DE4113262A1 - Verfahren zum aufbringen einer basiskupferschicht auf einem substrat aus aluminiumoxid-keramik und verfahren zur herstellung sehr feiner leiterbahnstrukturen darauf - Google Patents
Verfahren zum aufbringen einer basiskupferschicht auf einem substrat aus aluminiumoxid-keramik und verfahren zur herstellung sehr feiner leiterbahnstrukturen daraufInfo
- Publication number
- DE4113262A1 DE4113262A1 DE19914113262 DE4113262A DE4113262A1 DE 4113262 A1 DE4113262 A1 DE 4113262A1 DE 19914113262 DE19914113262 DE 19914113262 DE 4113262 A DE4113262 A DE 4113262A DE 4113262 A1 DE4113262 A1 DE 4113262A1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- copper layer
- rinsing
- copper
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 239000010949 copper Substances 0.000 title claims abstract description 55
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 53
- 239000011224 oxide ceramic Substances 0.000 title claims abstract 3
- 229910052574 oxide ceramic Inorganic materials 0.000 title claims abstract 3
- 238000000034 method Methods 0.000 title claims description 37
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 title claims 2
- 238000004519 manufacturing process Methods 0.000 title description 3
- 239000003054 catalyst Substances 0.000 claims abstract description 11
- 238000004140 cleaning Methods 0.000 claims abstract description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 11
- 239000000126 substance Substances 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000011261 inert gas Substances 0.000 claims abstract description 4
- 239000000084 colloidal system Substances 0.000 claims abstract description 3
- 238000000137 annealing Methods 0.000 claims abstract 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229920002120 photoresistant polymer Polymers 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000000206 photolithography Methods 0.000 claims description 4
- 238000005554 pickling Methods 0.000 claims description 4
- 239000012298 atmosphere Substances 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 2
- 238000009835 boiling Methods 0.000 claims description 2
- 239000012459 cleaning agent Substances 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 239000006260 foam Substances 0.000 claims description 2
- 239000008098 formaldehyde solution Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 1
- 239000011253 protective coating Substances 0.000 claims 1
- 239000012629 purifying agent Substances 0.000 abstract 1
- 238000009991 scouring Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 38
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 14
- 229910052763 palladium Inorganic materials 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000005234 chemical deposition Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 241001026509 Kata Species 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000035784 germination Effects 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19914113262 DE4113262A1 (de) | 1991-04-23 | 1991-04-23 | Verfahren zum aufbringen einer basiskupferschicht auf einem substrat aus aluminiumoxid-keramik und verfahren zur herstellung sehr feiner leiterbahnstrukturen darauf |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19914113262 DE4113262A1 (de) | 1991-04-23 | 1991-04-23 | Verfahren zum aufbringen einer basiskupferschicht auf einem substrat aus aluminiumoxid-keramik und verfahren zur herstellung sehr feiner leiterbahnstrukturen darauf |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE4113262A1 true DE4113262A1 (de) | 1992-10-29 |
| DE4113262C2 DE4113262C2 (enrdf_load_stackoverflow) | 1993-07-15 |
Family
ID=6430190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19914113262 Granted DE4113262A1 (de) | 1991-04-23 | 1991-04-23 | Verfahren zum aufbringen einer basiskupferschicht auf einem substrat aus aluminiumoxid-keramik und verfahren zur herstellung sehr feiner leiterbahnstrukturen darauf |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE4113262A1 (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7980000B2 (en) * | 2006-12-29 | 2011-07-19 | Applied Materials, Inc. | Vapor dryer having hydrophilic end effector |
| WO2011129720A1 (ru) * | 2010-04-15 | 2011-10-20 | Zaligin Yury Removich | Тонкослойное керамическое покрытие и поверхность трения на его основе |
| CN114031424A (zh) * | 2021-12-15 | 2022-02-11 | 大富科技(安徽)股份有限公司 | 微波介质陶瓷材料的表面金属化方法、微波介质陶瓷器件 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3993799A (en) * | 1974-10-04 | 1976-11-23 | Surface Technology, Inc. | Electroless plating process employing non-noble metal hydrous oxide catalyst |
| US4327125A (en) * | 1974-10-04 | 1982-04-27 | Nathan Feldstein | Colloidal compositions for electroless deposition comprising colloidal copper-stannic oxide product |
| DE3523956A1 (de) * | 1985-07-04 | 1987-01-08 | Licentia Gmbh | Verfahren zur chemischen metallisierung eines elektrisch schlecht leitenden traegerkoerpers aus einem anorganischen material |
| US4842899A (en) * | 1987-03-31 | 1989-06-27 | Hitachi Chemical Co., Ltd. | Process for forming metallic film on inorganic material |
-
1991
- 1991-04-23 DE DE19914113262 patent/DE4113262A1/de active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3993799A (en) * | 1974-10-04 | 1976-11-23 | Surface Technology, Inc. | Electroless plating process employing non-noble metal hydrous oxide catalyst |
| US4327125A (en) * | 1974-10-04 | 1982-04-27 | Nathan Feldstein | Colloidal compositions for electroless deposition comprising colloidal copper-stannic oxide product |
| DE3523956A1 (de) * | 1985-07-04 | 1987-01-08 | Licentia Gmbh | Verfahren zur chemischen metallisierung eines elektrisch schlecht leitenden traegerkoerpers aus einem anorganischen material |
| US4842899A (en) * | 1987-03-31 | 1989-06-27 | Hitachi Chemical Co., Ltd. | Process for forming metallic film on inorganic material |
Non-Patent Citations (1)
| Title |
|---|
| RONAL, Lea: Techn.Bull., Nr. 803/803, 21.04.82, Nr. 9 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7980000B2 (en) * | 2006-12-29 | 2011-07-19 | Applied Materials, Inc. | Vapor dryer having hydrophilic end effector |
| US8205352B2 (en) | 2006-12-29 | 2012-06-26 | Applied Materials, Inc. | Vapor dryer having hydrophilic end effector |
| WO2011129720A1 (ru) * | 2010-04-15 | 2011-10-20 | Zaligin Yury Removich | Тонкослойное керамическое покрытие и поверхность трения на его основе |
| RU2453640C2 (ru) * | 2010-04-15 | 2012-06-20 | Юрий Рэмович Залыгин | Тонкослойное керамическое покрытие, способ его получения, поверхность трения на основе тонкослойного керамического покрытия и способ ее получения |
| CN114031424A (zh) * | 2021-12-15 | 2022-02-11 | 大富科技(安徽)股份有限公司 | 微波介质陶瓷材料的表面金属化方法、微波介质陶瓷器件 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4113262C2 (enrdf_load_stackoverflow) | 1993-07-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3002166C2 (enrdf_load_stackoverflow) | ||
| DE69829018T2 (de) | Substrat und Verfahren zu dessen Herstellung | |
| DE3782649T2 (de) | Verfahren zur selektiven metallisierung, additive methode zur herstellung gedruckter traeger von schaltkreisen und dabei verwendete materialmischung. | |
| DE3872852T2 (de) | Verfahren zur beschichtung von kupferleiterbahnen auf polyimide. | |
| DE2105845C3 (de) | Verfahren zur Vorbehandlung von polymerisierten Kunstharzträgern | |
| DE797690T1 (de) | Herstellung von gedruckten schaltungen | |
| DE1808161A1 (de) | Verfahren zum Aufbringen eines gedruckten Leitungsmusters auf ein elektrisch isolierendes Substrat | |
| DE3016132C2 (de) | Verfahren zur Herstellung von gegen Hitzeschockeinwirkung widerstandsfähigen gedruckten Schaltungen | |
| DE3110415C2 (de) | Verfahren zum Herstellen von Leiterplatten | |
| DE2847070C2 (de) | Verfahren zur Behandlung von Multilayer-Innenlagen mit additiv aufplattierten Leiterzügen | |
| DE69824133T2 (de) | Verfahren zur Herstellung von mehrschichtigen Leiterplatten | |
| DE4231535C2 (de) | Verfahren zur Erzeugung eines leitenden Schaltungsmusters | |
| DE19642922C2 (de) | Aktivierende katalytische Lösung zur stromlosen Metallisierung und Verfahren zur Vorbereitung eines Substrats zur stromlosen Metallisierung | |
| DE4113262C2 (enrdf_load_stackoverflow) | ||
| DE69800056T2 (de) | Aktivierende katalytische Lösung für stromlose Metallisierung und Verfahren für stromlose Metallisierung | |
| DE4113261C2 (enrdf_load_stackoverflow) | ||
| DE2307222C2 (de) | Verfahren zum direkten Metallisieren freiliegender Flächen | |
| DE4113263A1 (de) | Verfahren zur ganzflaechigen, stromlosen beschichtung von kleinen formteilen aus keramischem material | |
| DE1496551A1 (de) | Verfahren zur Metallisierung und Aktivierung von Nichtleitern | |
| DE2310736A1 (de) | Verfahren zum ausbessern defekter metallmuster | |
| DE2854403C2 (de) | Verfahren zur Reaktivierung und Weiterbeschichtung von Nickel- oder Nickel- Phosphor-Schichten | |
| DE3732510C1 (en) | Process for producing strongly adhering nickel layers on glass or ceramic | |
| DE3021896A1 (de) | Verfahren zur herstellung von gedruckten schaltungen | |
| DE4013094C2 (enrdf_load_stackoverflow) | ||
| DE3048665C2 (enrdf_load_stackoverflow) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |