DE69105167D1 - Laserbearbeitungsvorrichtung. - Google Patents

Laserbearbeitungsvorrichtung.

Info

Publication number
DE69105167D1
DE69105167D1 DE69105167T DE69105167T DE69105167D1 DE 69105167 D1 DE69105167 D1 DE 69105167D1 DE 69105167 T DE69105167 T DE 69105167T DE 69105167 T DE69105167 T DE 69105167T DE 69105167 D1 DE69105167 D1 DE 69105167D1
Authority
DE
Germany
Prior art keywords
processing device
laser processing
laser
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69105167T
Other languages
English (en)
Other versions
DE69105167T2 (de
Inventor
Toshikazu Kajikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69105167D1 publication Critical patent/DE69105167D1/de
Application granted granted Critical
Publication of DE69105167T2 publication Critical patent/DE69105167T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE69105167T 1990-06-21 1991-06-20 Laserbearbeitungsvorrichtung. Expired - Fee Related DE69105167T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2163717A JP2526717B2 (ja) 1990-06-21 1990-06-21 レ―ザ加工装置

Publications (2)

Publication Number Publication Date
DE69105167D1 true DE69105167D1 (de) 1994-12-22
DE69105167T2 DE69105167T2 (de) 1995-04-06

Family

ID=15779310

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69105167T Expired - Fee Related DE69105167T2 (de) 1990-06-21 1991-06-20 Laserbearbeitungsvorrichtung.

Country Status (4)

Country Link
US (1) US5191187A (de)
EP (1) EP0462842B1 (de)
JP (1) JP2526717B2 (de)
DE (1) DE69105167T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06350153A (ja) * 1993-06-10 1994-12-22 Kokusai Chodendo Sangyo Gijutsu Kenkyu Center 超電導デバイスの製造方法
NL9500331A (nl) * 1995-02-21 1996-10-01 Bootsman Holding Bv Laserbewerkingssysteem.
US5620618A (en) * 1995-04-28 1997-04-15 International Business Machines Corporation Multi-wavelength programmable laser processing mechanisms and apparatus
US5751588A (en) * 1995-04-28 1998-05-12 International Business Machines Corporation Multi-wavelength programmable laser processing mechanisms and apparatus utilizing vaporization detection
US6774340B1 (en) * 1998-11-25 2004-08-10 Komatsu Limited Shape of microdot mark formed by laser beam and microdot marking method
JP2000263840A (ja) * 1999-03-11 2000-09-26 Hitachi Ltd レーザ印字方法及びレーザ印字装置
JP2001017571A (ja) 1999-07-09 2001-01-23 Bridgestone Sports Co Ltd ソリッドゴルフボール
KR100467745B1 (ko) * 2002-06-19 2005-01-24 주식회사 이오테크닉스 갈바노 미터의 회전자 위치 측정 시스템
US6710288B2 (en) * 2002-07-25 2004-03-23 Matsushita Electric Industrial Co., Ltd. Method and apparatus for aligning a work piece in a laser drilling system
US7015849B2 (en) * 2002-11-08 2006-03-21 Olympus Corporation Control circuit
US20040188401A1 (en) * 2003-03-28 2004-09-30 Sadao Mori Laser processing apparatus
US7163294B2 (en) * 2003-12-31 2007-01-16 Symbol Technologies, Inc. Method and apparatus for providing an interface between a liquid crystal display controller and a laser projection display
DE102005002670B4 (de) * 2005-01-14 2009-07-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Bearbeitung von Werkstücken mittels Laserstrahlung
US20070100414A1 (en) * 2005-11-02 2007-05-03 Cardiomind, Inc. Indirect-release electrolytic implant delivery systems
JP4612733B2 (ja) 2008-12-24 2011-01-12 東芝機械株式会社 パルスレーザ加工装置
JP2013515612A (ja) * 2009-12-23 2013-05-09 イムラ アメリカ インコーポレイテッド 光学素子構造体と集束ビームとを用いたレーザ利用パターン形成
US9842740B2 (en) * 2014-08-29 2017-12-12 Seagate Technology Llc Ablation for feature recovery
CN109890553B (zh) * 2016-08-28 2022-05-17 Acs 运动控制有限公司 用于激光机械加工多个相对较大工件的方法及系统
US10739227B2 (en) * 2017-03-23 2020-08-11 Johnson & Johnson Surgical Vision, Inc. Methods and systems for measuring image quality
EP3687447A1 (de) 2017-11-30 2020-08-05 AMO Groningen B.V. Intraokularlinsen zur verbesserung der brillenunabhängigkeit nach einer operation und verfahren zu ihrer herstellung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734558A (en) * 1983-05-16 1988-03-29 Nec Corporation Laser machining apparatus with controllable mask
DE3530189A1 (de) * 1985-08-23 1987-03-05 Zeiss Carl Fa Einrichtung zur lagekorrektur eines ueber eine gelenkoptik gefuehrten laserstrahls
JPH0658466B2 (ja) * 1985-11-28 1994-08-03 日本電気株式会社 レ−ザマ−カ装置
GB8604449D0 (en) * 1986-02-22 1986-03-26 Austin Rover Group Monitoring laser beam
US4818835A (en) * 1987-03-02 1989-04-04 Hitachi, Ltd. Laser marker and method of laser marking
US4920364A (en) * 1989-05-10 1990-04-24 Xerox Corporation Liquid crystal dynamic attenuator for laser printers

Also Published As

Publication number Publication date
EP0462842A2 (de) 1991-12-27
DE69105167T2 (de) 1995-04-06
US5191187A (en) 1993-03-02
EP0462842B1 (de) 1994-11-17
JPH0455077A (ja) 1992-02-21
EP0462842A3 (en) 1992-04-22
JP2526717B2 (ja) 1996-08-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee