DE3889763D1 - Siebdruckverfahren für die Herstellung von Leiterbahnen einheitlicher Breite und Höhe. - Google Patents

Siebdruckverfahren für die Herstellung von Leiterbahnen einheitlicher Breite und Höhe.

Info

Publication number
DE3889763D1
DE3889763D1 DE3889763T DE3889763T DE3889763D1 DE 3889763 D1 DE3889763 D1 DE 3889763D1 DE 3889763 T DE3889763 T DE 3889763T DE 3889763 T DE3889763 T DE 3889763T DE 3889763 D1 DE3889763 D1 DE 3889763D1
Authority
DE
Germany
Prior art keywords
height
production
screen printing
printing process
conductor tracks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3889763T
Other languages
English (en)
Other versions
DE3889763T2 (de
Inventor
Michael Edward Cropp
Prado Phillip De
Kamalesh Suryakant Desai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE3889763D1 publication Critical patent/DE3889763D1/de
Application granted granted Critical
Publication of DE3889763T2 publication Critical patent/DE3889763T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Screen Printers (AREA)
  • Printing Methods (AREA)
  • Printing Plates And Materials Therefor (AREA)
DE3889763T 1987-04-06 1988-03-11 Siebdruckverfahren für die Herstellung von Leiterbahnen einheitlicher Breite und Höhe. Expired - Fee Related DE3889763T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/034,972 US4808435A (en) 1987-04-06 1987-04-06 Screen printing method for producing lines of uniform width and height

Publications (2)

Publication Number Publication Date
DE3889763D1 true DE3889763D1 (de) 1994-07-07
DE3889763T2 DE3889763T2 (de) 1994-12-08

Family

ID=21879817

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3889763T Expired - Fee Related DE3889763T2 (de) 1987-04-06 1988-03-11 Siebdruckverfahren für die Herstellung von Leiterbahnen einheitlicher Breite und Höhe.

Country Status (4)

Country Link
US (1) US4808435A (de)
EP (1) EP0285850B1 (de)
JP (1) JPH069297B2 (de)
DE (1) DE3889763T2 (de)

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* Cited by examiner, † Cited by third party
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JPH01319990A (ja) * 1988-06-22 1989-12-26 Sumitomo Electric Ind Ltd 厚膜形成方法
JPH0471293A (ja) * 1990-07-11 1992-03-05 Cmk Corp プリント配線板におけるスルーホール等への導電性物質等の充填方法
JPH0494593A (ja) * 1990-08-10 1992-03-26 Cmk Corp プリント配線板におけるスルーホールの形成方法
US5955119A (en) * 1990-12-21 1999-09-21 International Business Machines Corporation Carbide rod screening nozzles
US5167976A (en) * 1991-05-24 1992-12-01 Papetti's Hygrade Egg Products Inc. Method of producing extended refrigerated shelf life bakeable liquid egg
US5174201A (en) * 1991-06-07 1992-12-29 International Business Machines Corporation Thick film mask separation detection system
EP0565151A3 (en) * 1992-04-09 1993-11-24 Ibm Manufacture of multi-layer ceramic interconnect structures
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
US6045714A (en) * 1998-04-01 2000-04-04 International Business Machines Corporation Method for forming flat surface vias in integrated circuit substrates
US6259408B1 (en) 1999-11-19 2001-07-10 Intermec Ip Corp. RFID transponders with paste antennas and flip-chip attachment
WO2005081970A2 (en) 2004-02-24 2005-09-09 The Curators Of The University Of Missouri Self-assembling cell aggregates and methods of making engineered tissue using the same
KR20170020942A (ko) 2008-06-24 2017-02-24 더 큐레이터스 오브 더 유니버시티 오브 미주리 자가-조립가능 다세포체 및 이들을 이용하여 3차원 생물학적 구조체를 생산하는 방법
DK2629975T3 (da) * 2010-10-21 2022-05-09 Organovo Inc Anordninger til fremstilling af væv
US9499779B2 (en) 2012-04-20 2016-11-22 Organovo, Inc. Devices, systems, and methods for the fabrication of tissue utilizing UV cross-linking
US9442105B2 (en) 2013-03-15 2016-09-13 Organovo, Inc. Engineered liver tissues, arrays thereof, and methods of making the same
CA2919734C (en) 2013-07-31 2023-04-25 Organovo, Inc. Automated devices, systems, and methods for the fabrication of tissue
JP6243449B2 (ja) * 2013-12-18 2017-12-06 富士機械製造株式会社 はんだ供給装置
CN103770457B (zh) * 2014-01-06 2016-03-02 弘益泰克自动化设备（惠州）有限公司 泵式刮刀头配套装置
JP6194481B2 (ja) * 2014-03-17 2017-09-13 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及びスクリーン印刷方法
JP6101937B2 (ja) * 2014-03-17 2017-03-29 パナソニックＩｐマネジメント株式会社 ペースト供給装置及びスクリーン印刷装置
JP6101938B2 (ja) * 2014-03-17 2017-03-29 パナソニックＩｐマネジメント株式会社 ペースト供給装置及びスクリーン印刷装置
JP6167336B2 (ja) * 2014-03-19 2017-07-26 パナソニックＩｐマネジメント株式会社 ペースト供給装置、スクリーン印刷装置、ペースト供給方法及びスクリーン印刷方法
CA3177480A1 (en) 2014-04-04 2015-10-08 Organovo, Inc. Engineered three-dimensional breast tissue, adipose tissue, and tumor disease model
KR20170064547A (ko) 2014-10-06 2017-06-09 오가노보, 인크. 조작된 신장 조직, 이의 어레이, 및 이를 제조하는 방법
WO2016073782A1 (en) 2014-11-05 2016-05-12 Organovo, Inc. Engineered three-dimensional skin tissues, arrays thereof, and methods of making the same
CN114686884B (zh) * 2020-12-29 2023-07-07 苏州运宏电子有限公司 一种精密防侧蚀的蚀刻区域控制方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3416440A (en) * 1966-03-18 1968-12-17 Ibm Apparatus for screen printing
US3384931A (en) * 1966-06-24 1968-05-28 Ibm Injection printing of electrical circuit components
US3712825A (en) * 1970-12-07 1973-01-23 T Yocum Method of making simulated masonry wall
US4068994A (en) * 1976-11-11 1978-01-17 International Business Machines Corporation Apparatus for the printing of ceramic green sheets
US4242401A (en) * 1978-01-24 1980-12-30 Mitani Electronics Industry Corp. Screen-printing mask
US4327124A (en) * 1978-07-28 1982-04-27 Desmarais Jr Raymond C Method for manufacturing printed circuits comprising printing conductive ink on dielectric surface
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4291642A (en) * 1979-12-26 1981-09-29 Rca Corporation Nozzle for dispensing viscous fluid
JPS57132393A (en) * 1981-02-09 1982-08-16 Tokyo Shibaura Electric Co Method of producing electric circuit board
US4382430A (en) * 1981-06-01 1983-05-10 Shinichiro Iwasaki Ignition system
JPS5893107A (ja) * 1981-11-25 1983-06-02 アルプス電気株式会社 透明導電性被膜形成用ペ−スト
JPS5968291A (ja) * 1982-10-14 1984-04-18 Matsushita Electric Ind Co Ltd スクリ−ン印刷方法
US4604298A (en) * 1985-02-12 1986-08-05 Gulton Industries, Inc. Finger line screen printing method and apparatus
US4659406A (en) * 1985-04-22 1987-04-21 International Business Machines Corporation Method of bonding to ceramic and glass

Also Published As

Publication number Publication date
EP0285850A2 (de) 1988-10-12
EP0285850A3 (en) 1990-07-11
JPH069297B2 (ja) 1994-02-02
JPS63261890A (ja) 1988-10-28
EP0285850B1 (de) 1994-06-01
US4808435A (en) 1989-02-28
DE3889763T2 (de) 1994-12-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee