DE3880234D1 - Ausrichten von glasfaser-arrays. - Google Patents

Ausrichten von glasfaser-arrays.

Info

Publication number
DE3880234D1
DE3880234D1 DE8888201696T DE3880234T DE3880234D1 DE 3880234 D1 DE3880234 D1 DE 3880234D1 DE 8888201696 T DE8888201696 T DE 8888201696T DE 3880234 T DE3880234 T DE 3880234T DE 3880234 D1 DE3880234 D1 DE 3880234D1
Authority
DE
Germany
Prior art keywords
fiber arrays
aligning fiber
aligning
arrays
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888201696T
Other languages
English (en)
Other versions
DE3880234T2 (de
Inventor
Fredrick Arthur Randle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
GEC Marconi Ltd
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Marconi Ltd, Marconi Co Ltd filed Critical GEC Marconi Ltd
Application granted granted Critical
Publication of DE3880234D1 publication Critical patent/DE3880234D1/de
Publication of DE3880234T2 publication Critical patent/DE3880234T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE8888201696T 1987-08-19 1988-08-08 Ausrichten von glasfaser-arrays. Expired - Fee Related DE3880234T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8719557A GB2208943B (en) 1987-08-19 1987-08-19 Alignment of fibre arrays

Publications (2)

Publication Number Publication Date
DE3880234D1 true DE3880234D1 (de) 1993-05-19
DE3880234T2 DE3880234T2 (de) 1993-09-16

Family

ID=10622478

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888201696T Expired - Fee Related DE3880234T2 (de) 1987-08-19 1988-08-08 Ausrichten von glasfaser-arrays.

Country Status (5)

Country Link
US (1) US4892377A (de)
EP (1) EP0304118B1 (de)
JP (1) JP2664214B2 (de)
DE (1) DE3880234T2 (de)
GB (1) GB2208943B (de)

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JPH024204A (ja) * 1988-06-21 1990-01-09 Hitachi Ltd 光・電子回路の実装方法
GB8827242D0 (en) * 1988-11-22 1988-12-29 Plessey Co Plc Optical coupling of optical fibres & optical devices
JPH03141308A (ja) * 1989-07-17 1991-06-17 Nippon Telegr & Teleph Corp <Ntt> 受光モジュールおよびその製造方法
US5046809A (en) * 1989-09-29 1991-09-10 Siemens Aktiengesellschaft Coupling arrangement for optically coupling a fiber to a planar optical waveguide integrated on a substrate
US5130660A (en) * 1991-04-02 1992-07-14 International Business Machines Corporation Miniature electronic device aligner using capacitance techniques
US5155786A (en) * 1991-04-29 1992-10-13 International Business Machines Corporation Apparatus and a method for an optical fiber interface
US5241614A (en) * 1991-04-29 1993-08-31 International Business Machines Corporation Apparatus and a method for an optical fiber interface
CA2077161A1 (en) * 1991-09-13 1993-03-14 Thomas W. Fitzgerald Method of establishing soldered connections
JPH0688917A (ja) * 1991-11-07 1994-03-29 Nec Corp 光導波路素子と光ファイバ端末との接続方法
JP2976642B2 (ja) * 1991-11-07 1999-11-10 日本電気株式会社 光結合回路
JPH07503328A (ja) * 1992-01-28 1995-04-06 ブリテイッシュ・テレコミュニケーションズ・パブリック・リミテッド・カンパニー 集積された光学部品の整列
EP0562211A1 (de) * 1992-03-25 1993-09-29 International Business Machines Corporation Selbstausrichtende Faserkoppler
KR100225026B1 (ko) * 1993-03-31 1999-10-15 구라우치 노리타카 광파이버어레이
US5499312A (en) * 1993-11-09 1996-03-12 Hewlett-Packard Company Passive alignment and packaging of optoelectronic components to optical waveguides using flip-chip bonding technology
KR0155508B1 (ko) * 1994-11-30 1998-10-15 정선종 자기 정렬된 광섬유-광소자 결합장치의 제조방법
JP2655112B2 (ja) * 1994-12-22 1997-09-17 日本電気株式会社 光モジュールの実装方法および構造
DE69618035T2 (de) * 1995-06-30 2002-07-11 Whitaker Corp Vorrichtung zur ausrichtung eines optoelektronischen bauteils
JPH09138325A (ja) * 1995-11-13 1997-05-27 Nec Corp 光ファイバ実装構造とその製造方法
US5768457A (en) * 1995-11-30 1998-06-16 Lucent Technologies Inc. Multilayered connector pads for supporting butt-joined optical arrays
JP3792358B2 (ja) * 1997-07-30 2006-07-05 京セラ株式会社 光接続部品及びその製造方法
US6085007A (en) * 1998-02-27 2000-07-04 Jiang; Ching-Long Passive alignment member for vertical surface emitting/detecting device
US5981975A (en) * 1998-02-27 1999-11-09 The Whitaker Corporation On-chip alignment fiducials for surface emitting devices
US6174092B1 (en) 1999-01-11 2001-01-16 Oesys Photonics, Inc. Method and apparatus for coupling an optical fiber to an optoelectronic device
EP1094355A1 (de) * 1999-10-19 2001-04-25 Corning Incorporated Elektrischer Anschluss von planaren Lichtwellenschaltungen
GB2356463B (en) * 1999-11-16 2003-06-25 Marconi Electronic Syst Ltd Method of alignment in an optoelectronic assembly
US6546173B2 (en) * 2001-02-20 2003-04-08 Avanti Optics Corporation Optical module
US6546172B2 (en) * 2001-02-20 2003-04-08 Avanti Optics Corporation Optical device
US6443631B1 (en) 2001-02-20 2002-09-03 Avanti Optics Corporation Optical module with solder bond
US20040212802A1 (en) * 2001-02-20 2004-10-28 Case Steven K. Optical device with alignment compensation
US6956999B2 (en) 2001-02-20 2005-10-18 Cyberoptics Corporation Optical device
GB2374157B (en) * 2001-04-06 2003-06-25 Bookham Technology Plc Mounting an optical fibre using a retaining channel
US6550666B2 (en) * 2001-08-21 2003-04-22 Advanpack Solutions Pte Ltd Method for forming a flip chip on leadframe semiconductor package
GB2381593A (en) * 2001-10-30 2003-05-07 Bookham Technology Plc Optical device with optically connected planar lightwave circuits
KR20040009814A (ko) * 2002-07-26 2004-01-31 우리로광통신주식회사 단심 광섬유 어레이의 제조방법
US20040264870A1 (en) * 2002-08-20 2004-12-30 Skunes Timothy A. Optical alignment mount with height adjustment
US7499614B2 (en) 2003-10-24 2009-03-03 International Business Machines Corporation Passive alignment of VCSELs to waveguides in opto-electronic cards and printed circuit boards
CA2855913C (en) * 2011-11-16 2016-11-29 Mitsubishi Electric Corporation Semiconductor laser excitation solid-state laser
CN104105440B (zh) * 2012-10-12 2016-06-22 奥林巴斯株式会社 内窥镜
GB2555398B (en) * 2016-10-24 2020-04-08 Toshiba Kk An optoelectronic system and method for its fabrication
JP6933794B2 (ja) * 2016-12-01 2021-09-08 富士通株式会社 光モジュール及び光モジュールの製造方法
CN113696524A (zh) * 2021-08-11 2021-11-26 苏州易锐光电科技有限公司 一种光学器件的微纳加工方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3871014A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
US3871015A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform connector joints
US3963920A (en) * 1975-03-10 1976-06-15 General Dynamics Corporation Integrated optical-to-electrical signal transducing system and apparatus
GB2137807B (en) * 1983-04-05 1987-08-12 Plessey Co Plc A semiconductor component and method of manufacture
JPS59185306A (ja) * 1983-04-07 1984-10-20 Agency Of Ind Science & Technol 光集積回路の実装法
JPS60188909A (ja) * 1984-03-08 1985-09-26 Canon Inc グレ−テイングカツプラ−の作製方法
DE3568517D1 (en) * 1984-04-06 1989-04-06 Plessey Overseas Improvements relating to the fabrication of optical devices
WO1986002172A1 (en) * 1984-09-28 1986-04-10 American Telephone & Telegraph Company Optical waveguide lateral alignment arrangement
JPS61173206A (ja) * 1985-01-29 1986-08-04 Fujitsu Ltd 光結合部の固定方法
JP2513599B2 (ja) * 1985-02-27 1996-07-03 富士通株式会社 光導波路基板の製造方法
DE3531734A1 (de) * 1985-09-05 1987-03-12 Siemens Ag Einrichtung zur positionierung eines halbleiterlasers mit selbstjustierender wirkung fuer eine anzukoppelnde glasfaser
GB8522429D0 (en) * 1985-09-10 1985-10-16 Plessey Co Plc Alignment for hybrid device
DE3534017A1 (de) * 1985-09-24 1987-03-26 Siemens Ag Verfahren zum ankoppeln einer laserdiode an einen monomode-lichtwellenleiter und eine anordnung aus einer laserdiode und einem daran angekoppelten lichtwellenleiter
DE3538556C2 (de) * 1985-10-30 1995-12-14 Ant Nachrichtentech Vorrichtung zum gegenseitigen Ausrichten zweier miteinander zu koppelnder optischer Komponenten

Also Published As

Publication number Publication date
GB2208943A (en) 1989-04-19
US4892377A (en) 1990-01-09
JP2664214B2 (ja) 1997-10-15
GB2208943B (en) 1991-07-31
EP0304118A3 (en) 1989-11-15
JPH01140104A (ja) 1989-06-01
DE3880234T2 (de) 1993-09-16
EP0304118B1 (de) 1993-04-14
EP0304118A2 (de) 1989-02-22
GB8719557D0 (en) 1987-09-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee