DE3750076D1 - Verfahren zur Veränderung der Eigenschften von Halbleitern. - Google Patents
Verfahren zur Veränderung der Eigenschften von Halbleitern.Info
- Publication number
- DE3750076D1 DE3750076D1 DE3750076T DE3750076T DE3750076D1 DE 3750076 D1 DE3750076 D1 DE 3750076D1 DE 3750076 T DE3750076 T DE 3750076T DE 3750076 T DE3750076 T DE 3750076T DE 3750076 D1 DE3750076 D1 DE 3750076D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductors
- changing
- properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/182—Intermixing or interdiffusion or disordering of III-V heterostructures, e.g. IILD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/2636—Bombardment with radiation with high-energy radiation for heating, e.g. electron beam heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2059—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3428—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers layer orientation perpendicular to the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/933,666 US4771010A (en) | 1986-11-21 | 1986-11-21 | Energy beam induced layer disordering (EBILD) |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3750076D1 true DE3750076D1 (de) | 1994-07-21 |
DE3750076T2 DE3750076T2 (de) | 1995-01-05 |
Family
ID=25464329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3750076T Expired - Fee Related DE3750076T2 (de) | 1986-11-21 | 1987-11-18 | Verfahren zur Veränderung der Eigenschften von Halbleitern. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4771010A (de) |
EP (1) | EP0269359B1 (de) |
JP (1) | JP2608567B2 (de) |
DE (1) | DE3750076T2 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4786951A (en) * | 1985-02-12 | 1988-11-22 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor optical element and a process for producing the same |
US4871690A (en) * | 1986-01-21 | 1989-10-03 | Xerox Corporation | Semiconductor structures utilizing semiconductor support means selectively pretreated with migratory defects |
JPH0748560B2 (ja) * | 1986-11-18 | 1995-05-24 | 株式会社東芝 | 半導体受光装置の製造方法 |
JPH073908B2 (ja) * | 1987-07-16 | 1995-01-18 | 三菱電機株式会社 | 半導体発光装置の製造方法 |
JP2650930B2 (ja) * | 1987-11-24 | 1997-09-10 | 株式会社日立製作所 | 超格子構作の素子製作方法 |
JPH01143285A (ja) * | 1987-11-28 | 1989-06-05 | Mitsubishi Electric Corp | 半導体超格子の無秩序化方法及び半導体レーザ装置 |
JPH0775265B2 (ja) * | 1988-02-02 | 1995-08-09 | 三菱電機株式会社 | 半導体レーザおよびその製造方法 |
US4870652A (en) * | 1988-07-08 | 1989-09-26 | Xerox Corporation | Monolithic high density arrays of independently addressable semiconductor laser sources |
US4883769A (en) * | 1988-08-18 | 1989-11-28 | The United States Of America As Represented By The Secretary Of The Army | Method of making a multidimensional quantum-well array |
US5031185A (en) * | 1988-11-17 | 1991-07-09 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having a disordered superlattice |
JPH02196486A (ja) * | 1989-01-24 | 1990-08-03 | Mitsubishi Electric Corp | 半導体レーザの製造方法 |
US5563094A (en) * | 1989-03-24 | 1996-10-08 | Xerox Corporation | Buried reverse bias junction configurations in semiconductor structures employing photo induced evaporation enhancement during in situ epitaxial growth and device structures utilizing the same |
US5013684A (en) * | 1989-03-24 | 1991-05-07 | Xerox Corporation | Buried disordering sources in semiconductor structures employing photo induced evaporation enhancement during in situ epitaxial growth |
DE3914001A1 (de) * | 1989-04-27 | 1990-10-31 | Siemens Ag | Halbleiterlaser mit eingepraegtem modenspektrum und verfahren zu dessen herstellung |
US5238868A (en) * | 1989-11-30 | 1993-08-24 | Gte Laboratories Incorporated | Bandgap tuning of semiconductor quantum well structures |
US5102825A (en) * | 1990-01-25 | 1992-04-07 | The United States Of America As Represented By The United States Department Of Energy | Method of making an ion-implanted planar-buried-heterostructure diode laser |
US5126281A (en) * | 1990-09-11 | 1992-06-30 | Hewlett-Packard Company | Diffusion using a solid state source |
US5225368A (en) * | 1991-02-08 | 1993-07-06 | The United States Of America As Represented By The United States Department Of Energy | Method of producing strained-layer semiconductor devices via subsurface-patterning |
FR2675308A1 (fr) * | 1991-04-12 | 1992-10-16 | Thomson Csf | Procede de realisation de dispositifs optoelectroniques a semiconducteurs. |
US5225371A (en) * | 1992-03-17 | 1993-07-06 | The United States Of America As Represented By The Secretary Of The Navy | Laser formation of graded junction devices |
US5721150A (en) * | 1993-10-25 | 1998-02-24 | Lsi Logic Corporation | Use of silicon for integrated circuit device interconnection by direct writing of patterns therein |
JPH07162086A (ja) * | 1993-12-10 | 1995-06-23 | Mitsubishi Electric Corp | 半導体レーザの製造方法 |
US5395793A (en) * | 1993-12-23 | 1995-03-07 | National Research Council Of Canada | Method of bandgap tuning of semiconductor quantum well structures |
US5451552A (en) * | 1994-05-13 | 1995-09-19 | Hughes Aircraft Company | Method for improvement of optical quality and reduction of background doping in gainSB/INAS superlattices |
US5883000A (en) * | 1995-05-03 | 1999-03-16 | Lsi Logic Corporation | Circuit device interconnection by direct writing of patterns therein |
US5682455A (en) * | 1996-02-29 | 1997-10-28 | Northern Telecom Limited | Semiconductor optical waveguide |
US5841179A (en) * | 1996-08-28 | 1998-11-24 | Advanced Micro Devices, Inc. | Conductive layer with anti-reflective surface portion |
DE19934089A1 (de) * | 1999-07-19 | 2001-01-25 | Univ Schiller Jena | Verfahren zur Erzeugung elektrisch leitender Bereiche in mehrkomponentigen Materialien |
US6878562B2 (en) | 2000-10-20 | 2005-04-12 | Phosistor Technologies, Incorporated | Method for shifting the bandgap energy of a quantum well layer |
US6878959B2 (en) * | 2002-11-22 | 2005-04-12 | Agilent Technologies, Inc. | Group III-V semiconductor devices including semiconductor materials made by spatially-selective intermixing of atoms on the group V sublattice |
US7209506B2 (en) | 2003-07-31 | 2007-04-24 | Osram Opto Semiconductors Gmbh | Optically pumped semiconductor device and method for producing it |
DE10341085A1 (de) * | 2003-07-31 | 2005-03-03 | Osram Opto Semiconductors Gmbh | Optisch gepumpte Halbleitervorrichtung und Verfahren zu deren Herstellung |
GB0509727D0 (en) * | 2005-05-13 | 2005-06-22 | Renishaw Plc | Method and apparatus for scale manufacture |
DE102010010813A1 (de) * | 2010-03-03 | 2011-09-08 | Centrotherm Photovoltaics Ag | Verfahren zur Dotierung eines Halbleitersubstrats und Solarzelle mit zweistufiger Dotierung |
US8542437B1 (en) * | 2010-03-09 | 2013-09-24 | Translucent, Inc. | Earth abundant photonic structures |
EP3745471A1 (de) * | 2019-05-31 | 2020-12-02 | OSRAM Opto Semiconductors GmbH | Verfahren zur laserbehandlung eines halbleiterwafers mit algainp-leds zur erhöhung ihrer lichterzeugungseffizienz |
CN113300211B (zh) * | 2021-06-24 | 2022-07-15 | 西安嘉合超亿光电科技有限公司 | 半导体激光器封装结构及其制备方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4151008A (en) * | 1974-11-15 | 1979-04-24 | Spire Corporation | Method involving pulsed light processing of semiconductor devices |
US4159414A (en) * | 1978-04-25 | 1979-06-26 | Massachusetts Institute Of Technology | Method for forming electrically conductive paths |
US4181538A (en) * | 1978-09-26 | 1980-01-01 | The United States Of America As Represented By The United States Department Of Energy | Method for making defect-free zone by laser-annealing of doped silicon |
NL7904580A (nl) * | 1979-06-12 | 1980-12-16 | Philips Nv | Inrichting voor het schrijven van patronen in een laag op een substraat met een bundel elektrisch geladen deeltjes. |
US4318752A (en) * | 1980-05-16 | 1982-03-09 | Bell Telephone Laboratories, Incorporated | Heterojunction semiconductor laser fabrication utilizing laser radiation |
US4340617A (en) * | 1980-05-19 | 1982-07-20 | Massachusetts Institute Of Technology | Method and apparatus for depositing a material on a surface |
US4330363A (en) * | 1980-08-28 | 1982-05-18 | Xerox Corporation | Thermal gradient control for enhanced laser induced crystallization of predefined semiconductor areas |
US4511408A (en) * | 1982-04-22 | 1985-04-16 | The Board Of Trustees Of The University Of Illinois | Semiconductor device fabrication with disordering elements introduced into active region |
US4378255A (en) * | 1981-05-06 | 1983-03-29 | University Of Illinois Foundation | Method for producing integrated semiconductor light emitter |
US4388145A (en) * | 1981-10-29 | 1983-06-14 | Xerox Corporation | Laser annealing for growth of single crystal semiconductor areas |
US4639275A (en) * | 1982-04-22 | 1987-01-27 | The Board Of Trustees Of The University Of Illinois | Forming disordered layer by controlled diffusion in heterojunction III-V semiconductor |
US4578127A (en) * | 1982-08-13 | 1986-03-25 | At&T Bell Laboratories | Method of making an improved group III-V semiconductor device utilizing a getter-smoothing layer |
US4542580A (en) * | 1983-02-14 | 1985-09-24 | Prime Computer, Inc. | Method of fabricating n-type silicon regions and associated contacts |
US4585299A (en) * | 1983-07-19 | 1986-04-29 | Fairchild Semiconductor Corporation | Process for fabricating optical wave-guiding components and components made by the process |
US4671830A (en) * | 1984-01-03 | 1987-06-09 | Xerox Corporation | Method of controlling the modeling of the well energy band profile by interdiffusion |
US4505949A (en) * | 1984-04-25 | 1985-03-19 | Texas Instruments Incorporated | Thin film deposition using plasma-generated source gas |
JPS60251631A (ja) * | 1984-05-28 | 1985-12-12 | Semiconductor Res Found | 不均一不純物密度分布を有する半導体装置の製造方法 |
US4543270A (en) * | 1984-06-20 | 1985-09-24 | Gould Inc. | Method for depositing a micron-size metallic film on a transparent substrate utilizing a visible laser |
US4731789A (en) * | 1985-05-13 | 1988-03-15 | Xerox Corporation | Clad superlattice semiconductor laser |
US4654090A (en) * | 1985-09-13 | 1987-03-31 | Xerox Corporation | Selective disordering of well structures by laser annealing |
JPS62257782A (ja) * | 1986-05-01 | 1987-11-10 | Mitsubishi Electric Corp | 半導体の加工方法 |
-
1986
- 1986-11-21 US US06/933,666 patent/US4771010A/en not_active Expired - Fee Related
-
1987
- 1987-11-13 JP JP62287209A patent/JP2608567B2/ja not_active Expired - Lifetime
- 1987-11-18 DE DE3750076T patent/DE3750076T2/de not_active Expired - Fee Related
- 1987-11-18 EP EP87310162A patent/EP0269359B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0269359B1 (de) | 1994-06-15 |
DE3750076T2 (de) | 1995-01-05 |
EP0269359A2 (de) | 1988-06-01 |
US4771010A (en) | 1988-09-13 |
JP2608567B2 (ja) | 1997-05-07 |
JPS63197396A (ja) | 1988-08-16 |
EP0269359A3 (en) | 1989-03-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |