DE60003454D1 - Zusammensetzung zum vermeiden des kriechens eines weichlötflussmittels, und dessen verwendung - Google Patents

Zusammensetzung zum vermeiden des kriechens eines weichlötflussmittels, und dessen verwendung

Info

Publication number
DE60003454D1
DE60003454D1 DE60003454T DE60003454T DE60003454D1 DE 60003454 D1 DE60003454 D1 DE 60003454D1 DE 60003454 T DE60003454 T DE 60003454T DE 60003454 T DE60003454 T DE 60003454T DE 60003454 D1 DE60003454 D1 DE 60003454D1
Authority
DE
Germany
Prior art keywords
cream
avoiding
composition
soft soldering
soldering flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60003454T
Other languages
English (en)
Other versions
DE60003454T2 (de
Inventor
Syunji Odaka
Yutaka Fukatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seimi Chemical Co Ltd
Original Assignee
Seimi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seimi Chemical Co Ltd filed Critical Seimi Chemical Co Ltd
Application granted granted Critical
Publication of DE60003454D1 publication Critical patent/DE60003454D1/de
Publication of DE60003454T2 publication Critical patent/DE60003454T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE60003454T 1999-11-02 2000-11-02 Zusammensetzung zum vermeiden des kriechens eines weichlötflussmittels, und dessen verwendung Expired - Lifetime DE60003454T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP31234199 1999-11-02
JP31234199A JP4343354B2 (ja) 1999-11-02 1999-11-02 半田用フラックス這い上がり防止剤組成物とその用途
PCT/JP2000/007726 WO2001032351A1 (en) 1999-11-02 2000-11-02 Composition for preventing creeping of a flux for soldering and use thereof

Publications (2)

Publication Number Publication Date
DE60003454D1 true DE60003454D1 (de) 2003-07-24
DE60003454T2 DE60003454T2 (de) 2004-05-06

Family

ID=18028086

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60003454T Expired - Lifetime DE60003454T2 (de) 1999-11-02 2000-11-02 Zusammensetzung zum vermeiden des kriechens eines weichlötflussmittels, und dessen verwendung

Country Status (8)

Country Link
US (1) US6758389B1 (de)
EP (1) EP1232039B1 (de)
JP (1) JP4343354B2 (de)
CN (1) CN1178760C (de)
DE (1) DE60003454T2 (de)
MY (1) MY120864A (de)
TW (1) TW483296B (de)
WO (1) WO2001032351A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4343354B2 (ja) * 1999-11-02 2009-10-14 Ａｇｃセイミケミカル株式会社 半田用フラックス這い上がり防止剤組成物とその用途
AU2003268772A1 (en) * 2002-10-10 2004-05-04 Seimi Chemical Co., Ltd. Oil-barrier composition
JP4996837B2 (ja) * 2004-11-18 2012-08-08 Ａｇｃセイミケミカル株式会社 潤滑オイルのバリア剤組成物およびその用途
JP5124441B2 (ja) * 2006-03-01 2013-01-23 Ａｇｃセイミケミカル株式会社 半田用フラックス這い上がり防止組成物
JP5161789B2 (ja) * 2006-11-17 2013-03-13 Ａｇｃセイミケミカル株式会社 はんだ用フラックス這い上がり防止組成物、該組成物を被覆したはんだ用電子部材、該部材のはんだ付け方法および電気製品
GB0703172D0 (en) * 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
CN101952082B (zh) * 2008-01-18 2013-03-13 Agc清美化学股份有限公司 焊剂上爬防止组合物、被覆了该组合物的锡焊用电子构件、该构件的锡焊方法及电气产品
WO2011105223A1 (ja) * 2010-02-26 2011-09-01 アルプス電気株式会社 電気接点用表面処理剤
CN101811235B (zh) * 2010-05-07 2012-11-28 常州大学 一种能够消除锡珠的用于波峰焊用助焊剂的添加剂
US8070045B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable amine flux composition and method of soldering
US8070046B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
US8070043B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8070044B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Polyamine flux composition and method of soldering
US8434667B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Polyamine, carboxylic acid flux composition and method of soldering
US8430295B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8430293B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable amine, carboxylic acid flux composition and method of soldering
US8434666B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
US8430294B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Amine, carboxylic acid flux composition and method of soldering
JP5453385B2 (ja) * 2011-12-26 2014-03-26 千住金属工業株式会社 ソルダペースト
CN105026446A (zh) * 2012-11-13 2015-11-04 3M创新有限公司 可固化的防污组合物、使用方法以及制品
WO2020039497A1 (ja) * 2018-08-21 2020-02-27 ハリマ化成株式会社 ろう付け材、ろう付け部材、熱交換器、および、ろう付け部材の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0191882B1 (de) 1985-02-21 1989-06-07 Asahi Glass Company Ltd. Verfahren zum Weichlöten von elektrischen Bauteilen
JPS62158756A (ja) * 1986-01-07 1987-07-14 Asahi Glass Co Ltd 農業用合成樹脂被覆材
JP2595275B2 (ja) 1987-12-28 1997-04-02 株式会社ネオス 付着防止剤
EP0460523B1 (de) * 1990-06-01 1995-08-02 Asahi Glass Company Ltd. Fluoropolymer-Überzugszusammensetzung und damit beschichteter Gegenstand
US5292796A (en) * 1991-04-02 1994-03-08 Minnesota Mining And Manufacturing Company Urea-aldehyde condensates and melamine derivatives comprising fluorochemical oligomers
US5316825A (en) * 1991-06-19 1994-05-31 Mitsubishi Kasei Vinyl Company Anti-fogging film made of a transparent synthetic resin
US5498657A (en) * 1993-08-27 1996-03-12 Asahi Glass Company Ltd. Fluorine-containing polymer composition
JP3516148B2 (ja) 1993-12-28 2004-04-05 大日本インキ化学工業株式会社 電子部品へのフラックス侵入防止方法
JP3239645B2 (ja) * 1994-10-24 2001-12-17 ダイキン工業株式会社 含フッ素系重合体水性分散液
JP3673880B2 (ja) * 1996-05-29 2005-07-20 大日本インキ化学工業株式会社 水性樹脂水分散体及びその製造方法
TW416260B (en) * 1997-01-31 2000-12-21 Asahi Glass Co Ltd Electronic components having fluorine polymer thin film
US6495624B1 (en) * 1997-02-03 2002-12-17 Cytonix Corporation Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same
US5977241A (en) * 1997-02-26 1999-11-02 Integument Technologies, Inc. Polymer and inorganic-organic hybrid composites and methods for making same
US6283360B1 (en) 1997-07-15 2001-09-04 Seimi Chemical Co., Ltd. Composition for preventing creeping of a flux for soldering
US6391807B1 (en) * 1999-09-24 2002-05-21 3M Innovative Properties Company Polymer composition containing a fluorochemical oligomer
US6174964B1 (en) * 1999-09-24 2001-01-16 3M Innovative Properties Company Fluorochemical oligomer and use thereof
JP4343354B2 (ja) * 1999-11-02 2009-10-14 Ａｇｃセイミケミカル株式会社 半田用フラックス這い上がり防止剤組成物とその用途

Also Published As

Publication number Publication date
JP4343354B2 (ja) 2009-10-14
CN1384773A (zh) 2002-12-11
MY120864A (en) 2005-11-30
US6758389B1 (en) 2004-07-06
TW483296B (en) 2002-04-11
DE60003454T2 (de) 2004-05-06
WO2001032351A1 (en) 2001-05-10
CN1178760C (zh) 2004-12-08
EP1232039B1 (de) 2003-06-18
EP1232039A1 (de) 2002-08-21
JP2001135926A (ja) 2001-05-18

Similar Documents

Publication Publication Date Title
DE60003454D1 (de) Zusammensetzung zum vermeiden des kriechens eines weichlötflussmittels, und dessen verwendung
DE60024437D1 (de) Werkzeug zum einstellen eines implantierbaren und einstellbaren durchflussregelventils
MXPA02000927A (es) Amina y derivados de amida como ligandos para el receptor del neuropeptido y y5 utiles en el tratamiento de obesidad y otros trastornos.
GB0109537D0 (en) Well treatment fluids and methods for the use thereof
GB0109414D0 (en) Well treatment fluids and methods for the use thereof
IL143477A0 (en) A NEW PROCESS FOR THE PREPARATION OF 17-PHENYL-18,19,20-TRINOR-PGF2α AND ITS DERIVATIVES
MXPA03007440A (es) Compuestos de fase cubica cristalina liquida y metodos para su preparacion.
IL159890A0 (en) Dolastatin 10 derivatives
HK1098737A1 (en) Process for the preparation of 1,1,1,3,3-pentafluoro-2-chloropropene and 1,1,1,3,3,3-hexafluoro-2-chloropropane
HUP0302719A3 (en) Substituted amine derivatives and their use for the treatment of angiogenesis
AP2003002857A0 (en) New spirotricyclic derivatives and their use as phosphodiesterase-7 inhibitors.
EP1583821A4 (de) Verfahren und zusammensetzungen zur behandlung von urologischen erkrankungen unter verwendung von 44390, 54181, 211, 5687, 884, 1405, 636, 4421, 5410, 30905, 2045, 16405, 18560, 2047, 33751, 52872, 14063, 20739, 32544, 43239, 44373, 51164, 53010, 16852, 1587, 2207, 22245, 2387, 52908, 69112, 14990, 18547, 115, 579, 15985, 15625, 76
EP1487356A4 (de) Lokalisierte flüssigkeitsabgabe mit einem porösen applikator und anwendungsverfahren dafür
HUP0102255A3 (en) Vla-4 inhibitor omepupa-v, pharmaceutical compositions comprising thereof and their use
IL166821A0 (en) Novel 1,4-diazabicycloalkane derivatives their preparation and use
HUP0401403A3 (en) 2,4-diaminothiazole derivatives, their use and pharmaceutical compositions containing them
DE60110450D1 (de) Legierung zum löten und für lötverbindung
IL161893A0 (en) 5-Phenylpyrimidines, agents comprising the same, method for production and use thereof
TWI319762B (en) 1,7,8-trifluoro-2-naphthol and manufacturing methods for liquid crystal compositions containing the same
DE29910202U1 (de) Füllkörper zum Verengen des Querschnitts eines Knochenkanals
GB0110061D0 (en) Novel 4,5-Dihydroisoxazolylalkylpiperazine derivatives having selective biological activity at dopamine D3 or D4 receptor and preparation thereof
IL181216A0 (en) 3, 5-seco-4-norcholestane derivatives and pharmaceutical compositions containing the same
HUP0202110A2 (en) Benzamide derivatives, agricultural and horticultural insecticid composition containing thereof and a method for using the same
DE50105428D1 (de) Ventilblock und ventilblockeinsatz zum herstellen solch eines ventilblocks
SI1197485T1 (en) Cyclobuten-dione derivatives for use in the treatment of artherosclerosis

Legal Events

Date Code Title Description
8364 No opposition during term of opposition