DE59405145D1 - Verfahren und Vorrichtung zum Schneiden der Deckfolie eines laminierten Folienmaterials - Google Patents
Verfahren und Vorrichtung zum Schneiden der Deckfolie eines laminierten FolienmaterialsInfo
- Publication number
- DE59405145D1 DE59405145D1 DE59405145T DE59405145T DE59405145D1 DE 59405145 D1 DE59405145 D1 DE 59405145D1 DE 59405145 T DE59405145 T DE 59405145T DE 59405145 T DE59405145 T DE 59405145T DE 59405145 D1 DE59405145 D1 DE 59405145D1
- Authority
- DE
- Germany
- Prior art keywords
- cutting
- sheet
- laminated film
- film material
- cover film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/02—Means for moving the cutting member into its operative position for cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
- B26D3/085—On sheet material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2628—Means for adjusting the position of the cutting member
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0341—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0348—Active means to control depth of score
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
- Y10T83/148—Including means to correct the sensed operation
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Control Of Cutting Processes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Nonmetal Cutting Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4315539A DE4315539C2 (de) | 1993-05-10 | 1993-05-10 | Verfahren und Vorrichtung zum Schneiden der Deckfolie eines laminierten Folienmaterials |
Publications (1)
Publication Number | Publication Date |
---|---|
DE59405145D1 true DE59405145D1 (de) | 1998-03-05 |
Family
ID=6487702
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4315539A Expired - Fee Related DE4315539C2 (de) | 1993-05-10 | 1993-05-10 | Verfahren und Vorrichtung zum Schneiden der Deckfolie eines laminierten Folienmaterials |
DE59405145T Expired - Fee Related DE59405145D1 (de) | 1993-05-10 | 1994-05-09 | Verfahren und Vorrichtung zum Schneiden der Deckfolie eines laminierten Folienmaterials |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4315539A Expired - Fee Related DE4315539C2 (de) | 1993-05-10 | 1993-05-10 | Verfahren und Vorrichtung zum Schneiden der Deckfolie eines laminierten Folienmaterials |
Country Status (4)
Country | Link |
---|---|
US (1) | US5515758A (de) |
EP (1) | EP0624438B1 (de) |
AT (1) | ATE162749T1 (de) |
DE (2) | DE4315539C2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0726222B1 (de) * | 1994-12-21 | 2001-08-22 | Seiko Epson Corporation | Verfahren und Vorrichtung zur Abtrennung eines Halterstreifens von einem Klebestreifen |
JPH08229887A (ja) * | 1994-12-27 | 1996-09-10 | Seiko Epson Corp | 積層シートのカット方法およびその装置 |
AUPN653695A0 (en) * | 1995-11-14 | 1995-12-07 | Tangential Technologies Pty. Limited | Method and apparatus for distinguishing a boundary between two layers |
EP0841131A1 (de) * | 1996-11-07 | 1998-05-13 | Bullmer Spezialmaschinen GmbH | Schneidvorrichtung mit Hubregelung |
WO2002022296A2 (en) | 2000-09-11 | 2002-03-21 | Allison Advanced Development Company | Mechanically grooved sheet and method of manufacture |
SE517931C2 (sv) * | 2000-11-10 | 2002-08-06 | Ericsson Telefon Ab L M | Anordning för att kapa en optisk fiber |
DE10135180A1 (de) * | 2001-07-19 | 2003-02-06 | Koenig & Bauer Ag | Vorrichtung und Verfahren zum Durchtrennen eines Klebebandes |
JP2008229789A (ja) * | 2007-03-22 | 2008-10-02 | Nec Corp | 凹部形成方法、凹部形成装置、及び凹部形成用材料 |
FR2998823B1 (fr) * | 2012-11-30 | 2015-06-05 | Oberthur Technologies | Dispositif de decoupe pour test de delaminage |
JP2018171669A (ja) * | 2017-03-31 | 2018-11-08 | ブラザー工業株式会社 | 切断装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1390455A (en) * | 1971-03-19 | 1975-04-16 | Amada Co Ltd | Vertical band sawing machine |
US3880028A (en) * | 1974-02-25 | 1975-04-29 | Ppg Industries Inc | Method and apparatus for monitoring and controlling glass cutting |
US3897659A (en) * | 1974-08-30 | 1975-08-05 | Us Energy | Ultrasonic-acoustic grinding wheel setting station for automatic numerically-controlled machines |
ES8305237A1 (es) * | 1981-01-26 | 1983-05-01 | Investronica Sa | Sistema mejorado para corregir flexiones de la cuchilla en una maquina automatica de corte |
NZ208780A (en) * | 1983-07-05 | 1988-02-29 | Univ Western Australia | Contact sensing device |
US4624169A (en) * | 1985-04-08 | 1986-11-25 | Aerochem, Inc. | Apparatus for automated cutting of thin films |
US4736625A (en) * | 1986-11-05 | 1988-04-12 | The Warner & Swasey Company | Method and apparatus for monitoring the cutting condition of a machine tool during machining of a workpiece |
DE3729208C1 (de) * | 1987-08-29 | 1988-12-22 | Rotring Werke Riepe Kg | Schneidvorrichtung |
US4920495A (en) * | 1988-07-15 | 1990-04-24 | Gfm Holdings Ag | Sheet cutting machine |
US5038654A (en) * | 1989-04-04 | 1991-08-13 | Ppg Industries, Inc. | Apparatus for scoring a glass sheet |
US5136817A (en) * | 1990-02-28 | 1992-08-11 | Nihon Dempa Kogyo Co., Ltd. | Automatic lapping apparatus for piezoelectric materials |
US5222329A (en) * | 1992-03-26 | 1993-06-29 | Micron Technology, Inc. | Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of conductors, semiconductors, and dielectric materials |
-
1993
- 1993-05-10 DE DE4315539A patent/DE4315539C2/de not_active Expired - Fee Related
-
1994
- 1994-04-28 US US08/234,564 patent/US5515758A/en not_active Expired - Fee Related
- 1994-05-09 DE DE59405145T patent/DE59405145D1/de not_active Expired - Fee Related
- 1994-05-09 EP EP94107239A patent/EP0624438B1/de not_active Expired - Lifetime
- 1994-05-09 AT AT94107239T patent/ATE162749T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0624438A1 (de) | 1994-11-17 |
DE4315539A1 (de) | 1994-11-17 |
ATE162749T1 (de) | 1998-02-15 |
EP0624438B1 (de) | 1998-01-28 |
US5515758A (en) | 1996-05-14 |
DE4315539C2 (de) | 1995-03-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |