DE3731167A1 - Verfahren zur haftfesten metallisierung von emails - Google Patents

Verfahren zur haftfesten metallisierung von emails

Info

Publication number
DE3731167A1
DE3731167A1 DE19873731167 DE3731167A DE3731167A1 DE 3731167 A1 DE3731167 A1 DE 3731167A1 DE 19873731167 DE19873731167 DE 19873731167 DE 3731167 A DE3731167 A DE 3731167A DE 3731167 A1 DE3731167 A1 DE 3731167A1
Authority
DE
Germany
Prior art keywords
acids
carried out
roughening
wetting agent
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19873731167
Other languages
German (de)
English (en)
Inventor
Roland Herold
Eveline Dannenberg
Klaus Majentny
Hermann-Josef Dipl Che Middeke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Priority to DE19873731167 priority Critical patent/DE3731167A1/de
Priority to EP19880111820 priority patent/EP0307585A3/fr
Priority to US07/241,594 priority patent/US4948674A/en
Priority to JP63227666A priority patent/JPH01129981A/ja
Publication of DE3731167A1 publication Critical patent/DE3731167A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1855—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by mechanical pretreatment, e.g. grinding, sanding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19873731167 1987-09-14 1987-09-14 Verfahren zur haftfesten metallisierung von emails Withdrawn DE3731167A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19873731167 DE3731167A1 (de) 1987-09-14 1987-09-14 Verfahren zur haftfesten metallisierung von emails
EP19880111820 EP0307585A3 (fr) 1987-09-14 1988-07-22 Procédé de métallisation adhérente d'émail
US07/241,594 US4948674A (en) 1987-09-14 1988-09-07 Method of applying a metal layer of large adhesive strength on enamels
JP63227666A JPH01129981A (ja) 1987-09-14 1988-09-13 エナメルを付着強固にメタライジングする方法及びメタライジングされたエナメル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873731167 DE3731167A1 (de) 1987-09-14 1987-09-14 Verfahren zur haftfesten metallisierung von emails

Publications (1)

Publication Number Publication Date
DE3731167A1 true DE3731167A1 (de) 1989-05-11

Family

ID=6336172

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873731167 Withdrawn DE3731167A1 (de) 1987-09-14 1987-09-14 Verfahren zur haftfesten metallisierung von emails

Country Status (4)

Country Link
US (1) US4948674A (fr)
EP (1) EP0307585A3 (fr)
JP (1) JPH01129981A (fr)
DE (1) DE3731167A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3907902A1 (de) * 1989-03-08 1990-09-13 Siemens Ag Verfahren zum chemischen metallisieren von keramikkoerpern
US5380564A (en) * 1992-04-28 1995-01-10 Progressive Blasting Systems, Inc. High pressure water jet method of blasting low density metallic surfaces
US10465295B2 (en) * 2014-05-20 2019-11-05 Alpha Assembly Solutions Inc. Jettable inks for solar cell and semiconductor fabrication
EP3418425B1 (fr) * 2016-03-25 2021-05-26 Mitsubishi Heavy Industries Engine & Turbocharger, Ltd. Élément doté d'une couche plaquée renforcé par des fibres et procédé de placage pour un élément renforcé par des fibres
CN110423995B (zh) * 2019-08-26 2022-01-04 惠州市安泰普表面处理科技有限公司 不锈钢产品滚镀方法及活化液

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3173705D1 (en) * 1981-06-15 1986-03-20 Asahi Glass Co Ltd Heat radiation reflecting glass and preparation thereof
US4532015A (en) * 1982-08-20 1985-07-30 Phillips Petroleum Company Poly(arylene sulfide) printed circuit boards
DE3332029C2 (de) * 1982-09-16 1994-04-28 Licentia Gmbh Verfahren zur Beschichtung eines festen Körpers
JPS61209926A (ja) * 1985-03-14 1986-09-18 Hitachi Chem Co Ltd 金属膜の形成方法

Also Published As

Publication number Publication date
US4948674A (en) 1990-08-14
EP0307585A3 (fr) 1990-06-27
EP0307585A2 (fr) 1989-03-22
JPH01129981A (ja) 1989-05-23

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Legal Events

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