DE3879995D1 - Verfahren zum stromlosen plattieren eines metalles auf nichtleitende materialien. - Google Patents

Verfahren zum stromlosen plattieren eines metalles auf nichtleitende materialien.

Info

Publication number
DE3879995D1
DE3879995D1 DE8888101112T DE3879995T DE3879995D1 DE 3879995 D1 DE3879995 D1 DE 3879995D1 DE 8888101112 T DE8888101112 T DE 8888101112T DE 3879995 T DE3879995 T DE 3879995T DE 3879995 D1 DE3879995 D1 DE 3879995D1
Authority
DE
Germany
Prior art keywords
metal
conductive materials
electrically plating
plating
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8888101112T
Other languages
English (en)
Inventor
Zhang Shaoxian Zhang Shaoxian
Han Rongsheng Han Rongsheng
Zheng Chuanming Zhen Chuanming
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ARMOUR FORCE ENG INST
Original Assignee
ARMOUR FORCE ENG INST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ARMOUR FORCE ENG INST filed Critical ARMOUR FORCE ENG INST
Application granted granted Critical
Publication of DE3879995D1 publication Critical patent/DE3879995D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE8888101112T 1987-01-27 1988-01-26 Verfahren zum stromlosen plattieren eines metalles auf nichtleitende materialien. Expired - Lifetime DE3879995D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN87100440A CN87100440B (zh) 1987-01-27 1987-01-27 在不导电材料上刷镀铜的方法

Publications (1)

Publication Number Publication Date
DE3879995D1 true DE3879995D1 (de) 1993-05-13

Family

ID=4812876

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888101112T Expired - Lifetime DE3879995D1 (de) 1987-01-27 1988-01-26 Verfahren zum stromlosen plattieren eines metalles auf nichtleitende materialien.

Country Status (4)

Country Link
US (1) US5492613A (de)
EP (1) EP0287753B1 (de)
CN (1) CN87100440B (de)
DE (1) DE3879995D1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5108786A (en) * 1989-05-01 1992-04-28 Enthone-Omi, Inc. Method of making printed circuit boards
FR2646583B1 (fr) * 1989-05-01 1992-01-24 Enthone Corp Procede pour fabriquer des plaquettes a circuits imprimes
DE19636493C1 (de) * 1996-09-09 1998-03-26 Bosch Gmbh Robert Mit Edelmetallsalzen bekeimte Substrate oder Pulver und Verfahren zu ihrer Herstellung
US6703186B1 (en) 1999-08-11 2004-03-09 Mitsuboshi Belting Ltd. Method of forming a conductive pattern on a circuit board
US6776826B1 (en) * 2001-07-27 2004-08-17 Gbn Technologies, Inc. Composition and method for electroless plating of non-conductive substrates
CN100428871C (zh) * 2003-12-19 2008-10-22 财团法人工业技术研究院 以喷墨法形成金属导线图案的方法
US8094007B2 (en) * 2004-06-17 2012-01-10 Honeywell International Inc. Alarm status voice annunciation using broadcast band transmissions
AT501113B1 (de) * 2004-11-19 2008-06-15 Otto E Dipl Ing Dr Glaser Elektrisch leitfähiges holz und holzwerkstoffe sowie verfahren zur vorsehung elektrischer leitfähigkeit bei holz und holzwerkstoffen
DE102006042076A1 (de) * 2006-09-05 2008-03-20 Goldschmidt Tib Gmbh Ein neues Additiv für Chromelektrolyte
FR2909101B1 (fr) * 2006-11-24 2009-02-27 Samuel Stremsdoerfer Procede non electrolytique prefectionne de metallisation d'un substrat par voie de reduction de sel(s) metallique(s) et par projection d'aerosol(s)
DE102009048669A1 (de) * 2009-09-30 2011-03-31 Siemens Aktiengesellschaft Verfahren zum elektrochemischen Beschichten eines Substrates durch Brush Plating und Vorrichtung zur Durchführung dieses Verfahrens
JP5942297B2 (ja) * 2011-03-08 2016-06-29 国立研究開発法人科学技術振興機構 ナノギャップ長を有する電極構造の作製方法、メッキ液及びナノデバイス
CN104681907B (zh) * 2015-02-09 2017-11-21 中国电子科技集团公司第二十三研究所 整体聚四氟乙烯绝缘表面镀银外导体射频电缆及加工方法
KR101678013B1 (ko) * 2016-02-15 2016-11-21 주식회사 베프스 금속성분의 액중 농도 지시체를 포함하는 도금액 및 이를 이용한 도금 방법
CN106435537A (zh) * 2016-12-06 2017-02-22 合肥乐凯科技产业有限公司 一种聚合物基材表面选择性化学镀的方法
CN106498502A (zh) * 2016-12-06 2017-03-15 南京理工大学 一种利用金属辅助刻蚀具有木材反向结构硅表面的方法
CN112979344B (zh) * 2021-03-16 2022-04-08 河海大学 基于化学镀法在混凝土表面制备的抗菌保护层及制备方法
WO2022239017A1 (en) * 2021-05-09 2022-11-17 Prerna Goradia Novel methodology for coating non-conducting articles with broad-spectrum antimicrobial electroless plating layers
DE102021124300B3 (de) 2021-09-20 2022-10-27 Ofs - Beteiligungs - Gmbh Holding Elektronisches Bauelement aus pflanzlichem Material
CN114561674B (zh) * 2022-03-25 2023-03-31 江阴纳力新材料科技有限公司 塑料薄膜刷镀铜工艺

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3874897A (en) * 1971-08-13 1975-04-01 Enthone Activator solutions, their preparation and use in electroless plating of surfaces
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
US4005238A (en) * 1973-10-25 1977-01-25 Akademie Der Wissenschaften Der Ddr Metallized articles and method of producing the same
US3930072A (en) * 1974-06-28 1975-12-30 Universal Oil Prod Co Stabilization of metal plating baths
CA1053994A (en) * 1974-07-03 1979-05-08 Amp Incorporated Sensitization of polyimide polymer for electroless metal deposition
IT1041350B (it) * 1975-07-25 1980-01-10 Alfachimici Spa Soluzione attivante a base di argento per processi di ramatura anelettrica
US4080513A (en) * 1975-11-03 1978-03-21 Metropolitan Circuits Incorporated Of California Molded circuit board substrate
US4181750A (en) * 1977-09-09 1980-01-01 Western Electric Company, Inc. Method of depositing a metal on a surface
US4259376A (en) * 1977-09-16 1981-03-31 Nathan Feldstein Catalytic promoters in electroless plating catalysts applied as an emulsion
US4192764A (en) * 1977-11-03 1980-03-11 Western Electric Company, Inc. Stabilizing composition for a metal deposition process
FI783935A (fi) * 1978-12-20 1980-06-21 Outokumpu Oy Foerfarande foer belaeggning med metall av ett material som icke leder elektricitet
US4650550A (en) * 1982-04-20 1987-03-17 Dentsply Research And Development Corporation Manufacture and repair of dental appliances
US4511597A (en) * 1983-10-12 1985-04-16 Kollmorgen Technologies Corporation Method for depositing a metal on a surface
FR2555185A1 (fr) * 1983-11-17 1985-05-24 Roehm Gmbh Substrat de matiere synthetique pour l'ancrage de revetements metalliques
DE3517984A1 (de) * 1985-05-18 1986-11-20 Max 4600 Dortmund Flötenmeyer Verfahren und vorrichtung zum abscheiden von spiegelbelaegen
DE3523960A1 (de) * 1985-07-04 1987-01-08 Licentia Gmbh Verfahren zur metallisierung eines elektrisch schlecht leitenden substrates aus einem anorganischen material

Also Published As

Publication number Publication date
CN87100440A (zh) 1988-03-30
US5492613A (en) 1996-02-20
CN87100440B (zh) 1988-05-11
EP0287753B1 (de) 1993-04-07
EP0287753A1 (de) 1988-10-26

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Legal Events

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8332 No legal effect for de