DE60015966D1 - Messung der lagen oder koplanarität von kontaktelementen eines elektronischen bauteils mit flacher beleuchtung und zwei kameras - Google Patents
Messung der lagen oder koplanarität von kontaktelementen eines elektronischen bauteils mit flacher beleuchtung und zwei kamerasInfo
- Publication number
- DE60015966D1 DE60015966D1 DE60015966T DE60015966T DE60015966D1 DE 60015966 D1 DE60015966 D1 DE 60015966D1 DE 60015966 T DE60015966 T DE 60015966T DE 60015966 T DE60015966 T DE 60015966T DE 60015966 D1 DE60015966 D1 DE 60015966D1
- Authority
- DE
- Germany
- Prior art keywords
- contact elements
- electronic component
- coplanarity
- cameras
- locations
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/50—Depth or shape recovery
- G06T7/55—Depth or shape recovery from multiple images
- G06T7/593—Depth or shape recovery from multiple images from stereo images
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Operations Research (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99201121 | 1999-04-13 | ||
EP99201121 | 1999-04-13 | ||
PCT/BE2000/000020 WO2000062012A1 (en) | 1999-04-13 | 2000-03-01 | Measuring positions or coplanarity of contact elements of an electronic component with a flat illumination and two cameras |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60015966D1 true DE60015966D1 (de) | 2004-12-23 |
DE60015966T2 DE60015966T2 (de) | 2005-12-01 |
Family
ID=8240084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60015966T Expired - Lifetime DE60015966T2 (de) | 1999-04-13 | 2000-03-01 | Messung der lagen oder koplanarität von kontaktelementen eines elektronischen bauteils mit flacher beleuchtung und zwei kameras |
Country Status (6)
Country | Link |
---|---|
US (1) | US6778282B1 (de) |
EP (1) | EP1185841B1 (de) |
AT (1) | ATE282815T1 (de) |
AU (1) | AU2897800A (de) |
DE (1) | DE60015966T2 (de) |
WO (1) | WO2000062012A1 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1220596A1 (de) * | 2000-12-29 | 2002-07-03 | Icos Vision Systems N.V. | Verfahren und Einrichtung zur Lageerfassung der Anschlusskontakte elektronischer Bauelemente |
US7113630B2 (en) * | 2002-02-19 | 2006-09-26 | Credence Systems Corporation | PICA system detector calibration |
US7250312B2 (en) * | 2003-08-08 | 2007-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Doping method and method for fabricating thin film transistor |
DE10341186A1 (de) * | 2003-09-06 | 2005-03-31 | Martin Michalk | Verfahren und Vorrichtung zum Kontaktieren von Halbleiterchips |
US6873924B1 (en) * | 2003-09-30 | 2005-03-29 | General Electric Company | Method and system for calibrating relative fields of view of multiple cameras |
US7551272B2 (en) * | 2005-11-09 | 2009-06-23 | Aceris 3D Inspection Inc. | Method and an apparatus for simultaneous 2D and 3D optical inspection and acquisition of optical inspection data of an object |
SG138491A1 (en) * | 2006-06-21 | 2008-01-28 | Generic Power Pte Ltd | Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components |
US7535560B2 (en) * | 2007-02-26 | 2009-05-19 | Aceris 3D Inspection Inc. | Method and system for the inspection of integrated circuit devices having leads |
MY148204A (en) * | 2008-07-21 | 2013-03-15 | Vitrox Corp Bhd | A method and means for measuring positions of contact elements of an electronic components |
US20120027251A1 (en) * | 2010-07-30 | 2012-02-02 | Wei Wu | Device with markings for configuration |
DE102014205701A1 (de) * | 2014-03-27 | 2015-10-01 | Robert Bosch Gmbh | Verfahren und Vorrichtung zur Bestimmung der Position und/oder Orientierung zumindest eines Steckkontakts |
CN103925878A (zh) * | 2014-04-11 | 2014-07-16 | 南京信息工程大学 | 基于Hough圆卷积变换算法的孔组检测方法与系统 |
US9885671B2 (en) | 2014-06-09 | 2018-02-06 | Kla-Tencor Corporation | Miniaturized imaging apparatus for wafer edge |
US9645097B2 (en) | 2014-06-20 | 2017-05-09 | Kla-Tencor Corporation | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
EP3015817B1 (de) * | 2014-10-27 | 2019-12-18 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Optisches Verfahren und Vorrichtung zum Bestimmen von Positionen und Ausrichtungen einer Vielzahl von Spiegeln im Sichtfeld eines Objektivs |
CN104792281A (zh) * | 2015-03-30 | 2015-07-22 | 智机科技(深圳)有限公司 | 一种测量端子共面度的方法 |
CN111189841A (zh) * | 2020-01-10 | 2020-05-22 | 广东利元亨智能装备股份有限公司 | 一种双相机检测机构以及双相机检测方法 |
TWI750800B (zh) * | 2020-09-09 | 2021-12-21 | 海華科技股份有限公司 | 晶片共面度檢測設備 |
TWI761202B (zh) * | 2020-09-09 | 2022-04-11 | 海華科技股份有限公司 | 晶片共面度檢測設備 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0638801B1 (de) * | 1993-08-12 | 1998-12-23 | International Business Machines Corporation | Verfahren zur Inspektion vom Verbindungskugel-Satz eines intergrierten Schaltungsmoduls |
US5621530A (en) | 1995-04-26 | 1997-04-15 | Texas Instruments Incorporated | Apparatus and method for verifying the coplanarity of a ball grid array |
US5943125A (en) * | 1997-02-26 | 1999-08-24 | Acuity Imaging, Llc | Ring illumination apparatus for illuminating reflective elements on a generally planar surface |
US6201892B1 (en) * | 1997-02-26 | 2001-03-13 | Acuity Imaging, Llc | System and method for arithmetic operations for electronic package inspection |
WO1999000661A1 (en) | 1997-06-30 | 1999-01-07 | Semiconductor Technologies & Instruments, Inc. | Method and apparatus for inspecting a workpiece |
US5956134A (en) * | 1997-07-11 | 1999-09-21 | Semiconductor Technologies & Instruments, Inc. | Inspection system and method for leads of semiconductor devices |
US6915007B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6072898A (en) * | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
US6915006B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
-
2000
- 2000-03-01 DE DE60015966T patent/DE60015966T2/de not_active Expired - Lifetime
- 2000-03-01 US US09/958,516 patent/US6778282B1/en not_active Expired - Lifetime
- 2000-03-01 AT AT00907364T patent/ATE282815T1/de not_active IP Right Cessation
- 2000-03-01 WO PCT/BE2000/000020 patent/WO2000062012A1/en active IP Right Grant
- 2000-03-01 AU AU28978/00A patent/AU2897800A/en not_active Abandoned
- 2000-03-01 EP EP00907364A patent/EP1185841B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6778282B1 (en) | 2004-08-17 |
ATE282815T1 (de) | 2004-12-15 |
WO2000062012A1 (en) | 2000-10-19 |
EP1185841A1 (de) | 2002-03-13 |
DE60015966T2 (de) | 2005-12-01 |
EP1185841B1 (de) | 2004-11-17 |
AU2897800A (en) | 2000-11-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |