DE3881378D1 - Verfahren zur herstellung einer elektrischen durchgangsverbindung unter verwendung eines loetbaren mechanischen halters. - Google Patents

Verfahren zur herstellung einer elektrischen durchgangsverbindung unter verwendung eines loetbaren mechanischen halters.

Info

Publication number
DE3881378D1
DE3881378D1 DE8888121895T DE3881378T DE3881378D1 DE 3881378 D1 DE3881378 D1 DE 3881378D1 DE 8888121895 T DE8888121895 T DE 8888121895T DE 3881378 T DE3881378 T DE 3881378T DE 3881378 D1 DE3881378 D1 DE 3881378D1
Authority
DE
Germany
Prior art keywords
solbable
producing
electrical
connection
mechanical holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888121895T
Other languages
English (en)
Other versions
DE3881378T2 (de
Inventor
James C Mackonic
Dawn Marie Lelko
Steven Almon Shugart
James K Koch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE3881378D1 publication Critical patent/DE3881378D1/de
Application granted granted Critical
Publication of DE3881378T2 publication Critical patent/DE3881378T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE88121895T 1988-02-25 1988-12-30 Verfahren zur Herstellung einer elektrischen Durchgangsverbindung unter Verwendung eines lötbaren mechanischen Halters. Expired - Fee Related DE3881378T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/160,390 US4881906A (en) 1988-02-25 1988-02-25 Method for obtaining electrical interconnect using a solderable mechanical fastener

Publications (2)

Publication Number Publication Date
DE3881378D1 true DE3881378D1 (de) 1993-07-01
DE3881378T2 DE3881378T2 (de) 1994-01-13

Family

ID=22576695

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88121895T Expired - Fee Related DE3881378T2 (de) 1988-02-25 1988-12-30 Verfahren zur Herstellung einer elektrischen Durchgangsverbindung unter Verwendung eines lötbaren mechanischen Halters.

Country Status (5)

Country Link
US (1) US4881906A (de)
EP (1) EP0331818B1 (de)
JP (1) JPH01253988A (de)
CA (1) CA1295426C (de)
DE (1) DE3881378T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0437087A (ja) * 1990-05-31 1992-02-07 Toshiba Corp 印刷配線板装置並びにその装置に用いるハトメ及びその取付け方法
JP2748768B2 (ja) * 1992-03-19 1998-05-13 株式会社日立製作所 薄膜多層配線基板およびその製造方法
JPH10500248A (ja) * 1994-05-10 1998-01-06 バーグ・テクノロジー・インコーポレーテッド 多連釣針状ホールドダウン
DE19900639C1 (de) * 1999-01-11 2000-06-08 Siemens Ag Elektrische Kontaktierungsverbindung und Steuergerät für ein Kraftfahrzeug mit einer elektrischen Kontaktierungsverbindung
DE10017774B4 (de) * 2000-04-10 2005-03-10 Epcos Ag Befestigungsplatte, Befestigungsanordnung mit der Befestigungsplatte und Verwendung der Befestigungsplatte
US6617520B1 (en) 2000-08-30 2003-09-09 Heatron, Inc. Circuit board
US9860975B2 (en) * 2014-01-30 2018-01-02 Hewlett Packard Enterprise Development Lp Thermal relief pad
CN108337817A (zh) * 2017-01-20 2018-07-27 台达电子工业股份有限公司 电子装置和连接方法
DE102017205360B3 (de) * 2017-03-29 2018-07-19 Te Connectivity Germany Gmbh Elektrisches Kontaktelement und Verfahren zur Herstellung einer hartgelöteten, elektrisch leitenden Verbindung mit einem Gegenkontakt mittels eines eingepressten Lotkörpers aus Hartlot
CN108966505A (zh) * 2018-08-28 2018-12-07 郑州云海信息技术有限公司 Pcb板安装过孔的方法
EP4250884A4 (de) * 2021-05-25 2024-07-31 Samsung Electronics Co Ltd Anzeigevorrichtung und herstellungsverfahren dafür

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3103547A (en) * 1963-09-10 ansley
US2756485A (en) * 1950-08-28 1956-07-31 Abramson Moe Process of assembling electrical circuits
US3061911A (en) * 1958-01-31 1962-11-06 Xerox Corp Method of making printed circuits
US3621116A (en) * 1969-12-29 1971-11-16 Bertram C Adams Printed circuit board
US3601750A (en) * 1970-02-09 1971-08-24 Berg Electronics Inc Circuit board connector
FR2184437A2 (de) * 1972-05-17 1973-12-28 Delaye Raymond
FR2205799B1 (de) * 1972-11-07 1975-11-28 Delaye Raymond
US3825999A (en) * 1972-12-26 1974-07-30 United Wiring And Mfg Co Inc Method of connecting electrical component
US4181385A (en) * 1978-03-30 1980-01-01 Motorola, Inc. Low profile socket for circuit board with gas vents for fixed position soldering
JPS5724775U (de) * 1980-07-17 1982-02-08

Also Published As

Publication number Publication date
EP0331818B1 (de) 1993-05-26
CA1295426C (en) 1992-02-04
EP0331818A1 (de) 1989-09-13
JPH01253988A (ja) 1989-10-11
US4881906A (en) 1989-11-21
DE3881378T2 (de) 1994-01-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee