DE4391640T1 - Verfahren und Gerät zum Detektieren einer Konzentration einer chemischen Behandlungslösung und automatisches Steuergerät dafür - Google Patents

Verfahren und Gerät zum Detektieren einer Konzentration einer chemischen Behandlungslösung und automatisches Steuergerät dafür

Info

Publication number
DE4391640T1
DE4391640T1 DE19934391640 DE4391640T DE4391640T1 DE 4391640 T1 DE4391640 T1 DE 4391640T1 DE 19934391640 DE19934391640 DE 19934391640 DE 4391640 T DE4391640 T DE 4391640T DE 4391640 T1 DE4391640 T1 DE 4391640T1
Authority
DE
Germany
Prior art keywords
concentration
detecting
automatic control
chemical treatment
treatment solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19934391640
Other languages
English (en)
Inventor
Makoto Suga
Masashi Niwa
Fumio Kojima
Nobumasa Ishida
Koji Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9815492A external-priority patent/JPH05295555A/ja
Priority claimed from JP13895092A external-priority patent/JPH05331651A/ja
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Publication of DE4391640T1 publication Critical patent/DE4391640T1/de
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D21/00—Control of chemical or physico-chemical variables, e.g. pH value
    • G05D21/02—Control of chemical or physico-chemical variables, e.g. pH value characterised by the use of electric means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0324—With control of flow by a condition or characteristic of a fluid
    • Y10T137/0329—Mixing of plural fluids of diverse characteristics or conditions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/2496—Self-proportioning or correlating systems
    • Y10T137/2499—Mixture condition maintaining or sensing
    • Y10T137/2509—By optical or chemical property

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
DE19934391640 1992-04-17 1993-04-16 Verfahren und Gerät zum Detektieren einer Konzentration einer chemischen Behandlungslösung und automatisches Steuergerät dafür Ceased DE4391640T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9815492A JPH05295555A (ja) 1992-04-17 1992-04-17 めっき液の自動管理装置
JP13895092A JPH05331651A (ja) 1992-05-29 1992-05-29 化学的処理液の濃度検出装置及び自動管理装置
PCT/JP1993/000486 WO1993021359A1 (en) 1992-04-17 1993-04-16 Method of and apparatus for detecting concentration of chemical processing liquid and automatic control apparatus for the same method and apparatus

Publications (1)

Publication Number Publication Date
DE4391640T1 true DE4391640T1 (de) 1994-05-05

Family

ID=26439358

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19934391640 Ceased DE4391640T1 (de) 1992-04-17 1993-04-16 Verfahren und Gerät zum Detektieren einer Konzentration einer chemischen Behandlungslösung und automatisches Steuergerät dafür

Country Status (4)

Country Link
US (1) US5450870A (de)
KR (1) KR940701464A (de)
DE (1) DE4391640T1 (de)
WO (1) WO1993021359A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5631845A (en) * 1995-10-10 1997-05-20 Ford Motor Company Method and system for controlling phosphate bath constituents
DE19539760C2 (de) * 1995-10-26 1998-06-04 Manz Galvanotechnik Gmbh Verfahren zur Steuerung des Wasserflusses in einem Spülsystem einer Anlage für die Galvano- und Oberflächentechnik
DE19814500A1 (de) * 1998-04-01 1999-10-14 Henkel Kgaa Automatische Kontrolle und Steuerung des Tensidgehalts in wäßrigen Prozeßlösungen
US6365033B1 (en) * 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
KR20010053520A (ko) * 1998-07-13 2001-06-25 디제이 파커 컴파니, 인코포레이티드 두잉 비즈니스 애즈 파커 시스템즈 보측된 화학 보충 시스템
US6269533B2 (en) * 1999-02-23 2001-08-07 Advanced Research Corporation Method of making a patterned magnetic recording head
US6496328B1 (en) 1999-12-30 2002-12-17 Advanced Research Corporation Low inductance, ferrite sub-gap substrate structure for surface film magnetic recording heads
US7001652B2 (en) * 2002-07-09 2006-02-21 Pinney Steve B Composite fiber-resin tube with diametral fiber truss and method of manufacture
US6986835B2 (en) * 2002-11-04 2006-01-17 Applied Materials Inc. Apparatus for plating solution analysis
US7851222B2 (en) * 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3426492A1 (de) * 1984-07-11 1986-01-30 Vsesojuznyj naučno-issledovatel'skij i proektnyj institut aljuminievoj, magnievoj i elektrodnoj promyšlennosti, Leningrad Verfahren zur steuerung des karbonisierungsprozesses von aluminatlauge

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3060950A (en) * 1958-12-27 1962-10-30 Shell Oil Co Buffer vessel with controlled by-pass and method of operating same
JPS53131963A (en) * 1977-04-25 1978-11-17 Kurabo Ind Ltd Device for controlling nitrogen oxide removing device
US4315518A (en) * 1980-06-30 1982-02-16 Western Electric Company, Inc. Methods of and system for controlling copper concentration in a solution
US4372666A (en) * 1981-11-16 1983-02-08 Pako Corporation Automatic variable-quantity/variable-time anti-oxidation replenisher control system
JPS602386B2 (ja) * 1982-03-16 1985-01-21 石原薬品株式会社 めっき液及び化成液の管理方法
JPH0247550B2 (ja) * 1982-08-23 1990-10-22 Chusho Kigyo Jigyodan Mudenkaidometsukiekinokanrihoho
US4464315A (en) * 1982-12-20 1984-08-07 Betz Entec, Inc. Indexing controller system and method of automatic control of cooling water tower systems
JPS61199069A (ja) * 1985-02-28 1986-09-03 C Uyemura & Co Ltd めっき液濃度自動連続管理装置
JPH01147707A (ja) * 1987-12-04 1989-06-09 Toshiba Corp 薬品注入制御装置
JPH02254181A (ja) * 1989-03-29 1990-10-12 Toyama Nippon Denki Kk エッチング浴の安定剤の管理方法
JP2971512B2 (ja) * 1990-05-19 1999-11-08 バブコツク日立株式会社 湿式排煙脱硫装置の制御方法
GB9108387D0 (en) * 1991-04-19 1991-06-05 Unilever Plc Washing process
US5340468A (en) * 1993-03-31 1994-08-23 Hawthorne Treatment Systems, Inc. System for controlling addition of lime to reduce water alkalinity

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3426492A1 (de) * 1984-07-11 1986-01-30 Vsesojuznyj naučno-issledovatel'skij i proektnyj institut aljuminievoj, magnievoj i elektrodnoj promyšlennosti, Leningrad Verfahren zur steuerung des karbonisierungsprozesses von aluminatlauge

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
D. Abel, Automatisierungstechnik 39, 12 (1991) *

Also Published As

Publication number Publication date
US5450870A (en) 1995-09-19
KR940701464A (ko) 1994-05-28
WO1993021359A1 (en) 1993-10-28

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: DENSO CORP., KARIYA, AICHI, JP

8131 Rejection