ES2000646A6 - Procedimiento y dispositivo para soldar un terminal sobre un circuito electrico soportado por una placa de vidrio - Google Patents
Procedimiento y dispositivo para soldar un terminal sobre un circuito electrico soportado por una placa de vidrioInfo
- Publication number
- ES2000646A6 ES2000646A6 ES8600135A ES8600135A ES2000646A6 ES 2000646 A6 ES2000646 A6 ES 2000646A6 ES 8600135 A ES8600135 A ES 8600135A ES 8600135 A ES8600135 A ES 8600135A ES 2000646 A6 ES2000646 A6 ES 2000646A6
- Authority
- ES
- Spain
- Prior art keywords
- electric circuit
- glass sheet
- cable terminal
- soldering
- borne
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating processes for reflow soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
EL PROCEDIMIENTO DESCRITO COMPRENDE DISPONER SOLDADURA (6) Y UN TERMINAL (3) EN CONTACTO CON UN CIRCUITO ELECTRICO (2) LLEVADO POR UNA PLACA DE VIDRIO (1) Y FUNDIR LA SOLDADURA POR MEDIO DE GAS CALIENTE SOPLADO SOBRE EL TERMINAL Y UNA PARTE ADYACENTE DE LA PLACA DE VIDRIO, TRAS LO CUAL SE ENFRIAN EL TERMINAL Y LA PARTE ADYACENTE DE LA PLACA DE VIDRIO POR MEDIO DE UN CHORRO DE GAS A TEMPERATURA INFERIOR A LA DE FUSION DE LA SOLDADURA. EL DISPOSITIVO PARA EJECUTAR ESTE PROCEDIMIENTO COMPRENDE UNA BOQUILLA DE CALENTAMIENTO (11) PARA SOPLAR EL GAS CALIENTE, UNA BOQUILLA DE REFRIGERACION (12) PARA SOPLAR EL GAS DE REFRIGERACION, MEDIOS DE ALIMENTACION DE SOLDADURA Y MEDIOS DE ALIMENTACI''ON Y POSICIONALMIENTO DEL TERMINAL SOBRE UNA PARTE DEL CIRCUITO ELECTRICO. EL INVENTO ES APLICABLE AL CIRCUITO CALENTADOR DE LA LUNETA TRASERA DE LOS AUTOMOVILES.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8510329A FR2584325B1 (fr) | 1985-07-05 | 1985-07-05 | Procede et dispositif de soudage d'une cosse sur un circuit electrique porte par une plaque de verre |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2000646A6 true ES2000646A6 (es) | 1988-03-16 |
Family
ID=9321016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES8600135A Expired ES2000646A6 (es) | 1985-07-05 | 1986-07-04 | Procedimiento y dispositivo para soldar un terminal sobre un circuito electrico soportado por una placa de vidrio |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0211708A1 (es) |
| DE (1) | DE211708T1 (es) |
| ES (1) | ES2000646A6 (es) |
| FR (1) | FR2584325B1 (es) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4937006A (en) * | 1988-07-29 | 1990-06-26 | International Business Machines Corporation | Method and apparatus for fluxless solder bonding |
| JPH03136340A (ja) * | 1989-10-23 | 1991-06-11 | Shinkawa Ltd | ワイヤボンデイング方法及び装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3653572A (en) * | 1969-09-05 | 1972-04-04 | Ibm | Hot gas solder removal |
| NL6918814A (es) * | 1969-12-16 | 1971-06-18 | ||
| GB1461494A (en) * | 1974-04-04 | 1977-01-13 | Asahi Glass Co Ltd | Apparatus and method for sealing components in tubes |
| GB2137130A (en) * | 1983-03-15 | 1984-10-03 | Glaverbel | Apparatus for soldering connector terminals |
-
1985
- 1985-07-05 FR FR8510329A patent/FR2584325B1/fr not_active Expired
-
1986
- 1986-06-25 EP EP86401396A patent/EP0211708A1/fr not_active Withdrawn
- 1986-06-25 DE DE198686401396T patent/DE211708T1/de active Pending
- 1986-07-04 ES ES8600135A patent/ES2000646A6/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2584325B1 (fr) | 1989-07-21 |
| DE211708T1 (de) | 1987-07-02 |
| EP0211708A1 (fr) | 1987-02-25 |
| FR2584325A1 (fr) | 1987-01-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FD1A | Patent lapsed |
Effective date: 20000131 |