DE50100613D1 - Verfahren zur regelung von reaktiven sputterprozessen - Google Patents

Verfahren zur regelung von reaktiven sputterprozessen

Info

Publication number
DE50100613D1
DE50100613D1 DE50100613T DE50100613T DE50100613D1 DE 50100613 D1 DE50100613 D1 DE 50100613D1 DE 50100613 T DE50100613 T DE 50100613T DE 50100613 T DE50100613 T DE 50100613T DE 50100613 D1 DE50100613 D1 DE 50100613D1
Authority
DE
Germany
Prior art keywords
reactive sputter
controlling reactive
sputter processes
processes
controlling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50100613T
Other languages
German (de)
English (en)
Inventor
Udo Bringmann
Thomas Hoeing
Niels Malkomes
Bernd Szyszka
Michael Vergoehl
Ralf Poeckelmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7636548&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE50100613(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority to DE50100613T priority Critical patent/DE50100613D1/de
Application granted granted Critical
Publication of DE50100613D1 publication Critical patent/DE50100613D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0094—Reactive sputtering in transition mode
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0042—Controlling partial pressure or flow rate of reactive or inert gases with feedback of measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Physical Vapour Deposition (AREA)
DE50100613T 2000-03-27 2001-03-27 Verfahren zur regelung von reaktiven sputterprozessen Expired - Lifetime DE50100613D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50100613T DE50100613D1 (de) 2000-03-27 2001-03-27 Verfahren zur regelung von reaktiven sputterprozessen

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10015150 2000-03-27
PCT/EP2001/003443 WO2001073151A1 (de) 2000-03-27 2001-03-27 Verfahren zur regelung von reaktiven sputterprozessen
DE50100613T DE50100613D1 (de) 2000-03-27 2001-03-27 Verfahren zur regelung von reaktiven sputterprozessen

Publications (1)

Publication Number Publication Date
DE50100613D1 true DE50100613D1 (de) 2003-10-16

Family

ID=7636548

Family Applications (1)

Application Number Title Priority Date Filing Date
DE50100613T Expired - Lifetime DE50100613D1 (de) 2000-03-27 2001-03-27 Verfahren zur regelung von reaktiven sputterprozessen

Country Status (4)

Country Link
EP (1) EP1268872B2 (3Den)
AU (1) AU2001263815A1 (3Den)
DE (1) DE50100613D1 (3Den)
WO (1) WO2001073151A1 (3Den)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10347521A1 (de) 2002-12-04 2004-06-24 Leybold Optics Gmbh Verfahren zur Herstellung Multilayerschicht und Vorrichtung zur Durchführung des Verfahrens
DE102005015587B4 (de) * 2005-04-05 2009-12-24 Von Ardenne Anlagentechnik Gmbh Verfahren und Anordnung zur Stabilisierung eines Arbeitspunktes von reaktiven, plasmagestützten Vakuumbeschichtungsprozessen
CN102725433B (zh) * 2010-01-21 2014-07-02 Oc欧瑞康巴尔斯公司 用以沉积防反射层于基材上的方法
CN107532290B (zh) 2015-03-31 2022-04-01 布勒阿尔策瑙股份有限公司 用于生产涂覆的基板的方法
DE102020122547B4 (de) 2020-08-28 2024-02-22 VON ARDENNE Asset GmbH & Co. KG Verfahren, Steuervorrichtung und nichtflüchtiger Datenspeicher

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4428811A (en) * 1983-04-04 1984-01-31 Borg-Warner Corporation Rapid rate reactive sputtering of a group IVb metal
JPH01268859A (ja) * 1988-04-20 1989-10-26 Casio Comput Co Ltd 透明導電膜の形成方法および形成装置
US5040559A (en) † 1989-02-06 1991-08-20 Mks Instruments, Inc. Modulating positive shutoff mechanism
ATE144004T1 (de) * 1991-04-12 1996-10-15 Balzers Hochvakuum Verfahren und anlage zur beschichtung mindestens eines gegenstandes
DE19609970A1 (de) * 1996-03-14 1997-09-18 Leybold Systems Gmbh Vorrichtung zum Aufbringen dünner Schichten auf ein Substrat

Also Published As

Publication number Publication date
EP1268872B1 (de) 2003-09-10
EP1268872B2 (de) 2010-01-20
WO2001073151A1 (de) 2001-10-04
AU2001263815A1 (en) 2001-10-08
EP1268872A1 (de) 2003-01-02

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings