DE3913066C2 - - Google Patents

Info

Publication number
DE3913066C2
DE3913066C2 DE3913066A DE3913066A DE3913066C2 DE 3913066 C2 DE3913066 C2 DE 3913066C2 DE 3913066 A DE3913066 A DE 3913066A DE 3913066 A DE3913066 A DE 3913066A DE 3913066 C2 DE3913066 C2 DE 3913066C2
Authority
DE
Germany
Prior art keywords
base plate
conductor tracks
cover cap
housing
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3913066A
Other languages
German (de)
English (en)
Other versions
DE3913066A1 (de
Inventor
Horst 4971 Huellhorst De Obermeier
Gerhard 3258 Aerzen De Brockmann
Edmund 4955 Hille De Freitag
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schoppe & Faeser 4950 Minden De GmbH
Original Assignee
Schoppe & Faeser 4950 Minden De GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoppe & Faeser 4950 Minden De GmbH filed Critical Schoppe & Faeser 4950 Minden De GmbH
Priority to DE3913066A priority Critical patent/DE3913066A1/de
Publication of DE3913066A1 publication Critical patent/DE3913066A1/de
Application granted granted Critical
Publication of DE3913066C2 publication Critical patent/DE3913066C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H10W76/48—
    • H10W95/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H10W72/5445—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
DE3913066A 1989-04-21 1989-04-21 Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse Granted DE3913066A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3913066A DE3913066A1 (de) 1989-04-21 1989-04-21 Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3913066A DE3913066A1 (de) 1989-04-21 1989-04-21 Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse

Publications (2)

Publication Number Publication Date
DE3913066A1 DE3913066A1 (de) 1990-11-08
DE3913066C2 true DE3913066C2 (enExample) 1992-09-03

Family

ID=6379103

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3913066A Granted DE3913066A1 (de) 1989-04-21 1989-04-21 Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse

Country Status (1)

Country Link
DE (1) DE3913066A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4102265A1 (de) * 1991-01-26 1992-07-30 Telefunken Electronic Gmbh Gehaeuse kfz-elektronik
WO1998049878A1 (en) * 1997-04-25 1998-11-05 Koninklijke Philips Electronics N.V. Method of manufacturing enveloped electric, electronic or electromechanical components of small dimensions
IT1317981B1 (it) * 2000-06-16 2003-07-21 Getters Spa Dispositivi assorbitori di umidita' per amplificatori laser e processo per la loro produzione.
ITMI20011092A1 (it) * 2001-05-23 2002-11-24 Getters Spa Sistema precursore di dispositivi assorbitori di acqua per schermi org anici elettroluminescenti, processo per la sua produzione e metodo d'u so
ITMI20021201A1 (it) * 2002-06-03 2003-12-03 Getters Spa Assemblato comprendente almeno un supporto con deposito di materiale getter per l'uso in schermi organi elettroluminescenti
US7211881B2 (en) * 2004-03-24 2007-05-01 Hewlett-Packard Development Company, L.P. Structure for containing desiccant
DE102006049592A1 (de) 2006-10-20 2008-04-30 Conti Temic Microelectronic Gmbh Steuergerät für ein Kraftfahrzeug
DE102008017553B4 (de) * 2008-04-07 2012-12-13 Siemens Aktiengesellschaft Elektronisches System
DE102011056742B4 (de) 2011-05-09 2019-07-18 Conti Temic Microelectronic Gmbh Steuergerät mit einer Getterschicht in einem Kraftfahrzeug
US10345165B2 (en) 2016-09-08 2019-07-09 Covidien Lp Force sensor for surgical devices
US10973142B2 (en) 2017-05-18 2021-04-06 Covidien Lp Hermetically sealed printed circuit boards
US10588231B2 (en) 2017-05-18 2020-03-10 Covidien Lp Hermetically sealed printed circuit boards
US10667408B2 (en) 2017-05-18 2020-05-26 Covidien Lp Fully encapsulated electronics and printed circuit boards

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD135026A1 (de) * 1978-03-16 1979-04-04 Herbert Bartuch Verfahren zum hermetischen verschluss von bauelementegehaeusen der elektronik
DE3442132A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zur verkapselung von mikroelektronikschaltungen mit organischen komponenten

Also Published As

Publication number Publication date
DE3913066A1 (de) 1990-11-08

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8120 Willingness to grant licences paragraph 23
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee