DE4315023C2 - Vorrichtung zur Kathodenzerstäubung - Google Patents
Vorrichtung zur KathodenzerstäubungInfo
- Publication number
- DE4315023C2 DE4315023C2 DE19934315023 DE4315023A DE4315023C2 DE 4315023 C2 DE4315023 C2 DE 4315023C2 DE 19934315023 DE19934315023 DE 19934315023 DE 4315023 A DE4315023 A DE 4315023A DE 4315023 C2 DE4315023 C2 DE 4315023C2
- Authority
- DE
- Germany
- Prior art keywords
- ring
- target
- anode
- cathode
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Description
2 Zerstäubungskathode
3 Vakuum-Dichtring
4 Anode
5 Joch
6 Isolator
7 Kühlplatte
8 Target
9 Ringmagnet
10 Schraube
11 Kabel
12 Isolator
13 Ringmagnet
14 Polschuh
15 Kühlring, -körper
16 Kühlkanal
17 Schraube
18 Kühlwasseranschluß
19 Kühlwasseranschluß
20 Hohlschraube (Polschuh)
21 Hülse
22 Kühlkopf
23 Kühlwasserzuführung
24 Kühlwasserrückführung
25 Schraube
26 Mittelanode
27 Substrat
28 Nut
29 Ausnehmung
30 Kammeroberfläche
31 Unterseite
32 Klemmring
33 Anodenring
34 Kontaktfläche
35 Öffnung
36 Ausnehmung
37 Magnetfeldlinien
38 Kathode
39, 39′ Anode
40 Kühlring
41 Joch
42 Kühlplatte
43 Target
44 Ringmagnet
45 Polschuh
45a Mantelfläche
46 Distanzring
46a Mantelfläche
47 Isolator
48 Kabel
49 Kühlkopf
50 Isolator
51 Hohlschraube
52 Targetvorderseite
53 Linie
X Detail
A Abstand
d Dunkelraumabstand
D1 Dicke
D2 Dicke
a Abstand
b Abstand
c Abstand
Claims (19)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4345403A DE4345403C2 (de) | 1993-05-06 | 1993-05-06 | Vorrichtung zur Kathodenzerstäubung |
DE19934315023 DE4315023C2 (de) | 1993-05-06 | 1993-05-06 | Vorrichtung zur Kathodenzerstäubung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19934315023 DE4315023C2 (de) | 1993-05-06 | 1993-05-06 | Vorrichtung zur Kathodenzerstäubung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE4315023A1 DE4315023A1 (de) | 1994-11-10 |
DE4315023C2 true DE4315023C2 (de) | 1997-05-28 |
Family
ID=6487350
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4345403A Expired - Fee Related DE4345403C2 (de) | 1993-05-06 | 1993-05-06 | Vorrichtung zur Kathodenzerstäubung |
DE19934315023 Expired - Fee Related DE4315023C2 (de) | 1993-05-06 | 1993-05-06 | Vorrichtung zur Kathodenzerstäubung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4345403A Expired - Fee Related DE4345403C2 (de) | 1993-05-06 | 1993-05-06 | Vorrichtung zur Kathodenzerstäubung |
Country Status (1)
Country | Link |
---|---|
DE (2) | DE4345403C2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0676791B1 (de) * | 1994-04-07 | 1995-11-15 | Balzers Aktiengesellschaft | Magnetronzerstäubungsquelle und deren Verwendung |
DE19614600C1 (de) | 1996-04-13 | 1997-04-24 | Singulus Technologies Gmbh | Vorrichtung zum Maskieren und Abdecken von Substraten |
DE19614598A1 (de) * | 1996-04-13 | 1997-10-16 | Singulus Technologies Gmbh | Vorrichtung zur Kathodenzerstäubung |
US5863399A (en) * | 1996-04-13 | 1999-01-26 | Singulus Technologies Gmbh | Device for cathode sputtering |
DE19643098C1 (de) * | 1996-10-19 | 1997-10-30 | Singulus Technologies Gmbh | Vorrichtung zur Kathodenzerstäubung |
DE19653999C1 (de) * | 1996-12-21 | 1998-01-22 | Singulus Technologies Gmbh | Vorrichtung zur Kathodenzerstäubung |
DE19654007A1 (de) * | 1996-12-21 | 1998-06-25 | Singulus Technologies Ag | Vorrichtung zur Kathodenzerstäubung |
EP0946966B1 (de) | 1996-12-21 | 2005-05-11 | Singulus Technologies AG | Vorrichtung zur kathodenzerstäubung |
DE19916941A1 (de) * | 1999-04-15 | 2000-10-19 | Leybold Systems Gmbh | Kühlfinger für eine Vorrichtung zur Kathodenzerstäubung |
US6264804B1 (en) | 2000-04-12 | 2001-07-24 | Ske Technology Corp. | System and method for handling and masking a substrate in a sputter deposition system |
DE10234859B4 (de) * | 2002-07-31 | 2007-05-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Einrichtung und Verfahren zum Beschichten von Substraten |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE711401C (de) * | 1938-03-25 | 1941-10-01 | Bernhard Berghaus | Anordnung zur Abdichtung metallischer Vakuumgefaesse, insbesondere Kathodenzerstaeubungsapparate |
US4060470A (en) * | 1974-12-06 | 1977-11-29 | Clarke Peter J | Sputtering apparatus and method |
US4100055A (en) * | 1977-06-10 | 1978-07-11 | Varian Associates, Inc. | Target profile for sputtering apparatus |
DE9217937U1 (de) * | 1992-01-29 | 1993-04-01 | Leybold AG, 6450 Hanau | Vorrichtung zur Kathodenzerstäubung |
-
1993
- 1993-05-06 DE DE4345403A patent/DE4345403C2/de not_active Expired - Fee Related
- 1993-05-06 DE DE19934315023 patent/DE4315023C2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE4345403C2 (de) | 1997-11-20 |
DE4315023A1 (de) | 1994-11-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8110 | Request for examination paragraph 44 | ||
8127 | New person/name/address of the applicant |
Owner name: BALZERS UND LEYBOLD DEUTSCHLAND HOLDING AG, 63450 |
|
8172 | Supplementary division/partition in: |
Ref country code: DE Ref document number: 4345403 Format of ref document f/p: P |
|
Q171 | Divided out to: |
Ref country code: DE Ref document number: 4345403 |
|
AH | Division in |
Ref country code: DE Ref document number: 4345403 Format of ref document f/p: P |
|
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
AH | Division in |
Ref country code: DE Ref document number: 4345403 Format of ref document f/p: P |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: UNAXIS DEUTSCHLAND HOLDING GMBH, 63450 HANAU, DE |
|
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20121201 |