. Carbon nanotube-based coaxial electrical cables and wiring harness
CA2723619A1 (en) * 2008-05-07 2009-11-12 Nanocomp Technologies, Inc. Nanostructure-based heating devices and method of use
CA2763548C (en) 2008-05-27 2019-01-15 Energesis Pharmaceuticals, Inc. Brown adipocyte progenitors in human skeletal muscle
US8242878B2 (en) 2008-09-05 2012-08-14 Vishay Dale Electronics, Inc. Resistor and method for making same
GB2468677A (en) 2009-03-17 2010-09-22 Eltek Valere As Resistor device
US8248202B2 (en) * 2009-03-19 2012-08-21 Vishay Dale Electronics, Inc. Metal strip resistor for mitigating effects of thermal EMF
EP2474008B1 (de) 2009-09-04 2023-10-04 Vishay Dale Electronics, Inc. Widerstand mit widerstandstemperaturkoeffizienten-kompensation
WO2012157435A1 (ja) * 2011-05-17 2012-11-22 ローム株式会社 チップ抵抗器、チップ抵抗器の製造方法、およびチップ抵抗器の実装構造
JP6038439B2 (ja) * 2011-10-14 2016-12-07 ローム株式会社 チップ抵抗器、チップ抵抗器の実装構造
EP3010853B1 (de) 2013-06-17 2023-02-22 Nanocomp Technologies, Inc. Exfolierende dispergiermittel für nanoröhrchen, bündel und fasern
US9396849B1 (en) 2014-03-10 2016-07-19 Vishay Dale Electronics Llc Resistor and method of manufacture
US11434581B2 (en) 2015-02-03 2022-09-06 Nanocomp Technologies, Inc. Carbon nanotube structures and methods for production thereof
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US11279836B2 (en) 2017-01-09 2022-03-22 Nanocomp Technologies, Inc. Intumescent nanostructured materials and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
JP7523190B2 (ja) 2020-08-20 2024-07-26 ヴィシェイ デール エレクトロニクス エルエルシー 抵抗器、電流検出抵抗器、電池分流器、分流抵抗器、およびこれらの製造方法

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Also Published As

Publication number Publication date
EP1523015B1 (de) 2006-07-05
EP1523015A1 (de) 2005-04-13
US7278202B2 (en) 2007-10-09
US20050104711A1 (en) 2005-05-19
US20020092154A1 (en) 2002-07-18
EP1240650B1 (de) 2005-06-08
DE60020736T2 (de) 2006-05-11
DE60020736D1 (de) 2005-07-14
US6901655B2 (en) 2005-06-07
EP1240650A1 (de) 2002-09-18
US6441718B1 (en) 2002-08-27
JP2003518330A (ja) 2003-06-03
WO2001046967A1 (en) 2001-06-28
DE60029264T2 (de) 2007-06-14
US6401329B1 (en) 2002-06-11
US20040168304A1 (en) 2004-09-02
AU3380100A (en) 2001-07-03
US6725529B2 (en) 2004-04-27

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