DE3936613A1 - Mehrfach verschliessbarers hybridschaltkreisgehaeuse - Google Patents

Mehrfach verschliessbarers hybridschaltkreisgehaeuse

Info

Publication number
DE3936613A1
DE3936613A1 DE3936613A DE3936613A DE3936613A1 DE 3936613 A1 DE3936613 A1 DE 3936613A1 DE 3936613 A DE3936613 A DE 3936613A DE 3936613 A DE3936613 A DE 3936613A DE 3936613 A1 DE3936613 A1 DE 3936613A1
Authority
DE
Germany
Prior art keywords
wall
housing
hybrid circuit
support shoulder
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3936613A
Other languages
German (de)
English (en)
Other versions
DE3936613C2 (enrdf_load_stackoverflow
Inventor
Karl Heinz Dipl Ing Meislitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technotron & Co KG GmbH
Original Assignee
Technotron & Co KG GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technotron & Co KG GmbH filed Critical Technotron & Co KG GmbH
Priority to DE3936613A priority Critical patent/DE3936613A1/de
Priority to DE9010159U priority patent/DE9010159U1/de
Publication of DE3936613A1 publication Critical patent/DE3936613A1/de
Application granted granted Critical
Publication of DE3936613C2 publication Critical patent/DE3936613C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
DE3936613A 1989-11-03 1989-11-03 Mehrfach verschliessbarers hybridschaltkreisgehaeuse Granted DE3936613A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE3936613A DE3936613A1 (de) 1989-11-03 1989-11-03 Mehrfach verschliessbarers hybridschaltkreisgehaeuse
DE9010159U DE9010159U1 (de) 1989-11-03 1990-07-04 Mehrfach verschließbares Hybridschaltkreisgehäuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3936613A DE3936613A1 (de) 1989-11-03 1989-11-03 Mehrfach verschliessbarers hybridschaltkreisgehaeuse

Publications (2)

Publication Number Publication Date
DE3936613A1 true DE3936613A1 (de) 1991-05-08
DE3936613C2 DE3936613C2 (enrdf_load_stackoverflow) 1992-09-17

Family

ID=6392794

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3936613A Granted DE3936613A1 (de) 1989-11-03 1989-11-03 Mehrfach verschliessbarers hybridschaltkreisgehaeuse

Country Status (1)

Country Link
DE (1) DE3936613A1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19806722A1 (de) * 1998-02-18 1999-08-19 Itt Mfg Enterprises Inc Sensor
US6091146A (en) * 1997-12-09 2000-07-18 Trw Inc. Ceramic lid for large multi-chip modules

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2568518A (en) * 1947-08-15 1951-09-18 Ohio Brass Co Gasproof receptacle
DE2824426C2 (de) * 1978-06-03 1982-09-02 Schott Glaswerke, 6500 Mainz Gehäuse zur Kapselung von elektrischen und/oder elektronischen Bauelementen
DE3527818A1 (de) * 1985-08-02 1987-02-26 Rose Elektrotech Gmbh Gehaeuse fuer einen hybridschaltkreis

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2568518A (en) * 1947-08-15 1951-09-18 Ohio Brass Co Gasproof receptacle
DE2824426C2 (de) * 1978-06-03 1982-09-02 Schott Glaswerke, 6500 Mainz Gehäuse zur Kapselung von elektrischen und/oder elektronischen Bauelementen
DE3527818A1 (de) * 1985-08-02 1987-02-26 Rose Elektrotech Gmbh Gehaeuse fuer einen hybridschaltkreis

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6091146A (en) * 1997-12-09 2000-07-18 Trw Inc. Ceramic lid for large multi-chip modules
DE19806722A1 (de) * 1998-02-18 1999-08-19 Itt Mfg Enterprises Inc Sensor

Also Published As

Publication number Publication date
DE3936613C2 (enrdf_load_stackoverflow) 1992-09-17

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee