DE3854564D1 - Laserbearbeitungsvorrichtung. - Google Patents

Laserbearbeitungsvorrichtung.

Info

Publication number
DE3854564D1
DE3854564D1 DE3854564T DE3854564T DE3854564D1 DE 3854564 D1 DE3854564 D1 DE 3854564D1 DE 3854564 T DE3854564 T DE 3854564T DE 3854564 T DE3854564 T DE 3854564T DE 3854564 D1 DE3854564 D1 DE 3854564D1
Authority
DE
Germany
Prior art keywords
processing device
laser processing
laser
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3854564T
Other languages
English (en)
Other versions
DE3854564T2 (de
Inventor
Koji C O Mitsubishi Denk Yasui
Masaaki C O Mitsubishi Tanaka
Shigenori C O Mitsubishi Yagi
Masaki C O Mitsubishi Kuzumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62179144A external-priority patent/JPH07101762B2/ja
Priority claimed from JP62182354A external-priority patent/JPH0728068B2/ja
Priority claimed from JP62311357A external-priority patent/JPH01152681A/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE3854564D1 publication Critical patent/DE3854564D1/de
Application granted granted Critical
Publication of DE3854564T2 publication Critical patent/DE3854564T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/105—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • H01S3/08081—Unstable resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)
DE3854564T 1987-07-20 1988-07-20 Laserbearbeitungsvorrichtung. Expired - Fee Related DE3854564T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62179144A JPH07101762B2 (ja) 1987-07-20 1987-07-20 レ−ザ加工装置
JP62182354A JPH0728068B2 (ja) 1987-07-23 1987-07-23 レ−ザ装置
JP62311357A JPH01152681A (ja) 1987-12-09 1987-12-09 パルスレーザ装置

Publications (2)

Publication Number Publication Date
DE3854564D1 true DE3854564D1 (de) 1995-11-16
DE3854564T2 DE3854564T2 (de) 1996-03-28

Family

ID=27324689

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3854564T Expired - Fee Related DE3854564T2 (de) 1987-07-20 1988-07-20 Laserbearbeitungsvorrichtung.

Country Status (4)

Country Link
US (1) US4937424A (de)
EP (1) EP0300465B1 (de)
KR (1) KR910009016B1 (de)
DE (1) DE3854564T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2760116B2 (ja) * 1989-12-18 1998-05-28 三菱電機株式会社 固体レーザ装置
FR2673557A1 (fr) * 1991-03-08 1992-09-11 Ugine Aciers Procede et dispositif optique statique pour irradiation laser d'un produit metallique en mouvement et son application au traitement de toles magnetiques.
WO1992021050A1 (en) * 1991-05-21 1992-11-26 Seiko Epson Corporation Optical device and optical machining system using the optical device
US5223692A (en) * 1991-09-23 1993-06-29 General Electric Company Method and apparatus for laser trepanning
US5300756A (en) * 1991-10-22 1994-04-05 General Scanning, Inc. Method for severing integrated-circuit connection paths by a phase-plate-adjusted laser beam
US5448410A (en) * 1992-07-31 1995-09-05 International Business Machines Corporation Variable magnification laser imaging system
JP3083688B2 (ja) * 1992-09-16 2000-09-04 三菱電機株式会社 固体レーザ装置
JP2980788B2 (ja) * 1992-10-21 1999-11-22 三菱電機株式会社 レーザ装置
JPH07246488A (ja) * 1994-03-11 1995-09-26 Fanuc Ltd レーザ加工装置
DE19609199A1 (de) * 1996-03-09 1997-09-11 Vetter & Co Apotheker Verfahren zur Bearbeitung von Werkstücken aus festen Materialien sowie Vorrichtung zur Durchführung des Verfahrens
US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US6259058B1 (en) 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6211488B1 (en) 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
EP1068923B1 (de) * 1999-07-12 2007-10-17 MDC Max Dätwyler AG Bleienbach Verfahren zur Erzeugung einer Intensitätsverteilung über einen Arbeitslaserstrahl sowie Vorrichtung hierzu
US6433303B1 (en) * 2000-03-31 2002-08-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus using laser pulses to make an array of microcavity holes
US6642477B1 (en) 2001-10-23 2003-11-04 Imra America, Inc. Method for laser drilling a counter-tapered through-hole in a material
JP2003340588A (ja) * 2002-05-24 2003-12-02 Inst Of Physical & Chemical Res 透明材料内部の処理方法およびその装置
JP4684544B2 (ja) * 2003-09-26 2011-05-18 株式会社ディスコ シリコンから形成された半導体ウエーハの分割方法及び装置
JP2005334925A (ja) * 2004-05-26 2005-12-08 Yamazaki Mazak Corp レーザ加工機における反射鏡の駆動軸制御装置
EP1926568B1 (de) * 2005-09-03 2012-11-14 TRUMPF Werkzeugmaschinen GmbH + Co. KG Laserbearbeitungsmaschine mit einer optischen blende zur randfeldbeseitigung
TW200911317A (en) * 2007-04-27 2009-03-16 Arkray Inc Laser drilling device, and protective member and cartridge for laser drilling device
DE102007046074A1 (de) * 2007-09-24 2009-04-09 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zur Laserbearbeitung
CN101797666A (zh) * 2010-03-26 2010-08-11 中国科学院上海光学精密机械研究所 延长焦深的激光切割头
WO2015045869A1 (ja) * 2013-09-25 2015-04-02 株式会社堀場製作所 分析装置及び分析方法
BR112016030522B1 (pt) * 2014-07-03 2019-11-05 Nippon Steel & Sumitomo Metal Corp aparelho de processamento a laser

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3586816A (en) * 1968-07-25 1971-06-22 American Optical Corp Spot welding system and method
DE2221057A1 (de) * 1972-04-28 1973-11-08 Siemens Ag Laser-oszillator-verstaerker-kombination zur erzeugung des grundmodus
GB1528451A (en) * 1974-10-03 1978-10-11 Atomic Energy Authority Uk Manufacture of bags
DE2449123C3 (de) * 1974-10-16 1978-08-10 Messerschmitt-Boelkow-Blohm Gmbh, 8000 Muenchen Auskoppelspiegel für astabile Laserresonatoren
DE2713904C3 (de) * 1977-03-29 1979-10-04 Siemens Ag, 1000 Berlin Und 8000 Muenchen Vorrichtung zum Bearbeiten von Werkstucken mittels eines Laserstrahles
US4287482A (en) * 1979-08-30 1981-09-01 Wert Iii John C CW-Pulsed laser
US4336435A (en) * 1981-03-23 1982-06-22 Canadian Patents & Dev. Limited Microwave apparatus for heating liquid in a closed plastic container
US4358659A (en) * 1981-07-13 1982-11-09 Mostek Corporation Method and apparatus for focusing a laser beam on an integrated circuit
JPS5939491A (ja) * 1982-08-30 1984-03-03 Matsushita Electric Works Ltd 金属薄板のレ−ザ溶接方法
US4553244A (en) * 1984-04-25 1985-11-12 Gte Communications Products Corporation Laser beam energy profile synthesizer
DE3764783D1 (de) * 1986-12-08 1990-10-11 Mitsubishi Electric Corp Laserapparat.

Also Published As

Publication number Publication date
KR910009016B1 (ko) 1991-10-26
EP0300465A2 (de) 1989-01-25
DE3854564T2 (de) 1996-03-28
KR890003075A (ko) 1989-04-12
US4937424A (en) 1990-06-26
EP0300465B1 (de) 1995-10-11
EP0300465A3 (de) 1991-10-09

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee