DE3804070C3 - Galvanisieranlage für Leiterplatten - Google Patents

Galvanisieranlage für Leiterplatten

Info

Publication number
DE3804070C3
DE3804070C3 DE3804070A DE3804070A DE3804070C3 DE 3804070 C3 DE3804070 C3 DE 3804070C3 DE 3804070 A DE3804070 A DE 3804070A DE 3804070 A DE3804070 A DE 3804070A DE 3804070 C3 DE3804070 C3 DE 3804070C3
Authority
DE
Germany
Prior art keywords
printed circuit
circuit boards
nozzles
electroplating system
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3804070A
Other languages
German (de)
English (en)
Other versions
DE3804070A1 (de
DE3804070C2 (enrdf_load_stackoverflow
Inventor
Hans-Hermann Di Merkenschlager
Gergely Ing Grad Szolnoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wincor Nixdorf International GmbH
Original Assignee
Siemens Nixdorf Informationssysteme AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Nixdorf Informationssysteme AG filed Critical Siemens Nixdorf Informationssysteme AG
Priority to DE3804070A priority Critical patent/DE3804070C3/de
Publication of DE3804070A1 publication Critical patent/DE3804070A1/de
Application granted granted Critical
Publication of DE3804070C2 publication Critical patent/DE3804070C2/de
Publication of DE3804070C3 publication Critical patent/DE3804070C3/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
DE3804070A 1988-02-10 1988-02-10 Galvanisieranlage für Leiterplatten Expired - Fee Related DE3804070C3 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3804070A DE3804070C3 (de) 1988-02-10 1988-02-10 Galvanisieranlage für Leiterplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3804070A DE3804070C3 (de) 1988-02-10 1988-02-10 Galvanisieranlage für Leiterplatten

Publications (3)

Publication Number Publication Date
DE3804070A1 DE3804070A1 (de) 1989-08-17
DE3804070C2 DE3804070C2 (enrdf_load_stackoverflow) 1992-06-04
DE3804070C3 true DE3804070C3 (de) 1994-02-24

Family

ID=6347085

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3804070A Expired - Fee Related DE3804070C3 (de) 1988-02-10 1988-02-10 Galvanisieranlage für Leiterplatten

Country Status (1)

Country Link
DE (1) DE3804070C3 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007026633B4 (de) * 2007-06-06 2009-04-02 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1431022A (en) * 1921-03-02 1922-10-03 Jr Thomas H Mumford Agitating apparatus for tanks
CH215409A (de) * 1939-11-03 1941-06-30 Rausser Emil Verfahren und Vorrichtung zur Erzeugung von galvanischen Überzügen.
US4372825A (en) * 1981-11-06 1983-02-08 Micro-Plate, Inc. Plating sparger and method
US4443304A (en) * 1982-10-01 1984-04-17 Micro-Plate, Inc. Plating system and method
DE3317970A1 (de) * 1983-05-13 1984-11-15 Schering AG, 1000 Berlin und 4709 Bergkamen Vorrichtung und verfahren zur galvanischen abscheidung von metallen
DE3643746A1 (de) * 1986-12-20 1988-06-30 Stohrer Doduco Gmbh & Co Tauchverfahren und vorrichtung zum elektrolytischen beschichten von platten, insbesondere von elektrischen leiterplatten

Also Published As

Publication number Publication date
DE3804070A1 (de) 1989-08-17
DE3804070C2 (enrdf_load_stackoverflow) 1992-06-04

Similar Documents

Publication Publication Date Title
DE69310129T2 (de) Elektroplattiersystem mit mehreren Abteilungen
DE3228292C2 (enrdf_load_stackoverflow)
EP0254962A1 (de) Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten
DE2151618C3 (de) Verfahren und Vorrichtung zum kathodischen Behandeln dünner elektrisch leitender Faserstränge bzw. -bündel
DE3317970C2 (enrdf_load_stackoverflow)
WO1996015294A1 (de) Vorrichtung zur elektrolytischen behandlung von plattenförmigen werkstücken, insbesondere von leiterplatten
DE3804070C3 (de) Galvanisieranlage für Leiterplatten
DE1948731A1 (de) Elektrolytische Bearbeitungsvorrichtung
DE1621143B2 (de) Vorrichtung zur selektiven gal vanischen Metallisierung
EP0194577A2 (de) Verfahren und Vorrichtung zur galvanischen Beschichtung von Pressbändern
EP0534269A2 (de) Galvanisiereinrichtung für im horizontalen Durchlauf zu behandelnde gelochte Leiterplatten
DE1565555B1 (de) Vorrichtung zur elektrolytischen Herstellung von L¦chern in Werkstücken
EP0254056B1 (de) Langgestreckte Gestelle mit Haltebügeln zum lösbaren Befestigen von Leiterplatten
DE68902459T2 (de) Apparat zur elektroentladungsbearbeitung.
DE69818779T2 (de) Elektroplattierungsanlage
EP1230442B1 (de) Vorrichtung zur elektrolytischen behandlung von plattenförmigen werkstücken, insbesondere von leiterplatten
DE2845886C2 (enrdf_load_stackoverflow)
DE19735244B4 (de) Verfahren und Vorrichtung zum Verchromen von Werkstücken
DE3925975C2 (de) Anordnung zur Spülung von in einer galvanischen Anlage behandelten Bauteilen
EP0342621B1 (de) Tauchverfahren und Vorrichtung zum elektrolytischen Beschichten von Platten, insbesondere von elektrischen Leiterplatten
DE543843C (de) Vorrichtung zur Erzeugung von Metallniederschlaegen auf galvanischem Wege
DE2612730C2 (de) Hochgeschwindigkeitsgalvanisierungseinrichtung für dünne Platten, Folien oder anderes flächiges Material
DE3822040C1 (en) Process and appliance for metallising clip-shaped workpieces
DE3643746A1 (de) Tauchverfahren und vorrichtung zum elektrolytischen beschichten von platten, insbesondere von elektrischen leiterplatten
JPS5665999A (en) Plating device

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8363 Opposition against the patent
8327 Change in the person/name/address of the patent owner

Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME AG, 4790 PADER

8366 Restricted maintained after opposition proceedings
8305 Restricted maintenance of patent after opposition
D4 Patent maintained restricted
8339 Ceased/non-payment of the annual fee