DE3879066T2 - Gehaeuse einer elektronischen schaltung fuer ein fahrzeug. - Google Patents

Gehaeuse einer elektronischen schaltung fuer ein fahrzeug.

Info

Publication number
DE3879066T2
DE3879066T2 DE8888115588T DE3879066T DE3879066T2 DE 3879066 T2 DE3879066 T2 DE 3879066T2 DE 8888115588 T DE8888115588 T DE 8888115588T DE 3879066 T DE3879066 T DE 3879066T DE 3879066 T2 DE3879066 T2 DE 3879066T2
Authority
DE
Germany
Prior art keywords
housing
vehicle
electronic circuit
electronic
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888115588T
Other languages
English (en)
Other versions
DE3879066D1 (de
Inventor
Noriyoshi Urushiwara
Noboru Sugiura
Ryoichi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3879066D1 publication Critical patent/DE3879066D1/de
Publication of DE3879066T2 publication Critical patent/DE3879066T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE8888115588T 1987-09-30 1988-09-22 Gehaeuse einer elektronischen schaltung fuer ein fahrzeug. Expired - Fee Related DE3879066T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62243819A JPH0652831B2 (ja) 1987-09-30 1987-09-30 自動車用電子回路装置の密封構造

Publications (2)

Publication Number Publication Date
DE3879066D1 DE3879066D1 (de) 1993-04-15
DE3879066T2 true DE3879066T2 (de) 1993-09-02

Family

ID=17109399

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888115588T Expired - Fee Related DE3879066T2 (de) 1987-09-30 1988-09-22 Gehaeuse einer elektronischen schaltung fuer ein fahrzeug.

Country Status (5)

Country Link
US (1) US4893215A (de)
EP (1) EP0309920B1 (de)
JP (1) JPH0652831B2 (de)
KR (1) KR920005463B1 (de)
DE (1) DE3879066T2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014007443A1 (de) * 2014-05-21 2015-11-26 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Elektrische Baugruppe für ein Kraftfahrzeug und Verfahren zur Montage einer solchen elektrischen Baugruppe
WO2016015924A1 (de) * 2014-07-31 2016-02-04 Continental Automotive Gmbh Gehäuse mit einer öffnung und einer abdeckeinrichtung

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DE3837974A1 (de) * 1988-11-09 1990-05-10 Telefunken Electronic Gmbh Elektronisches steuergeraet
DE3936906C2 (de) * 1989-11-06 1995-02-02 Telefunken Microelectron Gehäuse für Kfz-Elektronik
FR2655809B1 (fr) * 1989-12-13 1996-08-09 Siemens Automotive Sa Procede d'assemblage d'un boitier de protection, notamment d'un module electronique, et boitier de protection obtenu par la mise en óoeuvre de ce procede.
DE4104853A1 (de) * 1991-02-16 1992-08-20 Standard Elektrik Lorenz Ag Vorrichtung zur herstellung von loesbaren elektrischen verbindungen
JP2772184B2 (ja) * 1991-11-07 1998-07-02 株式会社東芝 半導体装置
US5263880A (en) * 1992-07-17 1993-11-23 Delco Electronics Corporation Wirebond pin-plastic header combination and methods of making and using the same
JP2891324B2 (ja) * 1994-05-25 1999-05-17 矢崎総業株式会社 電気接続箱の防水シール構造
US5956231A (en) * 1994-10-07 1999-09-21 Hitachi, Ltd. Semiconductor device having power semiconductor elements
US5719334A (en) * 1996-07-11 1998-02-17 Ford Motor Company Hermetically protected sensor assembly
DE19807718C2 (de) * 1998-02-24 2000-12-07 Lear Automotive Electronics Gm Elektronikbaugruppe
DE19815110B4 (de) * 1998-04-03 2004-12-30 Knürr AG Wärmeabführanordnung
DE19959985A1 (de) * 1999-12-13 2001-07-05 Tyco Electronics Logistics Ag Elektronischer Trennschalter
DE10102834A1 (de) * 2001-01-22 2002-08-01 Bosch Gmbh Robert Elektrisches Gerät, insbesondere Schalt-oder Steuergerät für Kraftfahrzeuge
JP4006189B2 (ja) * 2001-04-19 2007-11-14 株式会社ケーヒン 車両用制御ユニット構造
DE10120715A1 (de) * 2001-04-27 2002-11-28 Bosch Gmbh Robert Gehäuse für ein elektrisches Gerät
DE10126189C2 (de) * 2001-05-30 2003-12-18 Bosch Gmbh Robert Gehäuse für ein elektrisches Gerät, insbesondere ein Schalt-oder Steuergerät in einem KFZ
US20030063900A1 (en) * 2001-12-13 2003-04-03 Carter Group, Inc. Linear electric motor controller and system for providing linear speed control
US6587338B2 (en) * 2001-12-13 2003-07-01 Carter Group, Inc. Electronic controller modules and methods for making and using same
US7265516B2 (en) * 2001-12-13 2007-09-04 Lacroix Michael Charles Linear electric motor controller and system for providing linear control
US20040105664A1 (en) * 2002-12-03 2004-06-03 Mladen Ivankovic Linear electric motor controller and system for providing linear speed control
JP2003298253A (ja) * 2002-03-29 2003-10-17 Denso Corp 電子制御装置の筐体構造及び電子制御装置の搭載構造
US6871126B2 (en) * 2002-05-03 2005-03-22 Donnelly Corporation Variable blower controller for vehicle
JP3748253B2 (ja) * 2002-11-14 2006-02-22 三菱電機株式会社 車載電子機器の筐体構造
DE10313832A1 (de) 2003-03-21 2004-10-14 Tyco Electronics Pretema Gmbh Baueinheit und Verfahren zur Herstellung einer Baueinheit
DE10340974A1 (de) * 2003-09-05 2005-03-24 Robert Bosch Gmbh Steuergeräteeinheit und Verfahren zur Hestellung derselben
US20050264253A1 (en) * 2003-10-21 2005-12-01 Mladen Ivankovic Linear power module
DE102004033559A1 (de) * 2004-07-09 2006-02-09 Zf Friedrichshafen Ag Abdichtung eines Steuergerätes
DE102004040596A1 (de) * 2004-08-21 2006-02-23 Robert Bosch Gmbh Elektrische Vorrichtung mit einem Gehäuse und einem Kühlkörper
CN100581858C (zh) * 2004-09-15 2010-01-20 麦格纳唐纳利工程有限公司 一种车辆环境控制系统
JP4867280B2 (ja) * 2005-10-18 2012-02-01 株式会社ジェイテクト コーティング剤塗布方法
US7864496B2 (en) * 2006-12-04 2011-01-04 Magna Electronics Load dump protection for power FET device
DE102007032594B4 (de) * 2007-07-12 2009-04-09 Continental Automotive Gmbh Steuervorrichtung und Verfahren zur Herstellung einer Steuervorrichtung
JP4466744B2 (ja) * 2008-02-06 2010-05-26 株式会社デンソー 電子装置の放熱構造
JP5450192B2 (ja) * 2010-03-24 2014-03-26 日立オートモティブシステムズ株式会社 パワーモジュールとその製造方法
DE102010062653A1 (de) * 2010-12-08 2012-06-14 Robert Bosch Gmbh Steuermodul und Verfahren zu seiner Herstellung
US20120261409A1 (en) * 2011-04-14 2012-10-18 Continental Automotive Systems, Inc. Combined metal cover and anti-crush hole support
US9961786B2 (en) * 2013-11-19 2018-05-01 Continental Automotive Systems, Inc. Method and structure for limiting cover deflection in an ECU when exposed to high altitude environments
US9368905B2 (en) 2014-07-22 2016-06-14 Cooper Technologies Company Potting compound chamber designs for electrical connectors
EP3346810B8 (de) * 2015-09-04 2021-10-20 Hitachi Astemo, Ltd. Fahrzeugmontierte steuerungsvorrichtung
CN108432056B (zh) 2015-11-06 2020-03-13 伊顿智能动力有限公司 用于电连接器的灌注化合物腔室设计
US10483176B2 (en) * 2015-12-04 2019-11-19 Mitsubishi Electric Corporation Semiconductor module
DE212016000281U1 (de) * 2016-06-08 2019-02-25 Siemens Aktiengesellschaft Modul eines modularen Mehrstufenumrichters mit einem elastischen Dichtelement
JP6983485B2 (ja) 2018-09-06 2021-12-17 株式会社ミツバ モータのドライバ
JP7033274B2 (ja) * 2018-11-12 2022-03-10 オムロン株式会社 センサ及びその製造方法

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DE2305484C3 (de) * 1973-02-05 1978-08-24 Siemens Ag, 1000 Berlin Und 8000 Muenchen Erregereinrichtung für eine gleichstromerregte Drehstrom-Lichtmaschine
JPS5242765A (en) * 1975-09-30 1977-04-02 Seiko Instr & Electronics Ltd Electronic watch
US4272644A (en) * 1979-09-27 1981-06-09 Hybrid Systems Corporation Electronic hybrid circuit package
DE3307654A1 (de) * 1983-03-04 1984-09-06 Robert Bosch Gmbh, 7000 Stuttgart Elektrisches schaltgeraet im motorraum eines kraftfahrzeugs
JPS59208800A (ja) * 1983-05-12 1984-11-27 株式会社日立製作所 自動車用電子装置
DE3333684A1 (de) * 1983-09-17 1985-04-04 Standard Elektrik Lorenz Ag, 7000 Stuttgart Gehaeuse fuer ein elektromechanisches bauelement, insbesondere relais
JPS60213095A (ja) * 1984-04-09 1985-10-25 松下電器産業株式会社 電子回路装置
DE3604882A1 (de) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung des moduls
US4691265A (en) * 1986-09-10 1987-09-01 Eastman Kodak Company Semiconductor mounting assembly
US4811165A (en) * 1987-12-07 1989-03-07 Motorola, Inc. Assembly for circuit modules

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014007443A1 (de) * 2014-05-21 2015-11-26 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Elektrische Baugruppe für ein Kraftfahrzeug und Verfahren zur Montage einer solchen elektrischen Baugruppe
US9661773B2 (en) 2014-05-21 2017-05-23 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Electrical assembly for a motor vehicle
WO2016015924A1 (de) * 2014-07-31 2016-02-04 Continental Automotive Gmbh Gehäuse mit einer öffnung und einer abdeckeinrichtung
US10039197B2 (en) 2014-07-31 2018-07-31 Continental Automotive Gmbh Housing having an opening and a covering device

Also Published As

Publication number Publication date
EP0309920A3 (en) 1990-02-21
KR920005463B1 (ko) 1992-07-04
JPH0652831B2 (ja) 1994-07-06
EP0309920A2 (de) 1989-04-05
JPS6489496A (en) 1989-04-03
DE3879066D1 (de) 1993-04-15
US4893215A (en) 1990-01-09
EP0309920B1 (de) 1993-03-10
KR890006129A (ko) 1989-05-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee