DE60003332D1 - Elektrische prüfung der verbindung von leitern auf einem substrat - Google Patents

Elektrische prüfung der verbindung von leitern auf einem substrat

Info

Publication number
DE60003332D1
DE60003332D1 DE60003332T DE60003332T DE60003332D1 DE 60003332 D1 DE60003332 D1 DE 60003332D1 DE 60003332 T DE60003332 T DE 60003332T DE 60003332 T DE60003332 T DE 60003332T DE 60003332 D1 DE60003332 D1 DE 60003332D1
Authority
DE
Germany
Prior art keywords
conductor
ladders
substrate
connection
electrical check
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60003332T
Other languages
English (en)
Other versions
DE60003332T2 (de
Inventor
Christophe Vaucher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE60003332D1 publication Critical patent/DE60003332D1/de
Application granted granted Critical
Publication of DE60003332T2 publication Critical patent/DE60003332T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
DE60003332T 1999-11-26 2000-11-23 Elektrische prüfung der verbindung von leitern auf einem substrat Expired - Fee Related DE60003332T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9914876A FR2801680B3 (fr) 1999-11-26 1999-11-26 Methode de test electrique de la conformite de l'interconnexion de conducteurs electriques disposes sur un substrat, sans contact et sans outillage
FR9914876 1999-11-26
PCT/FR2000/003262 WO2001038892A1 (fr) 1999-11-26 2000-11-23 Test electrique de l'interconnexion de conducteurs electriques sur un substrat

Publications (2)

Publication Number Publication Date
DE60003332D1 true DE60003332D1 (de) 2003-07-17
DE60003332T2 DE60003332T2 (de) 2004-04-29

Family

ID=9552559

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60003332T Expired - Fee Related DE60003332T2 (de) 1999-11-26 2000-11-23 Elektrische prüfung der verbindung von leitern auf einem substrat

Country Status (10)

Country Link
US (1) US6859052B1 (de)
EP (1) EP1236052B1 (de)
JP (1) JP2003515175A (de)
CN (1) CN1208626C (de)
AT (1) ATE242884T1 (de)
AU (1) AU2176801A (de)
DE (1) DE60003332T2 (de)
ES (1) ES2203545T3 (de)
FR (1) FR2801680B3 (de)
WO (1) WO2001038892A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI221922B (en) † 2001-02-19 2004-10-11 Nihon Densan Read Kabushiki Ka A circuit board testing apparatus and method for testing a circuit board
JP3776902B2 (ja) * 2003-09-04 2006-05-24 株式会社東芝 基板検査装置、基板検査方法、プログラムおよび半導体装置の製造方法
JP4287255B2 (ja) * 2003-11-27 2009-07-01 日本電産リード株式会社 基板検査装置及び基板検査方法
IL160074A (en) * 2004-01-26 2009-07-20 Redent Nova Ltd Self adjusting instrument
US7196536B2 (en) * 2004-08-02 2007-03-27 Agilent Technologies, Inc. Method and apparatus for non-contact electrical probe
FR2881832B1 (fr) * 2005-02-04 2007-04-20 Beamind Soc Par Actions Simpli Procede de test de conducteurs electriques par effet photoelectrique, au moyen d'une plaque separatrice
FR2881833B1 (fr) * 2005-02-04 2007-04-20 Beamind Soc Par Actions Simpli Procede de test d'elements electriques utilisant un effet photoelectrique indirect
FR2881835B1 (fr) * 2005-02-04 2007-07-27 Beamind Soc Par Actions Simpli Procede et systeme de test ou de mesure d'elements electriques
FR2881834B1 (fr) * 2005-02-04 2007-05-11 Beamind Soc Par Actions Simpli Procede et systeme de test ou de mesure d'elements electriques, au moyen de deux impulsions decalees
TW200717682A (en) * 2005-10-11 2007-05-01 Orbotech Ltd Method for inspecting microelectronic components on a substrate and apparatus for testing same
KR100738089B1 (ko) * 2005-12-30 2007-07-12 삼성전자주식회사 표면 전자방출 소자 어레이를 이용한 ｔｆｔ 검사 장치
WO2007079477A2 (en) * 2006-01-03 2007-07-12 Applied Materials Israel, Ltd Apparatus and method for test structure inspection
FR2897690B1 (fr) * 2006-02-17 2008-04-18 Commissariat Energie Atomique Dispositif de test de connexions electriques, sans contact
EP2387021A1 (de) 2010-05-12 2011-11-16 Dialog Semiconductor GmbH Verbindungstest für OLED-Modul auf Grundlage eines Treiberchips
US9846130B2 (en) * 2014-02-24 2017-12-19 Applied Materials, Inc. Ceramic ring test device
JP2016151573A (ja) * 2015-02-19 2016-08-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法およびプローブカード
KR102387464B1 (ko) * 2017-10-12 2022-04-15 삼성전자주식회사 배선 회로 테스트 장치 및 방법과, 그 방법을 포함한 반도체 소자 제조방법
WO2023217354A1 (en) * 2022-05-10 2023-11-16 Applied Materials, Inc. Method for testing a packaging substrate, and apparatus for testing a packaging substrate
WO2023217355A1 (en) * 2022-05-10 2023-11-16 Applied Materials, Inc. Methods and apparatuses for identifying defective electrical connections of a substrate

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3235461A1 (de) 1982-09-24 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Verfahren zur kontaktlosen pruefung eines objekts, insbesondere von mikroverdrahtungen, mit einer korpuskularstrahl-sonde
US4837506A (en) * 1986-10-02 1989-06-06 Ultraprobe, Inc. Apparatus including a focused UV light source for non-contact measuremenht and alteration of electrical properties of conductors
JPH065691B2 (ja) * 1987-09-26 1994-01-19 株式会社東芝 半導体素子の試験方法および試験装置
US4967152A (en) * 1988-03-11 1990-10-30 Ultra-Probe Apparatus including a focused UV light source for non-contact measurement and alteration of electrical properties of conductors
EP0429739B1 (de) * 1989-11-28 1993-10-27 International Business Machines Corporation Verfahren zur Inspektion von Durchkontakt-Stiften in integrierten Schaltungspackungen mittels Photoemission
US5150043A (en) * 1991-02-11 1992-09-22 The United States Of America As Represented By The Secretary Of The Navy Apparatus and method for non-contact surface voltage probing by scanning photoelectron emission
US5141602A (en) * 1991-06-18 1992-08-25 International Business Machines Corporation High-productivity method and apparatus for making customized interconnections
US6072179A (en) * 1998-08-07 2000-06-06 Intel Corporation Method and apparatus using an infrared laser based optical probe for measuring voltages directly from active regions in an integrated circuit
US6369591B1 (en) * 1999-01-14 2002-04-09 Maniatech Incorporated Apparatus and method using photoelectric effect for testing electrical traces
US6369590B1 (en) * 1999-01-14 2002-04-09 Maniatech Incorporated Apparatus and method using photoelectric effect for testing electrical traces
US6653851B2 (en) * 1999-01-14 2003-11-25 Lomanoha Ventures Refocusing wavelengths to a common focal plane for electrical trace testing
US6512385B1 (en) * 1999-07-26 2003-01-28 Paul Pfaff Method for testing a device under test including the interference of two beams

Also Published As

Publication number Publication date
CN1208626C (zh) 2005-06-29
FR2801680A1 (fr) 2001-06-01
EP1236052A1 (de) 2002-09-04
ES2203545T3 (es) 2004-04-16
ATE242884T1 (de) 2003-06-15
CN1425138A (zh) 2003-06-18
US6859052B1 (en) 2005-02-22
JP2003515175A (ja) 2003-04-22
AU2176801A (en) 2001-06-04
DE60003332T2 (de) 2004-04-29
EP1236052B1 (de) 2003-06-11
WO2001038892A1 (fr) 2001-05-31
FR2801680B3 (fr) 2002-02-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee