DE3872705D1 - Vorrichtung und verfahren zum feststellen/regulieren des freiraums bei einer lithographiemaschine. - Google Patents

Vorrichtung und verfahren zum feststellen/regulieren des freiraums bei einer lithographiemaschine.

Info

Publication number
DE3872705D1
DE3872705D1 DE8989901625T DE3872705T DE3872705D1 DE 3872705 D1 DE3872705 D1 DE 3872705D1 DE 8989901625 T DE8989901625 T DE 8989901625T DE 3872705 T DE3872705 T DE 3872705T DE 3872705 D1 DE3872705 D1 DE 3872705D1
Authority
DE
Germany
Prior art keywords
wafer
plane
moving
exposed
fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8989901625T
Other languages
English (en)
Other versions
DE3872705T2 (de
Inventor
D Frankel
J Martin
G Baker
L Duft
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HAMPSHIRE INSTR Inc
Original Assignee
HAMPSHIRE INSTR Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HAMPSHIRE INSTR Inc filed Critical HAMPSHIRE INSTR Inc
Application granted granted Critical
Publication of DE3872705D1 publication Critical patent/DE3872705D1/de
Publication of DE3872705T2 publication Critical patent/DE3872705T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KTECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K5/00Irradiation devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70033Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21BFUSION REACTORS
    • G21B1/00Thermonuclear fusion reactors
    • G21B1/11Details
    • G21B1/23Optical systems, e.g. for irradiating targets, for heating plasma or for plasma diagnostics
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00Energy generation of nuclear origin
    • Y02E30/10Nuclear fusion reactors

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE8989901625T 1987-12-30 1988-12-28 Vorrichtung und verfahren zum feststellen/regulieren des freiraums bei einer lithographiemaschine. Expired - Fee Related DE3872705T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/139,637 US4870668A (en) 1987-12-30 1987-12-30 Gap sensing/adjustment apparatus and method for a lithography machine
PCT/US1988/004674 WO1989006430A1 (en) 1987-12-30 1988-12-28 Gap sensing/adjustment apparatus and method for a lithography machine

Publications (2)

Publication Number Publication Date
DE3872705D1 true DE3872705D1 (de) 1992-08-13
DE3872705T2 DE3872705T2 (de) 1993-01-21

Family

ID=22487599

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8989901625T Expired - Fee Related DE3872705T2 (de) 1987-12-30 1988-12-28 Vorrichtung und verfahren zum feststellen/regulieren des freiraums bei einer lithographiemaschine.

Country Status (7)

Country Link
US (1) US4870668A (de)
EP (1) EP0349632B1 (de)
JP (1) JPH02502503A (de)
KR (1) KR920005740B1 (de)
AT (1) ATE78110T1 (de)
DE (1) DE3872705T2 (de)
WO (1) WO1989006430A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2799575B2 (ja) * 1988-09-30 1998-09-17 キヤノン株式会社 露光方法
WO1991018401A1 (en) * 1990-05-21 1991-11-28 Hampshire Instruments, Inc. Mask tray for and method of loading mask in lithography system
US5197089A (en) * 1990-05-21 1993-03-23 Hampshire Instruments, Inc. Pin chuck for lithography system
JP3004045B2 (ja) * 1990-11-19 2000-01-31 株式会社東芝 露光装置
US5150392A (en) * 1991-09-09 1992-09-22 International Business Machines Corporation X-ray mask containing a cantilevered tip for gap control and alignment
US5528118A (en) * 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US6989647B1 (en) * 1994-04-01 2006-01-24 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US7365513B1 (en) 1994-04-01 2008-04-29 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US5874820A (en) * 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US6246204B1 (en) 1994-06-27 2001-06-12 Nikon Corporation Electromagnetic alignment and scanning apparatus
US5623853A (en) * 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
US6008500A (en) * 1995-04-04 1999-12-28 Nikon Corporation Exposure apparatus having dynamically isolated reaction frame
TW318255B (de) 1995-05-30 1997-10-21 Philips Electronics Nv
US5760564A (en) * 1995-06-27 1998-06-02 Nikon Precision Inc. Dual guide beam stage mechanism with yaw control
US6215896B1 (en) * 1995-09-29 2001-04-10 Advanced Micro Devices System for enabling the real-time detection of focus-related defects
JP2000228355A (ja) * 1998-12-04 2000-08-15 Canon Inc 半導体露光装置およびデバイス製造方法
US6437463B1 (en) 2000-04-24 2002-08-20 Nikon Corporation Wafer positioner with planar motor and mag-lev fine stage
KR100471018B1 (ko) 2000-11-28 2005-03-08 스미도모쥬기가이고교 가부시키가이샤 두 개의 대상물 간의 갭 조절장치 및 조절방법
EP1845281B1 (de) * 2006-04-11 2016-03-09 Integrated Dynamics Engineering GmbH Aktives Schwingungsisolationssystem
CN116710729A (zh) 2020-09-30 2023-09-05 艾德克斯实验室公司 Z轴测量夹具和使用该夹具确定物体的平面度的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57204547A (en) * 1981-06-12 1982-12-15 Hitachi Ltd Exposing method
US4444492A (en) * 1982-05-15 1984-04-24 General Signal Corporation Apparatus for projecting a series of images onto dies of a semiconductor wafer
US4504144A (en) * 1982-07-06 1985-03-12 The Perkin-Elmer Corporation Simple electromechanical tilt and focus device
US4472824A (en) * 1982-08-04 1984-09-18 The Perkin-Elmer Corporation Apparatus for effecting alignment and spacing control of a mask and wafer for use in X-ray lithography
US4516253A (en) * 1983-03-15 1985-05-07 Micronix Partners Lithography system
US4525852A (en) * 1983-03-15 1985-06-25 Micronix Partners Alignment apparatus
US4538069A (en) * 1983-10-28 1985-08-27 Control Data Corporation Capacitance height gage applied in reticle position detection system for electron beam lithography apparatus
US4694477A (en) * 1983-12-21 1987-09-15 Hewlett-Packard Company Flexure stage alignment apparatus
US4613981A (en) * 1984-01-24 1986-09-23 Varian Associates, Inc. Method and apparatus for lithographic rotate and repeat processing

Also Published As

Publication number Publication date
KR920005740B1 (ko) 1992-07-16
KR900701015A (ko) 1990-08-17
EP0349632A1 (de) 1990-01-10
WO1989006430A1 (en) 1989-07-13
JPH02502503A (ja) 1990-08-09
US4870668A (en) 1989-09-26
DE3872705T2 (de) 1993-01-21
ATE78110T1 (de) 1992-07-15
EP0349632A4 (de) 1990-05-14
EP0349632B1 (de) 1992-07-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee