US3778744A - Film resistors - Google Patents
Film resistors Download PDFInfo
- Publication number
- US3778744A US3778744A US00336518A US3778744DA US3778744A US 3778744 A US3778744 A US 3778744A US 00336518 A US00336518 A US 00336518A US 3778744D A US3778744D A US 3778744DA US 3778744 A US3778744 A US 3778744A
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- US
- United States
- Prior art keywords
- film
- resistor
- dielectric
- leads
- resistors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- 239000003989 dielectric material Substances 0.000 claims description 8
- 239000002241 glass-ceramic Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 3
- 238000009751 slip forming Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000011521 glass Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
Definitions
- Leads are connected to the back or front sides of the resistor by means of silverized terminals which are fused to the dielectric on two sides and the intervening edge of its dielectric thereby affording such option and allowing the film to be deposited over the entire surface of its front side when the leads are connected on the back side.
- the resistance path is formed in the film between slots cut through both the deposited film and the dielectric whereby the resistance of the film may be adjusted extremely accurately to the desired ohmage.
- the present invention relates to electric resistor components and, in particular, to such components employing metallic films as the resistor substance.
- film resistors have typically utilized cylindrically shaped ceramic bodies on which metallic film is deposited.
- the film is connected to end caps by fused end terminals, the leads being welded to the caps, See U. S. Pat. No. 3,643,200.
- the dielectric substrate is formed of a flat body having slots which determine the filmed resistive pathway, formed therein either prior or subsequent to the deposit of the film.
- the leads are then bonded to silver terminations which have been thermally fused to the substrate on one edge and two sides thereof so that the bonding can be effected on the reverse side thereof prior to film deposit over the entire surface of the substrate without affecting said parameters.
- the component is then encapsulated in a clear epoxy.
- One object of the invention is to provide an improved metallic film resistor having a long term stability in operation under extreme atmosphere and temperature conditions.
- Another object of the invention is to provide a metal film resistor having low temperature coefficiency.
- FIG. 1 is an elevational view of the film resistor with a portion thereof broken away;
- FIG. 2 is a section taken on the line 2-2 of FIG. 1;
- FIG. 3 is a perspective view showing a plurality of resistors in side by side relation to form a resistive network
- FIG. 4 is a perspective view showing a plurality of resistors in end to end relation to form a resistive network.
- the dielectric base or substrate for the film resistor is fabricated of a glassceramic.
- Silverized terminations 12 are thermally fused to the two lower corners of the base on its front face, the lower edge and the back side thereof as shown in FIG. 2.
- Leads '14 and 16 are soldered to the terminations on the back side of the substrate.
- a nickelchrome resistor film 18 There is deposited on one side of the base a nickelchrome resistor film 18.
- the ohmic resistance of the film is adjusted highly accurately to the desired value by grinding straight slots into the film and dielectric alternating from the top and bottom edges of the component as shown in FIG. 1.
- the resulting product is a highly stable, low noise resistor having a low temperature coefficiency.
- the particular expedient used to bond the leads of the silver terminals allows not only the elimination of end caps, but minimizes contact resistance.
- the resistor is finally encapsulated in a high temperature epoxy material 20 as protection against moisture or other contamination.
- the particular construction of the film resistor lends itself to either side by side combination, as shown in FIG. 3, or end to end combination, as shown in FIG. 4, of individual components to form a network of resistors which are adapted for easy insertion into a socket provided by an external circuit.
- the combination is then encapsulated in an epoxy covering.
- a film resistor comprising a flat base of a dielectric material, a metal material forming terminations discretely fused to said base, wire leads bonded to said metal material, a metallic film deposited on one side of said base, slots formed in said dielectric material and film to form a resistive path in said film, and a packing material encapsulating said resistor.
- a resistive network comprising two or more film resistors as defined in claim 6 which have been encapsulated in a common packing material.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Adjustable Resistors (AREA)
- Thermistors And Varistors (AREA)
- Details Of Resistors (AREA)
Abstract
A metal film resistor adapted to be combined with like resistors to form a resistor network. The film is deposited on a dielectric as a nickel-chrome alloy being fused thereto as by means of a glass medium. Leads are connected to the back or front sides of the resistor by means of silverized terminals which are fused to the dielectric on two sides and the intervening edge of its dielectric thereby affording such option and allowing the film to be deposited over the entire surface of its front side when the leads are connected on the back side. The resistance path is formed in the film between slots cut through both the deposited film and the dielectric whereby the resistance of the film may be adjusted extremely accurately to the desired ohmage.
Description
United States Patent [191 Brandi FILM RESISTORS [76] Inventor: Henry W. Brandi, P.O. Box 4 2085 R, Morristown, NJ.
[22] Filed: Feb. 28, 1973 [21] Appl. No.: 336,518
[52] US. Cl 338/260, 338/262, 338/273, 338/275, 338/292, 338/309, 338/314, 338/329 [51] 1nt.Cl 1101c 1/14 [58] Field of Search 338/260, 262, 273, 338/275, 276, 292, 293, 309, 313, 314, 329,
[56] References Cited UNITED STATES PATENTS 2,680,184 l/l954 Cox..- .338/292 3,518,603 6/1970 Kepata ..338/260 FOREIGN PATENTS OR APPLICATIONS 627,262 9/1961 Canada 338/292 [451 Dec. 11, 1973 Primary Examiner-E. A. Goldberg Attorney-Borst & Borst [57] ABSTRACT A metal film resistor adapted to be combined with like resistors to form a resistor network. The film is deposited on a dielectric as a nickel-chrome alloy being fused thereto as by means of a glass medium. Leads are connected to the back or front sides of the resistor by means of silverized terminals which are fused to the dielectric on two sides and the intervening edge of its dielectric thereby affording such option and allowing the film to be deposited over the entire surface of its front side when the leads are connected on the back side. The resistance path is formed in the film between slots cut through both the deposited film and the dielectric whereby the resistance of the film may be adjusted extremely accurately to the desired ohmage.
7 Claims, 4 Drawing Figures FILM RESISTORS The present invention relates to electric resistor components and, in particular, to such components employing metallic films as the resistor substance.
Hitherto, film resistors have typically utilized cylindrically shaped ceramic bodies on which metallic film is deposited. The film is connected to end caps by fused end terminals, the leads being welded to the caps, See U. S. Pat. No. 3,643,200.
The parameters of the known metal film resistors are adversely affected in operation as a consequence of the means employed to connect the leads to the resistors film. According to the present invention the dielectric substrate is formed of a flat body having slots which determine the filmed resistive pathway, formed therein either prior or subsequent to the deposit of the film. The leads are then bonded to silver terminations which have been thermally fused to the substrate on one edge and two sides thereof so that the bonding can be effected on the reverse side thereof prior to film deposit over the entire surface of the substrate without affecting said parameters. The component is then encapsulated in a clear epoxy.
One object of the invention is to provide an improved metallic film resistor having a long term stability in operation under extreme atmosphere and temperature conditions.
Another object of the invention is to provide a metal film resistor having low temperature coefficiency.
Other objects and advantages of the invention may be appreciated on reading the-following detailed description of one embodiment thereof which is taken in conjunction with the accompanying drawings, in which:
FIG. 1 is an elevational view of the film resistor with a portion thereof broken away;
FIG. 2 is a section taken on the line 2-2 of FIG. 1;
FIG. 3 is a perspective view showing a plurality of resistors in side by side relation to form a resistive network; and
FIG. 4 is a perspective view showing a plurality of resistors in end to end relation to form a resistive network.
Referring to the drawings, the dielectric base or substrate for the film resistor is fabricated of a glassceramic. Silverized terminations 12 are thermally fused to the two lower corners of the base on its front face, the lower edge and the back side thereof as shown in FIG. 2. Leads '14 and 16 are soldered to the terminations on the back side of the substrate.
There is deposited on one side of the base a nickelchrome resistor film 18. The ohmic resistance of the film is adjusted highly accurately to the desired value by grinding straight slots into the film and dielectric alternating from the top and bottom edges of the component as shown in FIG. 1. For standard size resistors, it may be preferred to precut the slots in the substrate prior to depositing the resistive film thereon. The resulting product is a highly stable, low noise resistor having a low temperature coefficiency. The particular expedient used to bond the leads of the silver terminals allows not only the elimination of end caps, but minimizes contact resistance. The resistor is finally encapsulated in a high temperature epoxy material 20 as protection against moisture or other contamination.
The particular construction of the film resistor lends itself to either side by side combination, as shown in FIG. 3, or end to end combination, as shown in FIG. 4, of individual components to form a network of resistors which are adapted for easy insertion into a socket provided by an external circuit. The combination is then encapsulated in an epoxy covering.
Various modifications of the invention may be effected by persons skilled in the art without departing from the scope and principle of the invention as defined in the appended claims.
What is claimed is:
1. A film resistor comprising a flat base of a dielectric material, a metal material forming terminations discretely fused to said base, wire leads bonded to said metal material, a metallic film deposited on one side of said base, slots formed in said dielectric material and film to form a resistive path in said film, and a packing material encapsulating said resistor.
2. A film resistor as defined in claim 1 wherein silverized metal material is continuously form ed on two sides and the intervening edge of the dielectric material and the leads are soldered to the terminations on the other side of said base.
3. A film resistor as defined in claim 1 wherein said dielectric material is a glass ceramic and said resistive path is formed between straight lined slots ground in said film.
4. A film resistor as defined in claim 2 wherein said dielectric material is a glass ceramic and said resistive path is formed between straight lined slots ground in said film.
5. A film resistor as defined in claim 4 wherein said metallic film is fabricated of a nickel-chrome alloy.
6. A film resistor as defined in claim 5 wherein said straight lined slots are ground in the film and ceramic alternately from one edge and an opposing edge of the resistor, each slot extending less than the entire distance between said edges.
7. A resistive network comprising two or more film resistors as defined in claim 6 which have been encapsulated in a common packing material.
Claims (6)
- 2. A film resistor as defined in claim 1 wherein silverized metal material is continuously formed on two sides and the intervening edge of the dielectric material and the leads are soldered to the terminations on the other side of said base.
- 3. A film resistor as defined in claim 1 wherein said dielectric material is a glass ceramic and said resistive path is formed between straight lined slots ground in said film.
- 4. A film resistor as defined in claim 2 wherein said dielectric material is a glass ceramic and said resistive path is formed between straight lined slots ground in said film.
- 5. A film resistor as defined in claim 4 wherein said metallic film is fabricated of a nickel-chrome alloy.
- 6. A film resistor as defined in claim 5 wherein said straight lined slots are ground in the film and ceramic alternately from one edge and an opposing edge of the resistor, each slot extending less than the entire distance between said edges.
- 7. A resistive network comprising two or more film resistors as defined in claim 6 which have been encapsulated in a common packing material.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33651873A | 1973-02-28 | 1973-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3778744A true US3778744A (en) | 1973-12-11 |
Family
ID=23316459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US00336518A Expired - Lifetime US3778744A (en) | 1973-02-28 | 1973-02-28 | Film resistors |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US3778744A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4016645A (en) * | 1974-05-02 | 1977-04-12 | Asg Industries, Inc. | Electric heater plate and terminal thereof |
| US4176445A (en) * | 1977-06-03 | 1979-12-04 | Angstrohm Precision, Inc. | Metal foil resistor |
| US4183136A (en) * | 1977-08-03 | 1980-01-15 | Johnson Controls, Inc. | Temperature sensing resistance device |
| US4306217A (en) * | 1977-06-03 | 1981-12-15 | Angstrohm Precision, Inc. | Flat electrical components |
| US4368453A (en) * | 1979-11-03 | 1983-01-11 | Robert Bosch Gmbh | Rapid acting gas temperature sensor |
| US4792782A (en) * | 1985-09-23 | 1988-12-20 | Hammond Robert W | Apparatus and method for providing improved resistive ratio stability of a resistive divider network |
| US5361300A (en) * | 1993-01-19 | 1994-11-01 | Caddock Electronics, Inc. | Balancing resistor and thermistor network for telephone circuits, and combination thereof with relay |
| US6292091B1 (en) * | 1999-07-22 | 2001-09-18 | Rohm Co., Ltd. | Resistor and method of adjusting resistance of the same |
| US20020092154A1 (en) * | 1999-12-21 | 2002-07-18 | Smejkal Joel J. | Overlay surface mount resistor and method for making same |
| US7049928B2 (en) * | 2000-05-30 | 2006-05-23 | Matsushita Electric Industrial Co., Ltd. | Resistor and method of manufacturing the same |
| US10527578B2 (en) * | 2015-08-21 | 2020-01-07 | Ngk Insulators, Ltd. | Ceramic heater, sensor element, and gas sensor |
| US10712307B2 (en) * | 2015-08-21 | 2020-07-14 | Ngk Insulators, Ltd. | Ceramic heater, sensor element, and gas sensor |
| US10837937B2 (en) * | 2015-08-21 | 2020-11-17 | Ngk Insulators, Ltd. | Ceramic heater, sensor element, and gas sensor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2680184A (en) * | 1951-02-07 | 1954-06-01 | Duncan B Cox | Method for severing or slitting metal foil |
| CA627262A (en) * | 1961-09-12 | Allen-Bradley Company Inc. | Grid configuration for film type resistor | |
| US3518603A (en) * | 1969-05-29 | 1970-06-30 | Philco Ford Corp | Resistive voltage divider |
-
1973
- 1973-02-28 US US00336518A patent/US3778744A/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA627262A (en) * | 1961-09-12 | Allen-Bradley Company Inc. | Grid configuration for film type resistor | |
| US2680184A (en) * | 1951-02-07 | 1954-06-01 | Duncan B Cox | Method for severing or slitting metal foil |
| US3518603A (en) * | 1969-05-29 | 1970-06-30 | Philco Ford Corp | Resistive voltage divider |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4016645A (en) * | 1974-05-02 | 1977-04-12 | Asg Industries, Inc. | Electric heater plate and terminal thereof |
| US4176445A (en) * | 1977-06-03 | 1979-12-04 | Angstrohm Precision, Inc. | Metal foil resistor |
| US4306217A (en) * | 1977-06-03 | 1981-12-15 | Angstrohm Precision, Inc. | Flat electrical components |
| US4183136A (en) * | 1977-08-03 | 1980-01-15 | Johnson Controls, Inc. | Temperature sensing resistance device |
| US4368453A (en) * | 1979-11-03 | 1983-01-11 | Robert Bosch Gmbh | Rapid acting gas temperature sensor |
| US4792782A (en) * | 1985-09-23 | 1988-12-20 | Hammond Robert W | Apparatus and method for providing improved resistive ratio stability of a resistive divider network |
| US5361300A (en) * | 1993-01-19 | 1994-11-01 | Caddock Electronics, Inc. | Balancing resistor and thermistor network for telephone circuits, and combination thereof with relay |
| US6292091B1 (en) * | 1999-07-22 | 2001-09-18 | Rohm Co., Ltd. | Resistor and method of adjusting resistance of the same |
| US20020092154A1 (en) * | 1999-12-21 | 2002-07-18 | Smejkal Joel J. | Overlay surface mount resistor and method for making same |
| US6725529B2 (en) * | 1999-12-21 | 2004-04-27 | Vishay Dale Electronics, Inc. | Method for making overlay surface mount resistor |
| US7049928B2 (en) * | 2000-05-30 | 2006-05-23 | Matsushita Electric Industrial Co., Ltd. | Resistor and method of manufacturing the same |
| US10527578B2 (en) * | 2015-08-21 | 2020-01-07 | Ngk Insulators, Ltd. | Ceramic heater, sensor element, and gas sensor |
| US10712307B2 (en) * | 2015-08-21 | 2020-07-14 | Ngk Insulators, Ltd. | Ceramic heater, sensor element, and gas sensor |
| US10837937B2 (en) * | 2015-08-21 | 2020-11-17 | Ngk Insulators, Ltd. | Ceramic heater, sensor element, and gas sensor |
| US11567032B2 (en) | 2015-08-21 | 2023-01-31 | Ngk Insulators, Ltd. | Ceramic heater, sensor element, and gas sensor |
| US11768169B2 (en) | 2015-08-21 | 2023-09-26 | Ngk Insulators, Ltd. | Ceramic heater, sensor element, and gas sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: TEPRO OF FLORIDA, INC., 2608 ENTERPRISE ROAD, BOX Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:BRANDI, HENRY W.;REEL/FRAME:004462/0192 Effective date: 19850808 |
|
| STCF | Information on status: patent grant |
Free format text: PATENTED FILE - (OLD CASE ADDED FOR FILE TRACKING PURPOSES) |