DE3770559D1 - Anordnung zur positionierung und synchronisation eines schreiblaserstrahls. - Google Patents

Anordnung zur positionierung und synchronisation eines schreiblaserstrahls.

Info

Publication number
DE3770559D1
DE3770559D1 DE8787810500T DE3770559T DE3770559D1 DE 3770559 D1 DE3770559 D1 DE 3770559D1 DE 8787810500 T DE8787810500 T DE 8787810500T DE 3770559 T DE3770559 T DE 3770559T DE 3770559 D1 DE3770559 D1 DE 3770559D1
Authority
DE
Germany
Prior art keywords
laser beam
semiconductor chip
mark
writing laser
synchronizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787810500T
Other languages
German (de)
English (en)
Inventor
Meinrad Kempter
Elko Doering
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LASARRAY HOLDING AG
Original Assignee
LASARRAY HOLDING AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LASARRAY HOLDING AG filed Critical LASARRAY HOLDING AG
Application granted granted Critical
Publication of DE3770559D1 publication Critical patent/DE3770559D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P34/00—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/01—Details
    • G06K7/015—Aligning or centering of the sensing device with respect to the record carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H10W46/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Laser Beam Printer (AREA)
  • Laser Beam Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE8787810500T 1986-09-22 1987-09-01 Anordnung zur positionierung und synchronisation eines schreiblaserstrahls. Expired - Fee Related DE3770559D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH3781/86A CH670592A5 (OSRAM) 1986-09-22 1986-09-22

Publications (1)

Publication Number Publication Date
DE3770559D1 true DE3770559D1 (de) 1991-07-11

Family

ID=4263345

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787810500T Expired - Fee Related DE3770559D1 (de) 1986-09-22 1987-09-01 Anordnung zur positionierung und synchronisation eines schreiblaserstrahls.

Country Status (10)

Country Link
US (1) US4809014A (OSRAM)
EP (1) EP0262088B1 (OSRAM)
JP (1) JPS6394622A (OSRAM)
KR (1) KR880004559A (OSRAM)
AT (1) ATE64238T1 (OSRAM)
CA (1) CA1278392C (OSRAM)
CH (1) CH670592A5 (OSRAM)
DE (1) DE3770559D1 (OSRAM)
IL (1) IL83969A (OSRAM)
ZA (1) ZA876229B (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4927226A (en) * 1989-03-27 1990-05-22 General Electric Company Multiplexer for high power CW lasers
JP2004200221A (ja) * 2002-12-16 2004-07-15 Toray Eng Co Ltd レーザマーキング方法及び装置
US20050087520A1 (en) * 2003-10-28 2005-04-28 Lixiao Wang Method and apparatus for selective ablation of coatings from medical devices
US7315038B2 (en) * 2005-08-26 2008-01-01 Electro Scientific Industries, Inc. Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target
US7297972B2 (en) * 2005-08-26 2007-11-20 Electro Scientific Industries, Inc. Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
WO2011097453A1 (en) * 2010-02-04 2011-08-11 Echelon Laser Systems, Lp Laser etching system and method
CN110945517A (zh) * 2017-07-27 2020-03-31 罗伯特·博世有限公司 用于实现探测功能的设备以及用于运行这种设备的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4134066A (en) * 1977-03-24 1979-01-09 International Business Machines Corporation Wafer indexing system using a grid pattern and coding and orientation marks in each grid cell
DE3123031A1 (de) * 1981-06-10 1983-01-05 Siemens AG, 1000 Berlin und 8000 München Verfahren zur kennzeichnung von halbleiterchips und kennzeichenbarer halbleiterchip
US4695698A (en) * 1984-07-10 1987-09-22 Larassay Holding Ag Method of, and apparatus for, generating a predetermined pattern using laser radiation
DE3427611A1 (de) * 1984-07-26 1988-06-09 Bille Josef Laserstrahl-lithograph

Also Published As

Publication number Publication date
EP0262088A1 (de) 1988-03-30
IL83969A (en) 1991-06-30
CA1278392C (en) 1990-12-27
CH670592A5 (OSRAM) 1989-06-30
IL83969A0 (en) 1988-02-29
US4809014A (en) 1989-02-28
KR880004559A (ko) 1988-06-04
JPS6394622A (ja) 1988-04-25
EP0262088B1 (de) 1991-06-05
ZA876229B (en) 1988-03-01
ATE64238T1 (de) 1991-06-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee