AU2001263815A1 - Method for controlling reactive sputtering processes - Google Patents

Method for controlling reactive sputtering processes

Info

Publication number
AU2001263815A1
AU2001263815A1 AU2001263815A AU6381501A AU2001263815A1 AU 2001263815 A1 AU2001263815 A1 AU 2001263815A1 AU 2001263815 A AU2001263815 A AU 2001263815A AU 6381501 A AU6381501 A AU 6381501A AU 2001263815 A1 AU2001263815 A1 AU 2001263815A1
Authority
AU
Australia
Prior art keywords
reactive sputtering
sputtering processes
controlling reactive
controlling
processes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001263815A
Inventor
Udo Bringmann
Thomas Hoing
Niels Malkomes
Ralf Pockelmann
Bernd Szyszka
Michael Vergohl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7636548&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2001263815(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Publication of AU2001263815A1 publication Critical patent/AU2001263815A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0094—Reactive sputtering in transition mode
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0042—Controlling partial pressure or flow rate of reactive or inert gases with feedback of measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
AU2001263815A 2000-03-27 2001-03-27 Method for controlling reactive sputtering processes Abandoned AU2001263815A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10015150 2000-03-27
DE10015150 2000-03-27
PCT/EP2001/003443 WO2001073151A1 (en) 2000-03-27 2001-03-27 Method for controlling reactive sputtering processes

Publications (1)

Publication Number Publication Date
AU2001263815A1 true AU2001263815A1 (en) 2001-10-08

Family

ID=7636548

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001263815A Abandoned AU2001263815A1 (en) 2000-03-27 2001-03-27 Method for controlling reactive sputtering processes

Country Status (4)

Country Link
EP (1) EP1268872B2 (en)
AU (1) AU2001263815A1 (en)
DE (1) DE50100613D1 (en)
WO (1) WO2001073151A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10347521A1 (en) 2002-12-04 2004-06-24 Leybold Optics Gmbh Method for producing a multilayer layer and device for carrying out the method
DE102005015587B4 (en) * 2005-04-05 2009-12-24 Von Ardenne Anlagentechnik Gmbh Method and arrangement for stabilizing an operating point of reactive plasma-assisted vacuum coating processes
CN102725433B (en) * 2010-01-21 2014-07-02 Oc欧瑞康巴尔斯公司 Method for depositing an antireflective layer on a substrate
WO2016156496A1 (en) 2015-03-31 2016-10-06 Bühler Alzenau Gmbh Method for producing coated substrates
DE102020122547B4 (en) 2020-08-28 2024-02-22 VON ARDENNE Asset GmbH & Co. KG Method, control device and non-volatile data storage

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4428811A (en) * 1983-04-04 1984-01-31 Borg-Warner Corporation Rapid rate reactive sputtering of a group IVb metal
JPH01268859A (en) * 1988-04-20 1989-10-26 Casio Comput Co Ltd Formation of transparent conductive film and device therefor
US5040559A (en) † 1989-02-06 1991-08-20 Mks Instruments, Inc. Modulating positive shutoff mechanism
EP0508359B1 (en) * 1991-04-12 1996-10-09 Balzers Aktiengesellschaft Process and apparatus for coating at least one object
DE19609970A1 (en) * 1996-03-14 1997-09-18 Leybold Systems Gmbh Device for applying thin layers on a substrate

Also Published As

Publication number Publication date
EP1268872B1 (en) 2003-09-10
DE50100613D1 (en) 2003-10-16
EP1268872A1 (en) 2003-01-02
EP1268872B2 (en) 2010-01-20
WO2001073151A1 (en) 2001-10-04

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