DE3739964A1 - Led-anordnungs-kopf - Google Patents

Led-anordnungs-kopf

Info

Publication number
DE3739964A1
DE3739964A1 DE19873739964 DE3739964A DE3739964A1 DE 3739964 A1 DE3739964 A1 DE 3739964A1 DE 19873739964 DE19873739964 DE 19873739964 DE 3739964 A DE3739964 A DE 3739964A DE 3739964 A1 DE3739964 A1 DE 3739964A1
Authority
DE
Germany
Prior art keywords
led
substrate
light
led arrangement
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19873739964
Other languages
German (de)
English (en)
Inventor
Makoto Tomoyori
Masashi Fuse
Shinji Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of DE3739964A1 publication Critical patent/DE3739964A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Laser Beam Printer (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Dot-Matrix Printers And Others (AREA)
DE19873739964 1986-11-27 1987-11-25 Led-anordnungs-kopf Ceased DE3739964A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986182595U JPH059698Y2 (enExample) 1986-11-27 1986-11-27

Publications (1)

Publication Number Publication Date
DE3739964A1 true DE3739964A1 (de) 1988-06-09

Family

ID=16121031

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873739964 Ceased DE3739964A1 (de) 1986-11-27 1987-11-25 Led-anordnungs-kopf

Country Status (3)

Country Link
US (1) US4827290A (enExample)
JP (1) JPH059698Y2 (enExample)
DE (1) DE3739964A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3829553A1 (de) * 1987-09-02 1989-03-16 Alps Electric Co Ltd Optischer aufzeichnungskopf
EP0619608A3 (en) * 1993-04-07 1994-10-19 MITSUI TOATSU CHEMICALS, Inc. Circuit board for optical devices
EP0600487A3 (en) * 1992-12-03 1996-03-06 Matsushita Electronics Corp Direct contact type image reading device and image reading unit.

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4928122A (en) * 1988-01-21 1990-05-22 Fuji Photo Film Co., Ltd. Exposure head
US4951064A (en) * 1989-05-15 1990-08-21 Westinghouse Electric Corp. Thin film electroluminescent edge emitter assembly and integral packaging
US4980701A (en) * 1989-07-03 1990-12-25 Eastman Kodak Company Non-impact printhead using a mask with a dye sensitive to and adjusted by light in a first spectrum to balance the transmission of light in a second spectrum emitted by an LED array
US5561451A (en) * 1993-01-27 1996-10-01 Sony Corporation Sublimation type printer and photographic paper therefor
US5882533A (en) * 1996-07-15 1999-03-16 Industrial Technology Research Institute Field emission based print head
US6784463B2 (en) * 1997-06-03 2004-08-31 Lumileds Lighting U.S., Llc III-Phospide and III-Arsenide flip chip light-emitting devices
BE1013248A3 (nl) * 2000-01-26 2001-11-06 Krypton Electronic Eng Nv Optisch apparaat.
JP3883770B2 (ja) * 2000-03-07 2007-02-21 パイオニア株式会社 発光素子の製造方法
US6486561B1 (en) * 2000-09-12 2002-11-26 Luminary Logic, Ltd. Semiconductor light emitting element formed on a clear or translucent substrate
US6547249B2 (en) 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
US20040206970A1 (en) * 2003-04-16 2004-10-21 Martin Paul S. Alternating current light emitting device
US7300182B2 (en) * 2003-05-05 2007-11-27 Lamina Lighting, Inc. LED light sources for image projection systems
JP4558400B2 (ja) * 2004-07-23 2010-10-06 新光電気工業株式会社 半導体装置
JP6374739B2 (ja) * 2014-09-19 2018-08-15 株式会社沖データ 露光装置及び画像形成装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968564A (en) * 1975-04-30 1976-07-13 Northern Electric Company Limited Alignment of optical fibers to light emitting diodes
DE3438949A1 (de) * 1983-10-25 1985-05-09 Canon K.K., Tokio/Tokyo Bilderzeugungsvorrichtung
US4614873A (en) * 1982-11-09 1986-09-30 Tokyo Shibaura Denki Kabushiki Kaisha Signal isolator with optical fiber grounding means

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598074A (ja) * 1982-07-05 1984-01-17 Nippon Telegr & Teleph Corp <Ntt> 画像処理方式
JPS5946740A (ja) * 1982-09-09 1984-03-16 Ricoh Co Ltd 光書込デバイス
JPS6162016A (ja) * 1984-09-03 1986-03-29 Nhk Spring Co Ltd Ｌｅｄプリンタヘツド

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968564A (en) * 1975-04-30 1976-07-13 Northern Electric Company Limited Alignment of optical fibers to light emitting diodes
US4614873A (en) * 1982-11-09 1986-09-30 Tokyo Shibaura Denki Kabushiki Kaisha Signal isolator with optical fiber grounding means
DE3438949A1 (de) * 1983-10-25 1985-05-09 Canon K.K., Tokio/Tokyo Bilderzeugungsvorrichtung

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Abstract zu JP 61-32482 (A2) *
Abstract zu JP 61-80876 (A2) *
IBM Technical Disclosure Bulletin" 17(1974) S. 317 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3829553A1 (de) * 1987-09-02 1989-03-16 Alps Electric Co Ltd Optischer aufzeichnungskopf
EP0600487A3 (en) * 1992-12-03 1996-03-06 Matsushita Electronics Corp Direct contact type image reading device and image reading unit.
EP0619608A3 (en) * 1993-04-07 1994-10-19 MITSUI TOATSU CHEMICALS, Inc. Circuit board for optical devices
US5463229A (en) * 1993-04-07 1995-10-31 Mitsui Toatsu Chemicals, Incorporated Circuit board for optical devices

Also Published As

Publication number Publication date
JPS6388809U (enExample) 1988-06-09
JPH059698Y2 (enExample) 1993-03-10
US4827290A (en) 1989-05-02

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection