DE60011143T2 - Chipsherstellungssteuerung - Google Patents

Chipsherstellungssteuerung Download PDF

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Publication number
DE60011143T2
DE60011143T2 DE60011143T DE60011143T DE60011143T2 DE 60011143 T2 DE60011143 T2 DE 60011143T2 DE 60011143 T DE60011143 T DE 60011143T DE 60011143 T DE60011143 T DE 60011143T DE 60011143 T2 DE60011143 T2 DE 60011143T2
Authority
DE
Germany
Prior art keywords
tool
process chambers
operating parameters
computer
match
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60011143T
Other languages
German (de)
English (en)
Other versions
DE60011143D1 (de
Inventor
W. Craig CHRISTIAN
M. Bradley DAVIS
L. Allen EVANS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE60011143D1 publication Critical patent/DE60011143D1/de
Publication of DE60011143T2 publication Critical patent/DE60011143T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32182—If state of tool, product deviates from standard, adjust system, feedback
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37576—Post-process, measure worpiece after machining, use results for new or same
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Chemical Vapour Deposition (AREA)
DE60011143T 2000-01-03 2000-09-20 Chipsherstellungssteuerung Expired - Lifetime DE60011143T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/476,892 US6684122B1 (en) 2000-01-03 2000-01-03 Control mechanism for matching process parameters in a multi-chamber process tool
US476892 2000-01-03
PCT/US2000/025723 WO2001050206A1 (en) 2000-01-03 2000-09-20 Wafer manufacturing control

Publications (2)

Publication Number Publication Date
DE60011143D1 DE60011143D1 (de) 2004-07-01
DE60011143T2 true DE60011143T2 (de) 2005-06-02

Family

ID=23893672

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60011143T Expired - Lifetime DE60011143T2 (de) 2000-01-03 2000-09-20 Chipsherstellungssteuerung

Country Status (6)

Country Link
US (1) US6684122B1 (https=)
EP (1) EP1254401B1 (https=)
JP (1) JP2003519444A (https=)
KR (1) KR100747126B1 (https=)
DE (1) DE60011143T2 (https=)
WO (1) WO2001050206A1 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9785140B2 (en) 2000-02-01 2017-10-10 Peer Intellectual Property Inc. Multi-protocol multi-client equipment server
JP4348412B2 (ja) * 2001-04-26 2009-10-21 東京エレクトロン株式会社 計測システムクラスター
US7089075B2 (en) * 2001-05-04 2006-08-08 Tokyo Electron Limited Systems and methods for metrology recipe and model generation
US6657716B1 (en) * 2001-05-23 2003-12-02 Advanced Micro Devices Inc. Method and apparatus for detecting necking over field/active transitions
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
DE10151259A1 (de) * 2001-10-17 2003-04-30 Aixtron Ag Verfahren und Vorrichtung zur Gewinnung von Korrelations-Werten aus Prozessparametern und Schichteigenschaften in einem CVD-Prozess
DE10240115B4 (de) * 2002-08-30 2004-10-28 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Handhaben von Substraten in einer Produktionslinie mit einer Cluster-Anlage und einer Messanlage
US6957119B2 (en) * 2002-09-09 2005-10-18 Macronix International Co., Ltd. Method for monitoring matched machine overlay
US7376472B2 (en) * 2002-09-11 2008-05-20 Fisher-Rosemount Systems, Inc. Integrated model predictive control and optimization within a process control system
US7369913B2 (en) * 2004-04-02 2008-05-06 Siemens Medical Solutions Usa, Inc. Recipe editor and controller
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US7206532B2 (en) * 2004-08-13 2007-04-17 Xerox Corporation Multiple object sources controlled and/or selected based on a common sensor
US20060079983A1 (en) * 2004-10-13 2006-04-13 Tokyo Electron Limited R2R controller to automate the data collection during a DOE
US7620516B2 (en) * 2005-05-02 2009-11-17 Mks Instruments, Inc. Versatile semiconductor manufacturing controller with statistically repeatable response times
JP2007123643A (ja) 2005-10-31 2007-05-17 Matsushita Electric Ind Co Ltd 成膜装置、成膜方法、成膜装置のモニタリングプログラムおよびその記録媒体
JP4925650B2 (ja) * 2005-11-28 2012-05-09 東京エレクトロン株式会社 基板処理装置
US8180594B2 (en) * 2007-09-06 2012-05-15 Asm International, N.V. System and method for automated customizable error diagnostics
US20100063610A1 (en) * 2008-09-08 2010-03-11 David Angell Method of process modules performance matching
US9177219B2 (en) * 2010-07-09 2015-11-03 Asml Netherlands B.V. Method of calibrating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product
US9606519B2 (en) * 2013-10-14 2017-03-28 Applied Materials, Inc. Matching process controllers for improved matching of process
JP6211960B2 (ja) * 2014-03-13 2017-10-11 東京エレクトロン株式会社 制御装置、基板処理装置及び基板処理システム
KR102238648B1 (ko) * 2014-06-03 2021-04-09 삼성전자주식회사 반도체 공정 관리 시스템, 이를 포함하는 반도체 제조 시스템 및 반도체 제조 방법
US11346882B2 (en) 2017-11-03 2022-05-31 Tokyo Electron Limited Enhancement of yield of functional microelectronic devices
US11244873B2 (en) * 2018-10-31 2022-02-08 Tokyo Electron Limited Systems and methods for manufacturing microelectronic devices
JP7529363B2 (ja) * 2020-08-31 2024-08-06 東京エレクトロン株式会社 半導体製造システム、制御装置、制御方法及びプログラム
US11868119B2 (en) 2021-09-24 2024-01-09 Tokyo Electron Limited Method and process using fingerprint based semiconductor manufacturing process fault detection

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126028A (en) 1989-04-17 1992-06-30 Materials Research Corporation Sputter coating process control method and apparatus
US5270222A (en) 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
JP2742170B2 (ja) * 1992-02-17 1998-04-22 山形日本電気株式会社 半導体装置の製造システム
US5812261A (en) * 1992-07-08 1998-09-22 Active Impulse Systems, Inc. Method and device for measuring the thickness of opaque and transparent films
US5555177A (en) 1994-05-27 1996-09-10 Ontrak Systems, Inc. Method and apparatus for resetting individual processes in a control system
US5614247A (en) * 1994-09-30 1997-03-25 International Business Machines Corporation Apparatus for chemical vapor deposition of aluminum oxide
US5715361A (en) * 1995-04-13 1998-02-03 Cvc Products, Inc. Rapid thermal processing high-performance multizone illuminator for wafer backside heating
US5665214A (en) 1995-05-03 1997-09-09 Sony Corporation Automatic film deposition control method and system
US5536317A (en) * 1995-10-27 1996-07-16 Specialty Coating Systems, Inc. Parylene deposition apparatus including a quartz crystal thickness/rate controller
JP2965002B2 (ja) 1997-06-20 1999-10-18 日本電気株式会社 半導体記憶装置
JPH1116973A (ja) * 1997-06-26 1999-01-22 Hitachi Ltd 半導体装置製造方法及びその半導体装置製造方法で製造された半導体装置
EP0932194A1 (en) * 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision
JP4271745B2 (ja) * 1998-05-15 2009-06-03 浜松ホトニクス株式会社 半導体製造装置制御システム
US6303395B1 (en) * 1999-06-01 2001-10-16 Applied Materials, Inc. Semiconductor processing techniques
FR2808098B1 (fr) * 2000-04-20 2002-07-19 Cit Alcatel Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes

Also Published As

Publication number Publication date
KR20020063269A (ko) 2002-08-01
DE60011143D1 (de) 2004-07-01
EP1254401B1 (en) 2004-05-26
US6684122B1 (en) 2004-01-27
KR100747126B1 (ko) 2007-08-09
JP2003519444A (ja) 2003-06-17
EP1254401A1 (en) 2002-11-06
WO2001050206A1 (en) 2001-07-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GLOBALFOUNDRIES INC. MAPLES CORPORATE SERVICES, KY