DE3772992D1 - Spannungsfreie nicht elastische montage eines druckuebertragers. - Google Patents

Spannungsfreie nicht elastische montage eines druckuebertragers.

Info

Publication number
DE3772992D1
DE3772992D1 DE8787903811T DE3772992T DE3772992D1 DE 3772992 D1 DE3772992 D1 DE 3772992D1 DE 8787903811 T DE8787903811 T DE 8787903811T DE 3772992 T DE3772992 T DE 3772992T DE 3772992 D1 DE3772992 D1 DE 3772992D1
Authority
DE
Germany
Prior art keywords
stress
free
pressure transfer
elastic installation
elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787903811T
Other languages
English (en)
Inventor
Thomas A Knecht
James Ruf
John P Schulte
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosemount Inc
Original Assignee
Rosemount Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosemount Inc filed Critical Rosemount Inc
Application granted granted Critical
Publication of DE3772992D1 publication Critical patent/DE3772992D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/145—Housings with stress relieving means
    • G01L19/146—Housings with stress relieving means using flexible element between the transducer and the support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE8787903811T 1986-06-23 1987-06-01 Spannungsfreie nicht elastische montage eines druckuebertragers. Expired - Lifetime DE3772992D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/877,278 US4800758A (en) 1986-06-23 1986-06-23 Pressure transducer with stress isolation for hard mounting
PCT/US1987/001265 WO1987007948A1 (en) 1986-06-23 1987-06-01 Pressure transducer with stress isolation for hard mounting

Publications (1)

Publication Number Publication Date
DE3772992D1 true DE3772992D1 (de) 1991-10-17

Family

ID=25369620

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787903811T Expired - Lifetime DE3772992D1 (de) 1986-06-23 1987-06-01 Spannungsfreie nicht elastische montage eines druckuebertragers.

Country Status (8)

Country Link
US (1) US4800758A (de)
EP (1) EP0311613B1 (de)
JP (2) JP2660247B2 (de)
BR (1) BR8707718A (de)
CA (1) CA1311365C (de)
DE (1) DE3772992D1 (de)
IL (1) IL82882A (de)
WO (1) WO1987007948A1 (de)

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DE4321804A1 (de) * 1993-06-30 1995-01-12 Ranco Inc Verfahren zur Herstellung von Kleinbauelementen
US5483834A (en) * 1993-09-20 1996-01-16 Rosemount Inc. Suspended diaphragm pressure sensor
WO1995008759A1 (en) * 1993-09-24 1995-03-30 Rosemount Inc. Pressure transmitter isolation diaphragm
US5424650A (en) * 1993-09-24 1995-06-13 Rosemont Inc. Capacitive pressure sensor having circuitry for eliminating stray capacitance
US5520054A (en) * 1994-03-29 1996-05-28 Rosemount Inc. Increased wall thickness for robust bond for micromachined sensor
US5637802A (en) * 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US5731522A (en) * 1997-03-14 1998-03-24 Rosemount Inc. Transmitter with isolation assembly for pressure sensor
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
US5587601A (en) * 1995-06-05 1996-12-24 Kulite Semiconductor Products, Inc. Support structure for a semiconductor pressure transducer
US5665899A (en) * 1996-02-23 1997-09-09 Rosemount Inc. Pressure sensor diagnostics in a process transmitter
US5763787A (en) * 1996-09-05 1998-06-09 Rosemont Inc. Carrier assembly for fluid sensor
US6059254A (en) * 1997-03-27 2000-05-09 Rosemount Inc. Process instrument mount
US5808205A (en) * 1997-04-01 1998-09-15 Rosemount Inc. Eccentric capacitive pressure sensor
US6029525A (en) * 1998-02-04 2000-02-29 Mks Instruments, Inc. Capacitive based pressure sensor design
US20020003274A1 (en) * 1998-08-27 2002-01-10 Janusz Bryzek Piezoresistive sensor with epi-pocket isolation
US6006607A (en) * 1998-08-31 1999-12-28 Maxim Integrated Products, Inc. Piezoresistive pressure sensor with sculpted diaphragm
DE19844808C1 (de) * 1998-09-30 2000-04-20 Bosch Gmbh Robert Drucksensorvorrichtung
US6351996B1 (en) 1998-11-12 2002-03-05 Maxim Integrated Products, Inc. Hermetic packaging for semiconductor pressure sensors
US6346742B1 (en) 1998-11-12 2002-02-12 Maxim Integrated Products, Inc. Chip-scale packaged pressure sensor
US6229190B1 (en) 1998-12-18 2001-05-08 Maxim Integrated Products, Inc. Compensated semiconductor pressure sensor
US6255728B1 (en) 1999-01-15 2001-07-03 Maxim Integrated Products, Inc. Rigid encapsulation package for semiconductor devices
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
DE60108217T2 (de) 2000-01-06 2005-12-29 Rosemount Inc., Eden Prairie Kornwachstumsverfahren zur herstellung einer elektrischen verbindung für mikroelektromechanische systeme (mems)
US6505516B1 (en) 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
US6848316B2 (en) * 2002-05-08 2005-02-01 Rosemount Inc. Pressure sensor assembly
US6768196B2 (en) * 2002-09-04 2004-07-27 Analog Devices, Inc. Packaged microchip with isolation
US7166911B2 (en) 2002-09-04 2007-01-23 Analog Devices, Inc. Packaged microchip with premolded-type package
US20040041254A1 (en) * 2002-09-04 2004-03-04 Lewis Long Packaged microchip
US6946742B2 (en) * 2002-12-19 2005-09-20 Analog Devices, Inc. Packaged microchip with isolator having selected modulus of elasticity
US20050056870A1 (en) * 2002-12-19 2005-03-17 Karpman Maurice S. Stress sensitive microchip with premolded-type package
SE525538C2 (sv) * 2003-07-18 2005-03-08 Radi Medical Systems Sensor- och styrtrådsanordning för intravaskulär mätning av fysiologiska variabler
AU2004202234B2 (en) * 2003-07-18 2009-12-17 St. Jude Medical Coordination Center Bvba Sensor and guide wire assembly
DE10349540A1 (de) * 2003-10-22 2005-05-25 Endress + Hauser Gmbh + Co. Kg Halbleiterdrucksensor und Verfahren zu seiner Herstellung
FR2881224B1 (fr) * 2005-01-21 2007-11-23 Auxitrol Sa Sa Ensemble de detection de la pression absolue d'un fluide
US20070013014A1 (en) * 2005-05-03 2007-01-18 Shuwen Guo High temperature resistant solid state pressure sensor
US7622782B2 (en) * 2005-08-24 2009-11-24 General Electric Company Pressure sensors and methods of making the same
US7661318B2 (en) * 2006-02-27 2010-02-16 Auxitrol S.A. Stress isolated pressure sensing die, sensor assembly inluding said die and methods for manufacturing said die and said assembly
ATE503988T1 (de) * 2006-02-27 2011-04-15 Auxitrol Sa Spannungsisolierter drucksensorchip
WO2008003051A2 (en) * 2006-06-29 2008-01-03 Analog Devices, Inc. Stress mitigation in packaged microchips
US7694610B2 (en) * 2007-06-27 2010-04-13 Siemens Medical Solutions Usa, Inc. Photo-multiplier tube removal tool
US7798010B2 (en) * 2007-10-11 2010-09-21 Honeywell International Inc. Sensor geometry for improved package stress isolation
WO2009108230A1 (en) * 2007-12-13 2009-09-03 The Timken Company Sensor module with stress isolated temperature compensation and method of manufacture
US8614491B2 (en) * 2009-04-07 2013-12-24 Honeywell International Inc. Package interface plate for package isolation structures
DE102009046692A1 (de) * 2009-11-13 2011-05-19 Endress + Hauser Gmbh + Co. Kg Druck-Messeinrichtung
EP2671218B1 (de) 2011-01-31 2017-08-02 BAE Systems PLC Anordnung und verfahren zur montage eines aktiven elementes auf einem festen substrat
JP6051873B2 (ja) * 2013-01-09 2016-12-27 株式会社デンソー 物理量センサおよびその製造方法
US9676614B2 (en) 2013-02-01 2017-06-13 Analog Devices, Inc. MEMS device with stress relief structures
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
US10131538B2 (en) 2015-09-14 2018-11-20 Analog Devices, Inc. Mechanically isolated MEMS device
DE102016107856A1 (de) * 2016-04-28 2017-11-02 Endress + Hauser Gmbh + Co. Kg Druckmesseinrichtung
US10481025B2 (en) 2017-01-26 2019-11-19 Rosemount Aerospace Inc. Piezoresistive sensor with spring flexures for stress isolation
EP3586148B1 (de) 2017-05-08 2022-06-29 Safran Colibrys SA Entkopplungsstruktur für beschleunigungsmesser
US11153985B2 (en) * 2017-06-29 2021-10-19 Rosemount Inc. Modular hybrid circuit packaging
DE102017127704A1 (de) 2017-11-23 2019-05-23 Endress+Hauser SE+Co. KG Druckmesseinrichtung
JP6810680B2 (ja) * 2017-12-20 2021-01-06 株式会社鷺宮製作所 圧力センサ
WO2019222598A1 (en) 2018-05-17 2019-11-21 Rosemount Inc. Measuring element and measuring device comprising the same
CN109738098A (zh) * 2018-12-29 2019-05-10 菲比蓝科技(深圳)有限公司 压力传感器及其形成方法
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components
CN112082681B (zh) * 2020-09-18 2021-11-23 重庆齿轮箱有限责任公司 一种风电主齿轮箱无应力安装方法
US11607589B1 (en) 2020-10-01 2023-03-21 Mark E. Van Denend Device for accurately measuring string bed stiffness in a racket
US11692895B2 (en) * 2021-03-30 2023-07-04 Rosemount Aerospace Inc. Differential pressure sensor

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JPS5365089A (en) * 1976-11-24 1978-06-10 Toshiba Corp Semiconductor pressure transducer
DE2709858B2 (de) * 1977-03-07 1979-01-04 Hebel Gasbetonwerk Gmbh, 8080 Emmering Verfahren zur Herstellung von dampfgehärtetem Gasbeton
JPS6022638B2 (ja) * 1977-06-24 1985-06-03 富士写真フイルム株式会社 記録材料
JPS54131892A (en) * 1978-04-05 1979-10-13 Hitachi Ltd Semiconductor pressure converter
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JPS58146827A (ja) * 1982-02-25 1983-09-01 Fuji Electric Co Ltd 半導体式圧力センサ
JPS59100833A (ja) * 1982-11-30 1984-06-11 Shimadzu Corp 半導体圧力センサ
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DE3313261A1 (de) * 1983-04-13 1984-10-25 Ermeto Armaturen Gmbh, 4800 Bielefeld Sensor
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JPS59217126A (ja) * 1983-05-25 1984-12-07 Mitsubishi Electric Corp 絶対圧形半導体圧力変換素子
US4536820A (en) * 1984-03-29 1985-08-20 General Signal Corporation Electrical feedthrough means for pressure transducer
DE3436440A1 (de) * 1984-10-04 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Halbleiter-messeinrichtung

Also Published As

Publication number Publication date
CA1311365C (en) 1992-12-15
IL82882A0 (en) 1987-12-20
IL82882A (en) 1991-05-12
EP0311613A4 (de) 1989-04-27
JPH102824A (ja) 1998-01-06
EP0311613B1 (de) 1991-09-11
BR8707718A (pt) 1989-08-15
JP2660247B2 (ja) 1997-10-08
JPH01503002A (ja) 1989-10-12
EP0311613A1 (de) 1989-04-19
WO1987007948A1 (en) 1987-12-30
US4800758A (en) 1989-01-31
JP2775430B2 (ja) 1998-07-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition