ATE282815T1 - Messung der lagen oder koplanarität von kontaktelementen eines elektronischen bauteils mit flacher beleuchtung und zwei kameras - Google Patents

Messung der lagen oder koplanarität von kontaktelementen eines elektronischen bauteils mit flacher beleuchtung und zwei kameras

Info

Publication number
ATE282815T1
ATE282815T1 AT00907364T AT00907364T ATE282815T1 AT E282815 T1 ATE282815 T1 AT E282815T1 AT 00907364 T AT00907364 T AT 00907364T AT 00907364 T AT00907364 T AT 00907364T AT E282815 T1 ATE282815 T1 AT E282815T1
Authority
AT
Austria
Prior art keywords
contact elements
electronic component
measuring
coplanarity
cameras
Prior art date
Application number
AT00907364T
Other languages
English (en)
Inventor
Carl Smets
Gils Karel Van
Der Burgt Maarten Van
Original Assignee
Icos Vision Systems Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Icos Vision Systems Nv filed Critical Icos Vision Systems Nv
Application granted granted Critical
Publication of ATE282815T1 publication Critical patent/ATE282815T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/55—Depth or shape recovery from multiple images
    • G06T7/593—Depth or shape recovery from multiple images from stereo images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AT00907364T 1999-04-13 2000-03-01 Messung der lagen oder koplanarität von kontaktelementen eines elektronischen bauteils mit flacher beleuchtung und zwei kameras ATE282815T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99201121 1999-04-13
PCT/BE2000/000020 WO2000062012A1 (en) 1999-04-13 2000-03-01 Measuring positions or coplanarity of contact elements of an electronic component with a flat illumination and two cameras

Publications (1)

Publication Number Publication Date
ATE282815T1 true ATE282815T1 (de) 2004-12-15

Family

ID=8240084

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00907364T ATE282815T1 (de) 1999-04-13 2000-03-01 Messung der lagen oder koplanarität von kontaktelementen eines elektronischen bauteils mit flacher beleuchtung und zwei kameras

Country Status (6)

Country Link
US (1) US6778282B1 (de)
EP (1) EP1185841B1 (de)
AT (1) ATE282815T1 (de)
AU (1) AU2897800A (de)
DE (1) DE60015966T2 (de)
WO (1) WO2000062012A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072898A (en) 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
EP1220596A1 (de) * 2000-12-29 2002-07-03 Icos Vision Systems N.V. Verfahren und Einrichtung zur Lageerfassung der Anschlusskontakte elektronischer Bauelemente
US7113630B2 (en) * 2002-02-19 2006-09-26 Credence Systems Corporation PICA system detector calibration
US7250312B2 (en) * 2003-08-08 2007-07-31 Semiconductor Energy Laboratory Co., Ltd. Doping method and method for fabricating thin film transistor
DE10341186A1 (de) * 2003-09-06 2005-03-31 Martin Michalk Verfahren und Vorrichtung zum Kontaktieren von Halbleiterchips
US6873924B1 (en) * 2003-09-30 2005-03-29 General Electric Company Method and system for calibrating relative fields of view of multiple cameras
US7551272B2 (en) * 2005-11-09 2009-06-23 Aceris 3D Inspection Inc. Method and an apparatus for simultaneous 2D and 3D optical inspection and acquisition of optical inspection data of an object
RU2324906C2 (ru) * 2006-04-17 2008-05-20 Государственное образовательное учреждение высшего профессионального образования Самарский государственный аэрокосмический университет имени академика С.П. Королева Лазерный измеритель амплитуды угловых и линейных виброперемещений
SG138491A1 (en) * 2006-06-21 2008-01-28 Generic Power Pte Ltd Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components
US7535560B2 (en) * 2007-02-26 2009-05-19 Aceris 3D Inspection Inc. Method and system for the inspection of integrated circuit devices having leads
MY148204A (en) * 2008-07-21 2013-03-15 Vitrox Corp Bhd A method and means for measuring positions of contact elements of an electronic components
US20120027251A1 (en) * 2010-07-30 2012-02-02 Wei Wu Device with markings for configuration
DE102014205701A1 (de) * 2014-03-27 2015-10-01 Robert Bosch Gmbh Verfahren und Vorrichtung zur Bestimmung der Position und/oder Orientierung zumindest eines Steckkontakts
CN103925878A (zh) * 2014-04-11 2014-07-16 南京信息工程大学 基于Hough圆卷积变换算法的孔组检测方法与系统
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
EP3015817B1 (de) 2014-10-27 2019-12-18 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Optisches Verfahren und Vorrichtung zum Bestimmen von Positionen und Ausrichtungen einer Vielzahl von Spiegeln im Sichtfeld eines Objektivs
CN104792281A (zh) * 2015-03-30 2015-07-22 智机科技（深圳）有限公司 一种测量端子共面度的方法
CN111189841A (zh) * 2020-01-10 2020-05-22 广东利元亨智能装备股份有限公司 一种双相机检测机构以及双相机检测方法
TWI750800B (zh) * 2020-09-09 2021-12-21 海華科技股份有限公司 晶片共面度檢測設備
TWI761202B (zh) * 2020-09-09 2022-04-11 海華科技股份有限公司 晶片共面度檢測設備

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0638801B1 (de) * 1993-08-12 1998-12-23 International Business Machines Corporation Verfahren zur Inspektion vom Verbindungskugel-Satz eines intergrierten Schaltungsmoduls
US5621530A (en) * 1995-04-26 1997-04-15 Texas Instruments Incorporated Apparatus and method for verifying the coplanarity of a ball grid array
US5943125A (en) * 1997-02-26 1999-08-24 Acuity Imaging, Llc Ring illumination apparatus for illuminating reflective elements on a generally planar surface
US6201892B1 (en) * 1997-02-26 2001-03-13 Acuity Imaging, Llc System and method for arithmetic operations for electronic package inspection
WO1999000661A1 (en) * 1997-06-30 1999-01-07 Semiconductor Technologies & Instruments, Inc. Method and apparatus for inspecting a workpiece
US5956134A (en) 1997-07-11 1999-09-21 Semiconductor Technologies & Instruments, Inc. Inspection system and method for leads of semiconductor devices
US6915007B2 (en) * 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6915006B2 (en) * 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6072898A (en) * 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components

Also Published As

Publication number Publication date
US6778282B1 (en) 2004-08-17
DE60015966D1 (de) 2004-12-23
DE60015966T2 (de) 2005-12-01
EP1185841A1 (de) 2002-03-13
EP1185841B1 (de) 2004-11-17
WO2000062012A1 (en) 2000-10-19
AU2897800A (en) 2000-11-14

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