DE3771884D1 - Loetvorrichtung. - Google Patents

Loetvorrichtung.

Info

Publication number
DE3771884D1
DE3771884D1 DE8787300791T DE3771884T DE3771884D1 DE 3771884 D1 DE3771884 D1 DE 3771884D1 DE 8787300791 T DE8787300791 T DE 8787300791T DE 3771884 T DE3771884 T DE 3771884T DE 3771884 D1 DE3771884 D1 DE 3771884D1
Authority
DE
Germany
Prior art keywords
pick
pcb
surrounding
component
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787300791T
Other languages
English (en)
Inventor
Richard Ian Todd
Robert Charles Claydon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
General Electric Co
Original Assignee
General Electric Co PLC
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB868602504A external-priority patent/GB8602504D0/en
Application filed by General Electric Co PLC, General Electric Co filed Critical General Electric Co PLC
Application granted granted Critical
Publication of DE3771884D1 publication Critical patent/DE3771884D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
DE8787300791T 1986-02-01 1987-01-29 Loetvorrichtung. Expired - Fee Related DE3771884D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB868602504A GB8602504D0 (en) 1986-02-01 1986-02-01 Soldering device
GB8617240A GB2186222B (en) 1986-02-01 1986-07-15 Unsoldering device

Publications (1)

Publication Number Publication Date
DE3771884D1 true DE3771884D1 (de) 1991-09-12

Family

ID=26290309

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787300791T Expired - Fee Related DE3771884D1 (de) 1986-02-01 1987-01-29 Loetvorrichtung.

Country Status (5)

Country Link
US (1) US4767047A (de)
EP (1) EP0233018B1 (de)
AT (1) ATE65951T1 (de)
DE (1) DE3771884D1 (de)
GR (1) GR3002444T3 (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4934920A (en) * 1987-06-17 1990-06-19 Mitsubishi Denki Kabushiki Kaisha Apparatus for producing semiconductor device
DE3873218D1 (de) * 1987-08-31 1992-09-03 Siemens Ag Verfahren zum ausloeten von aufgeklebten smd-bauteilen.
US4899920A (en) * 1988-02-22 1990-02-13 Pace Incorporated Apparatus for removal and installing electronic components with respect to a substrate
US4972990A (en) * 1988-02-22 1990-11-27 Pace Incorporated Apparatus for removal and installing electronic components with respect to a substrate
US5232144A (en) * 1992-06-26 1993-08-03 Motorola, Inc. Apparatus for tape automated bonding
DE9304784U1 (de) * 1993-03-29 1993-08-05 Cooper Tools GmbH, 74354 Besigheim Löt-/Entlötvorrichtung, insbesondere für integrierte Schaltungen
US5380982A (en) * 1993-07-23 1995-01-10 Fortune; William S. Metallic conduction - hot gas soldering-desoldering system
US5419481A (en) * 1993-09-21 1995-05-30 Air-Vac Engineering Company, Inc. Process and apparatus for attaching/deataching land grid array components
US5553768A (en) * 1993-09-21 1996-09-10 Air-Vac Engineering Company, Inc. Heat-control process and apparatus for attachment/detachment of soldered components
US5556024A (en) * 1994-09-29 1996-09-17 International Business Machines Corporation Apparatus and method for removing known good die using hot shear process
US5598965A (en) * 1994-11-03 1997-02-04 Scheu; William E. Integrated circuit, electronic component chip removal and replacement system
US5553766A (en) * 1994-11-21 1996-09-10 International Business Machines Corporation In-situ device removal for multi-chip modules
US5560531A (en) * 1994-12-14 1996-10-01 O.K. Industries, Inc. Reflow minioven for electrical component
US5605277A (en) * 1994-12-20 1997-02-25 International Business Machines Corporation Hot vacuum device removal process and apparatus
US6448169B1 (en) * 1995-12-21 2002-09-10 International Business Machines Corporation Apparatus and method for use in manufacturing semiconductor devices
US5735450A (en) * 1996-06-21 1998-04-07 International Business Machines Corporation Apparatus and method for heating a board-mounted electrical module for rework
US5810241A (en) * 1996-09-16 1998-09-22 International Business Machines Corporation Solder bonding/debonding nozzle insert
DE29621604U1 (de) * 1996-12-12 1998-01-02 Cooper Tools GmbH, 74354 Besigheim Löt-/Entlötvorrichtung
KR19990025445A (ko) * 1997-09-12 1999-04-06 구본준 반도체 패키지용 리페어 장치의 노즐 구조
US6247630B1 (en) * 1997-12-17 2001-06-19 Sun Microsystems, Inc. Apparatus and method for uniformly melting the solder attaching a surface mount device to a printed circuit board
DE19903957B4 (de) * 1999-01-25 2008-05-21 Finetech Gmbh & Co.Kg Verfahren und Vorrichtung zum Entfernen von Lot
US6220503B1 (en) * 1999-02-02 2001-04-24 International Business Machines Corporation Rework and underfill nozzle for electronic components
USD424588S (en) * 1999-02-22 2000-05-09 Metcal, Inc. Soldering and desoldering tool
US6201930B1 (en) 1999-02-22 2001-03-13 Metcal, Inc. Chip removal and replacement system
USD426524S (en) * 1999-02-22 2000-06-13 Metcal, Inc. Circuit board holder
USD424077S (en) * 1999-02-22 2000-05-02 Metcal, Inc. Soldering and desoldering tool controller
US6227437B1 (en) * 1999-08-24 2001-05-08 Kulicke & Soffa Industries Inc. Solder ball delivery and reflow apparatus and method of using the same
US6386433B1 (en) 1999-08-24 2002-05-14 Kulicke & Soffa Investments, Inc. Solder ball delivery and reflow apparatus and method
US6131791A (en) * 1999-12-06 2000-10-17 Hakko Corporation Soldering and desoldering device with improved pickup device
US6360934B1 (en) * 2000-02-10 2002-03-26 Sun Microsystems, Inc. Apparatus and method for removing a soldered device from a printed circuit board
US6360940B1 (en) * 2000-11-08 2002-03-26 International Business Machines Corporation Method and apparatus for removing known good die
US6761304B2 (en) 2000-11-13 2004-07-13 Czeslaw A. Ruszowski Heating head for soldering and de-soldering of SMD components
US6550669B1 (en) * 2001-10-04 2003-04-22 Genrad, Inc. Integral heating nozzle and pickup tube
US6772813B2 (en) * 2002-12-23 2004-08-10 Freescale Semiconductor, Inc. Removable heated end effector
US6915563B2 (en) 2003-06-27 2005-07-12 International Business Machines Corporation Apparatus for removing attached die
JP4519614B2 (ja) * 2004-11-19 2010-08-04 富士通株式会社 回路チップパッケージ用取り外し治具
US20070253179A1 (en) * 2006-04-27 2007-11-01 Briggs Randall D Method and apparatus for removing surface mount device from printed circuit board
EP2268442A4 (de) * 2008-03-24 2012-12-19 Vapor Works Inc Dampfphasenaufbereitungsstation und verfahren
US9302277B2 (en) * 2012-06-29 2016-04-05 International Business Machines Corporation Component rework nozzle
US10563920B2 (en) * 2014-12-08 2020-02-18 Raytheon Company Oven-style nozzle for reworking operations involving bottom-side terminated components or other components
US10475763B2 (en) * 2015-05-26 2019-11-12 Asm Technology Singapore Pte Ltd Die bonding apparatus comprising an inert gas environment
CN109551071A (zh) * 2019-01-03 2019-04-02 南通理工学院 一种半封闭空间焊接装置
US11278977B2 (en) 2019-10-22 2022-03-22 International Business Machines Corporation Liquid metal infiltration rework of electronic assembly
US11310950B2 (en) 2019-10-22 2022-04-19 International Business Machines Corporation Liquid metal infiltration rework of electronic assembly

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3731867A (en) * 1971-07-19 1973-05-08 Motorola Inc Vacuum die sensor apparatus and method for a semiconductor die bonding machine
US4295596A (en) * 1979-12-19 1981-10-20 Western Electric Company, Inc. Methods and apparatus for bonding an article to a metallized substrate
US4426571A (en) * 1980-06-19 1984-01-17 Sperry Corporation Portable electric hot air rework tool for soldering and desoldering printed circuit assemblies
US4444559A (en) * 1982-06-28 1984-04-24 International Business Machines Corporation Process and apparatus for unsoldering solder bonded semiconductor devices
US4552300A (en) * 1983-05-09 1985-11-12 Pace, Incorporated Method and apparatus for soldering and desoldering leadless semiconductor modules for printed wiring boards
US4610388A (en) * 1984-02-24 1986-09-09 Eldon Industries, Inc. Circuit board and component manipulation device
US4605152A (en) * 1984-02-24 1986-08-12 Pace, Incorporated Device for attaching modular electronic components to or removing them from an insulative substrate
US4659004A (en) * 1984-02-24 1987-04-21 Pace, Incorporated Device for attaching modular electronic components to or removing them from an insulative device
US4620659A (en) * 1984-04-02 1986-11-04 Pace, Incorporated Device for attaching modular electronic components to or removing them from an insulative substrate

Also Published As

Publication number Publication date
GR3002444T3 (en) 1992-12-30
EP0233018A3 (en) 1989-01-11
EP0233018B1 (de) 1991-08-07
ATE65951T1 (de) 1991-08-15
US4767047A (en) 1988-08-30
EP0233018A2 (de) 1987-08-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee