DE3789103D1 - System zur überwachung der dosismessung und der gleichmässigkeit für ionenimplantierung. - Google Patents

System zur überwachung der dosismessung und der gleichmässigkeit für ionenimplantierung.

Info

Publication number
DE3789103D1
DE3789103D1 DE87903184T DE3789103T DE3789103D1 DE 3789103 D1 DE3789103 D1 DE 3789103D1 DE 87903184 T DE87903184 T DE 87903184T DE 3789103 T DE3789103 T DE 3789103T DE 3789103 D1 DE3789103 D1 DE 3789103D1
Authority
DE
Germany
Prior art keywords
uniformity
ion implantation
dose measurement
monitoring dose
monitoring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE87903184T
Other languages
English (en)
Other versions
DE3789103T2 (de
Inventor
Philip D Corey
Paul Lundquist
Robert Brick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of DE3789103D1 publication Critical patent/DE3789103D1/de
Application granted granted Critical
Publication of DE3789103T2 publication Critical patent/DE3789103T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/244—Detectors; Associated components or circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/24405—Faraday cages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/2446—Position sensitive detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/2449—Detector devices with moving charges in electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
DE3789103T 1986-05-16 1987-04-27 System zur überwachung der dosismessung und der gleichmässigkeit für ionenimplantierung. Expired - Fee Related DE3789103T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/864,584 US4751393A (en) 1986-05-16 1986-05-16 Dose measurement and uniformity monitoring system for ion implantation
PCT/US1987/000985 WO1987007076A1 (en) 1986-05-16 1987-04-27 Dose measurement and uniformity monitoring system for ion implantation

Publications (2)

Publication Number Publication Date
DE3789103D1 true DE3789103D1 (de) 1994-03-24
DE3789103T2 DE3789103T2 (de) 1994-09-01

Family

ID=25343593

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3789103T Expired - Fee Related DE3789103T2 (de) 1986-05-16 1987-04-27 System zur überwachung der dosismessung und der gleichmässigkeit für ionenimplantierung.

Country Status (6)

Country Link
US (1) US4751393A (de)
EP (1) EP0276229B1 (de)
JP (1) JPH0628141B2 (de)
KR (1) KR950001252B1 (de)
DE (1) DE3789103T2 (de)
WO (1) WO1987007076A1 (de)

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US4849641A (en) * 1987-06-22 1989-07-18 Berkowitz Edward H Real time non-destructive dose monitor
US4967380A (en) * 1987-09-16 1990-10-30 Varian Associates, Inc. Dual channel signal processor using weighted integration of log-ratios and ion beam position sensor utilizing the signal processor
JP2969788B2 (ja) * 1990-05-17 1999-11-02 日新電機株式会社 イオンビームの平行度測定方法、走査波形整形方法およびイオン注入装置
US5198676A (en) * 1991-09-27 1993-03-30 Eaton Corporation Ion beam profiling method and apparatus
JP3125384B2 (ja) * 1991-11-14 2001-01-15 日本電気株式会社 イオン注入装置
JP3505013B2 (ja) * 1995-08-07 2004-03-08 株式会社日立製作所 試料像表示方法
CA2159531A1 (en) * 1995-09-29 1997-03-30 Courtland B. Lawrence Method for monitoring absorbed dose in an electron beam
JP3376793B2 (ja) * 1995-12-20 2003-02-10 株式会社日立製作所 走査形電子顕微鏡
US5757018A (en) * 1995-12-11 1998-05-26 Varian Associates, Inc. Zero deflection magnetically-suppressed Faraday for ion implanters
US5981961A (en) * 1996-03-15 1999-11-09 Applied Materials, Inc. Apparatus and method for improved scanning efficiency in an ion implanter
US6239440B1 (en) 1996-03-27 2001-05-29 Thermoceramix, L.L.C. Arc chamber for an ion implantation system
US5857889A (en) * 1996-03-27 1999-01-12 Thermoceramix, Llc Arc Chamber for an ion implantation system
US6022258A (en) * 1996-03-27 2000-02-08 Thermoceramix, Llc ARC chamber for an ion implantation system
US5914494A (en) * 1996-03-27 1999-06-22 Thermoceramix, Llc Arc chamber for an ion implantation system
US5760409A (en) * 1996-06-14 1998-06-02 Eaton Corporation Dose control for use in an ion implanter
US5672878A (en) * 1996-10-24 1997-09-30 Siemens Medical Systems Inc. Ionization chamber having off-passageway measuring electrodes
US5814823A (en) * 1997-07-12 1998-09-29 Eaton Corporation System and method for setecing neutral particles in an ion bean
US5861632A (en) * 1997-08-05 1999-01-19 Advanced Micro Devices, Inc. Method for monitoring the performance of an ion implanter using reusable wafers
US6020592A (en) * 1998-08-03 2000-02-01 Varian Semiconductor Equipment Associates, Inc. Dose monitor for plasma doping system
US6300643B1 (en) * 1998-08-03 2001-10-09 Varian Semiconductor Equipment Associates, Inc. Dose monitor for plasma doping system
AU2725300A (en) * 1999-01-14 2000-08-01 Quantum Manufacturing Technologies, Inc. A method and apparatus of continuously monitoring and recording parameters associated with pulsed ion beam surface treatment processes
US6507033B1 (en) * 1999-03-29 2003-01-14 The Regents Of The University Of California Versatile, high-sensitivity faraday cup array for ion implanters
US6403972B1 (en) 1999-07-08 2002-06-11 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for alignment of ion beam systems using beam current sensors
GB2355337B (en) * 1999-10-12 2004-04-14 Applied Materials Inc Ion implanter and beam stop therefor
US6521895B1 (en) 1999-10-22 2003-02-18 Varian Semiconductor Equipment Associates, Inc. Wide dynamic range ion beam scanners
US6323497B1 (en) 2000-06-02 2001-11-27 Varian Semiconductor Equipment Assoc. Method and apparatus for controlling ion implantation during vacuum fluctuation
KR100594220B1 (ko) * 2000-08-09 2006-06-30 삼성전자주식회사 이온 주입 장치
US7309997B1 (en) 2000-09-15 2007-12-18 Varian Semiconductor Equipment Associates, Inc. Monitor system and method for semiconductor processes
US6600163B2 (en) * 2000-12-22 2003-07-29 Alfred M. Halling In-process wafer charge monitor and control system for ion implanter
DE60238023D1 (de) * 2001-02-06 2010-12-02 Gsi Helmholtzzentrum Schwerionenforschung Gmbh Strahlabtastsystem für schwerionengantry
GB0120503D0 (en) * 2001-08-23 2001-10-17 Univ Glasgow Improved particle beam detector
FR2830372B1 (fr) * 2001-09-28 2008-08-22 Procede de caracterisation d'une etape d'implantation dans un substrat de materiau
US20040031934A1 (en) * 2002-08-15 2004-02-19 Hiatt William Mark System and method for monitoring ion implantation processing
US7462820B2 (en) * 2004-03-10 2008-12-09 Schubert Peter J Isotope separation process and apparatus therefor
US7102146B2 (en) * 2004-06-03 2006-09-05 Axcelis Technologies, Inc. Dose cup located near bend in final energy filter of serial implanter for closed loop dose control
US7982195B2 (en) * 2004-09-14 2011-07-19 Axcelis Technologies, Inc. Controlled dose ion implantation
US7109499B2 (en) * 2004-11-05 2006-09-19 Varian Semiconductor Equipment Associates, Inc. Apparatus and methods for two-dimensional ion beam profiling
KR100664375B1 (ko) * 2004-12-15 2007-01-02 동부일렉트로닉스 주식회사 이온 주입 장치
US7208330B2 (en) * 2005-01-12 2007-04-24 Texas Instruments Incorporated Method for varying the uniformity of a dopant as it is placed in a substrate by varying the speed of the implant across the substrate
JP3732220B1 (ja) * 2005-03-28 2006-01-05 株式会社リコー イオン注入量分布評価方法
KR100679263B1 (ko) * 2005-09-22 2007-02-05 삼성전자주식회사 페러데이 시스템 및 그를 이용한 이온주입설비
US7683348B2 (en) * 2006-10-11 2010-03-23 Axcelis Technologies, Inc. Sensor for ion implanter
US20080160170A1 (en) * 2006-12-28 2008-07-03 Varian Semiconductor Equipment Assoicates, Inc. Technique for using an improved shield ring in plasma-based ion implantation
US8097866B2 (en) * 2008-02-14 2012-01-17 Varian Semiconductor Equipment Associates, Inc. Apparatus for measuring beam characteristics and a method thereof
DE102010040324B3 (de) * 2010-09-07 2012-05-10 Asphericon Gmbh Ionenstrahlvorrichtung zur Bearbeitung eines Substrats
US8653443B2 (en) * 2011-06-29 2014-02-18 Philip James Witham Neutral particle microscope
US8581204B2 (en) * 2011-09-16 2013-11-12 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for monitoring ion implantation
US9383460B2 (en) * 2012-05-14 2016-07-05 Bwxt Nuclear Operations Group, Inc. Beam imaging sensor
US9535100B2 (en) 2012-05-14 2017-01-03 Bwxt Nuclear Operations Group, Inc. Beam imaging sensor and method for using same
KR102391971B1 (ko) * 2014-09-30 2022-04-29 세메스 주식회사 측정 유닛 및 그를 포함하는 기판 처리 장치, 그리고 측정 유닛 제조 방법
US9697989B2 (en) * 2015-02-26 2017-07-04 Taiwan Semiconductor Manufacturing Company Ltd. Method for generating parameter pattern, ion implantation method and feed forward semiconductor manufacturing method
US10553411B2 (en) 2015-09-10 2020-02-04 Taiwan Semiconductor Manufacturing Co., Ltd. Ion collector for use in plasma systems
CN112635280B (zh) * 2020-12-12 2024-02-23 北京烁科中科信电子装备有限公司 一种离子注入机束流与剂量测控装置及方法

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Publication number Priority date Publication date Assignee Title
GB1280013A (en) * 1969-09-05 1972-07-05 Atomic Energy Authority Uk Improvements in or relating to apparatus bombarding a target with ions
US3857090A (en) * 1972-06-07 1974-12-24 Nat Res Dev Generation of beams of charged particles
US4021675A (en) * 1973-02-20 1977-05-03 Hughes Aircraft Company System for controlling ion implantation dosage in electronic materials
US4011449A (en) * 1975-11-05 1977-03-08 Ibm Corporation Apparatus for measuring the beam current of charged particle beam
NL182924C (nl) * 1978-05-12 1988-06-01 Philips Nv Inrichting voor het implanteren van ionen in een trefplaat.
US4234797A (en) * 1979-05-23 1980-11-18 Nova Associates, Inc. Treating workpieces with beams
US4283631A (en) * 1980-02-22 1981-08-11 Varian Associates, Inc. Bean scanning and method of use for ion implantation
JPS56145645A (en) * 1980-04-15 1981-11-12 Toshiba Corp Ion injection device
JPS57123639A (en) * 1981-01-23 1982-08-02 Agency Of Ind Science & Technol Method for monitoring ion current for ion implantation apparatus
US4517465A (en) * 1983-03-29 1985-05-14 Veeco/Ai, Inc. Ion implantation control system
JPS60141870A (ja) * 1983-12-28 1985-07-26 Nec Corp イオン注入装置
US4539217A (en) * 1984-06-27 1985-09-03 Eaton Corporation Dose control method
US4628209A (en) * 1985-06-07 1986-12-09 Eaton Corporation Particle implantation apparatus and method

Also Published As

Publication number Publication date
US4751393A (en) 1988-06-14
KR950001252B1 (ko) 1995-02-15
EP0276229A1 (de) 1988-08-03
JPS63503340A (ja) 1988-12-02
EP0276229B1 (de) 1994-02-16
JPH0628141B2 (ja) 1994-04-13
EP0276229A4 (de) 1989-07-11
WO1987007076A1 (en) 1987-11-19
DE3789103T2 (de) 1994-09-01
KR870011674A (ko) 1987-12-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.(N.

8339 Ceased/non-payment of the annual fee