DE4490251D2 - Phasengesteuertes fraktales Lasersystem - Google Patents

Phasengesteuertes fraktales Lasersystem

Info

Publication number
DE4490251D2
DE4490251D2 DE4490251D DE4490251D DE4490251D2 DE 4490251 D2 DE4490251 D2 DE 4490251D2 DE 4490251 D DE4490251 D DE 4490251D DE 4490251 D DE4490251 D DE 4490251D DE 4490251 D2 DE4490251 D2 DE 4490251D2
Authority
DE
Germany
Prior art keywords
laser system
phase controlled
fractal laser
controlled fractal
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE4490251D
Other languages
English (en)
Other versions
DE4490251B4 (de
Inventor
Hans Opower
Helmut Huegel
Adolf Giesen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deutsches Zentrum fuer Luft und Raumfahrt eV
Institut fuer Strahlwerkzeuge Universitaet Stuttgart
Original Assignee
Deutsche Forschungs und Versuchsanstalt fuer Luft und Raumfahrt eV DFVLR
Institut fuer Strahlwerkzeuge Universitaet Stuttgart
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Forschungs und Versuchsanstalt fuer Luft und Raumfahrt eV DFVLR, Institut fuer Strahlwerkzeuge Universitaet Stuttgart filed Critical Deutsche Forschungs und Versuchsanstalt fuer Luft und Raumfahrt eV DFVLR
Application granted granted Critical
Publication of DE4490251D2 publication Critical patent/DE4490251D2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4249Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42Arrays of surface emitting lasers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42Arrays of surface emitting lasers
    • H01S5/423Arrays of surface emitting lasers having a vertical cavity

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE4490251D 1993-01-22 1994-01-14 Phasengesteuertes fraktales Lasersystem Expired - Lifetime DE4490251D2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4301687 1993-01-22
PCT/DE1994/000036 WO1994017575A1 (de) 1993-01-22 1994-01-14 Phasengesteuertes fraktales lasersystem
DE4490251A DE4490251B4 (de) 1993-01-22 1994-01-14 Phasengesteuertes fraktales Lasersystem

Publications (1)

Publication Number Publication Date
DE4490251D2 true DE4490251D2 (de) 1997-07-31

Family

ID=6478727

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4490251A Expired - Fee Related DE4490251B4 (de) 1993-01-22 1994-01-14 Phasengesteuertes fraktales Lasersystem
DE4490251D Expired - Lifetime DE4490251D2 (de) 1993-01-22 1994-01-14 Phasengesteuertes fraktales Lasersystem

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE4490251A Expired - Fee Related DE4490251B4 (de) 1993-01-22 1994-01-14 Phasengesteuertes fraktales Lasersystem

Country Status (4)

Country Link
US (1) US5513195A (de)
JP (1) JP3149956B2 (de)
DE (2) DE4490251B4 (de)
WO (1) WO1994017575A1 (de)

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US5729568A (en) * 1993-01-22 1998-03-17 Deutsche Forschungsanstalt Fuer Luft-Und Raumfahrt E.V. Power-controlled, fractal laser system
DE69529209T2 (de) * 1995-03-14 2003-11-13 Brown & Sharpe Tesa S.A., Renens Element mit einem geregelten Diodenlaser, und elektrooptische Vorrichtung unter Verwendung eines derartigen Elements
US5608742A (en) * 1995-08-18 1997-03-04 Spectra Physics Lasers, Inc. Diode pumped, fiber coupled laser with depolarized pump beam
US5999544A (en) * 1995-08-18 1999-12-07 Spectra-Physics Lasers, Inc. Diode pumped, fiber coupled laser with depolarized pump beam
DE19603111C2 (de) * 1996-01-29 2002-08-14 Deutsch Zentr Luft & Raumfahrt Lasersystem
DE59609070D1 (de) * 1996-10-20 2002-05-16 Inpro Innovations Gmbh Verfahren und Anordnung zur temperaturgeregelten Oberflächenbehandlung, insbesondere zum Härten von Werkstückoberflächen mittels Laserstrahlung
DE19861008B4 (de) * 1997-03-17 2007-08-16 Deutsches Zentrum für Luft- und Raumfahrt e.V. Lasersystem
US6157755A (en) * 1997-03-17 2000-12-05 Deutsches Zentrum Fuer Luft-Und Raumfahrt E.V. Laser system
US6272155B1 (en) 1997-06-30 2001-08-07 Hoya Corporation Fiber bundle and laser apparatus using the fiber bundle of manufacturing the same
ES2140341B1 (es) 1998-03-17 2000-10-16 Macsa Id Sa Sistema de marcaje laser.
US7027475B1 (en) * 2000-04-11 2006-04-11 Nuvonyx, Inc. Tailored index single mode optical amplifiers and devices and systems including same
JP2003255552A (ja) * 2002-03-06 2003-09-10 Nec Corp レーザ照射装置並びに走査レーザ光を用いた露光方法及び走査レーザ光を用いたカラーフィルタの製造方法
WO2003076150A1 (fr) * 2002-03-12 2003-09-18 Mitsuboshi Diamond Industrial Co., Ltd. Procede et systeme d'usinage d'un materiau fragile
ATE476772T1 (de) * 2003-09-01 2010-08-15 Avalon Photonics Ag Hochenergie-topemitter-vcsel
JP4816855B2 (ja) * 2004-06-04 2011-11-16 ウシオ電機株式会社 光源装置
US7620084B1 (en) * 2005-03-25 2009-11-17 Science Research Laboratory, Inc. Methods and systems for laser diode control
US20060239312A1 (en) * 2005-04-23 2006-10-26 Telaris Inc. Semiconductor Lasers in Optical Phase-Locked Loops
JP2010251649A (ja) * 2009-04-20 2010-11-04 Hitachi Ltd 面出射型レーザモジュールおよび面受光型モジュール
AU2015346153B2 (en) * 2014-11-14 2019-12-12 Boston Scientific Scimed, Inc. Surgical laser systems and laser devices

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US3590248A (en) * 1965-04-13 1971-06-29 Massachusetts Inst Technology Laser arrays
DE2153969A1 (de) * 1971-10-29 1973-05-03 Licentia Gmbh Anordnung zur erhoehung der strahlungsdichte von strahlungsquellen
JPS5773718A (en) * 1980-10-25 1982-05-08 Ricoh Co Ltd Synthesizer for semiconductor laser output
JPS5784189A (en) * 1980-11-14 1982-05-26 Nec Corp Hybrid integrated optical circuit
US4661786A (en) * 1984-04-16 1987-04-28 Mcdonnell Douglas Corporation Method and apparatus for producing an optical phased array
US4680767A (en) * 1985-07-01 1987-07-14 Polaroid Corporation Optical fiber laser
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Also Published As

Publication number Publication date
JPH07505745A (ja) 1995-06-22
WO1994017575A1 (de) 1994-08-04
DE4490251B4 (de) 2004-04-22
US5513195A (en) 1996-04-30
JP3149956B2 (ja) 2001-03-26

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