DE3883332D1 - Voraetzbehandlung eines plastiksubstrats. - Google Patents

Voraetzbehandlung eines plastiksubstrats.

Info

Publication number
DE3883332D1
DE3883332D1 DE8888308797T DE3883332T DE3883332D1 DE 3883332 D1 DE3883332 D1 DE 3883332D1 DE 8888308797 T DE8888308797 T DE 8888308797T DE 3883332 T DE3883332 T DE 3883332T DE 3883332 D1 DE3883332 D1 DE 3883332D1
Authority
DE
Germany
Prior art keywords
plastic substrate
prior treatment
treatment
prior
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8888308797T
Other languages
English (en)
Other versions
DE3883332T2 (de
Inventor
Barry Sydney James
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Engelhard Technologies Ltd
Original Assignee
Engelhard Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB878722643A external-priority patent/GB8722643D0/en
Priority claimed from GB878730038A external-priority patent/GB8730038D0/en
Application filed by Engelhard Technologies Ltd filed Critical Engelhard Technologies Ltd
Publication of DE3883332D1 publication Critical patent/DE3883332D1/de
Application granted granted Critical
Publication of DE3883332T2 publication Critical patent/DE3883332T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
DE19883883332 1987-09-25 1988-09-22 Vorätzbehandlung eines Plastiksubstrats. Expired - Lifetime DE3883332T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB878722643A GB8722643D0 (en) 1987-09-25 1987-09-25 Pre-etch conditioning of plastics substrate
GB878730038A GB8730038D0 (en) 1987-12-23 1987-12-23 Pre-etch conditioning of plastics substrate

Publications (2)

Publication Number Publication Date
DE3883332D1 true DE3883332D1 (de) 1993-09-23
DE3883332T2 DE3883332T2 (de) 1994-03-17

Family

ID=26292784

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19883883332 Expired - Lifetime DE3883332T2 (de) 1987-09-25 1988-09-22 Vorätzbehandlung eines Plastiksubstrats.

Country Status (4)

Country Link
EP (1) EP0309243B1 (de)
JP (1) JP2965569B2 (de)
CA (1) CA1335703C (de)
DE (1) DE3883332T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775557A (en) * 1987-11-09 1988-10-04 Enthone, Incorporated Composition and process for conditioning the surface of polycarbonate resins prior to metal plating
US5015329A (en) * 1988-11-07 1991-05-14 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
US5049230A (en) * 1988-11-07 1991-09-17 Jp Laboratories, Inc. Single step pre-swelling and etching of plastics for plating
US4941940A (en) * 1988-11-07 1990-07-17 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
JPH03115584A (ja) * 1989-09-28 1991-05-16 Okuno Seiyaku Kogyo Kk ポリカーボネート樹脂へのめっき方法
DE4221948C1 (de) * 1992-07-02 1993-10-21 Schering Ag Verfahren zur Metallisierung von Kunststoffen und Verwendung
EP2639332A1 (de) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
JP6367606B2 (ja) * 2013-09-09 2018-08-01 上村工業株式会社 無電解めっき用前処理剤、並びに前記無電解めっき用前処理剤を用いたプリント配線基板の前処理方法およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125649A (en) * 1975-05-27 1978-11-14 Crown City Plating Pre-etch conditioning of polysulfone and other polymers for electroless plating
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
JPS575855A (en) * 1980-06-12 1982-01-12 Kakihara Kogyo Kk Formation of metal film onto electric unconductive resin
JPS58189365A (ja) * 1982-04-28 1983-11-05 Okuno Seiyaku Kogyo Kk 化学メッキ用アンダーコート組成物
JPS61252691A (ja) * 1985-05-02 1986-11-10 キヤノン株式会社 プリント配線板の製造方法
DE3708909A1 (de) * 1986-04-02 1987-10-15 Werner Dreisoerner Gmbh Entfettungs- und korrosionsschutzmittel

Also Published As

Publication number Publication date
JPH01123078A (ja) 1989-05-16
EP0309243B1 (de) 1993-08-18
EP0309243A1 (de) 1989-03-29
JP2965569B2 (ja) 1999-10-18
CA1335703C (en) 1995-05-30
DE3883332T2 (de) 1994-03-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition