DE3701013A1 - Verfahren zum mikroloeten - Google Patents

Verfahren zum mikroloeten

Info

Publication number
DE3701013A1
DE3701013A1 DE19873701013 DE3701013A DE3701013A1 DE 3701013 A1 DE3701013 A1 DE 3701013A1 DE 19873701013 DE19873701013 DE 19873701013 DE 3701013 A DE3701013 A DE 3701013A DE 3701013 A1 DE3701013 A1 DE 3701013A1
Authority
DE
Germany
Prior art keywords
soldering
solder
chips
laser beam
yag laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19873701013
Other languages
German (de)
English (en)
Other versions
DE3701013C2 (enExample
Inventor
Werner Dr Moeller
Dieter Knoedler
Viktor Tiederle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Messerschmitt Bolkow Blohm AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Messerschmitt Bolkow Blohm AG filed Critical Messerschmitt Bolkow Blohm AG
Priority to DE19873701013 priority Critical patent/DE3701013A1/de
Publication of DE3701013A1 publication Critical patent/DE3701013A1/de
Application granted granted Critical
Publication of DE3701013C2 publication Critical patent/DE3701013C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE19873701013 1987-01-15 1987-01-15 Verfahren zum mikroloeten Granted DE3701013A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19873701013 DE3701013A1 (de) 1987-01-15 1987-01-15 Verfahren zum mikroloeten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873701013 DE3701013A1 (de) 1987-01-15 1987-01-15 Verfahren zum mikroloeten

Publications (2)

Publication Number Publication Date
DE3701013A1 true DE3701013A1 (de) 1988-07-28
DE3701013C2 DE3701013C2 (enExample) 1989-02-16

Family

ID=6318880

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873701013 Granted DE3701013A1 (de) 1987-01-15 1987-01-15 Verfahren zum mikroloeten

Country Status (1)

Country Link
DE (1) DE3701013A1 (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3834147A1 (de) * 1988-10-07 1990-04-12 Systec Digital Analog Tech Loetverfahren zur verbindung elektronischer und/oder mechanischer bauteile mit einer leiterplatte, zusatzstoff sowie laserloetvorrichtung
EP0402831A1 (de) * 1989-06-15 1990-12-19 Siemens Nixdorf Informationssysteme Aktiengesellschaft Verfahren zur Führung des Temperaturverlaufes an Lötstellen beim Laserlöten
EP0367624A3 (en) * 1988-11-03 1991-03-27 Lasa Industries, Inc. Method and apparatus for laser process control
FR2653367A1 (fr) * 1989-10-24 1991-04-26 Quantel Sa Procede et appareil de brasage au laser.
US5122635A (en) * 1989-12-01 1992-06-16 Messerschmitt-Bolkow-Blohm Gmbh Laser soldering system for smd-components
EP0405408A3 (en) * 1989-06-29 1992-07-22 Siemens Aktiengesellschaft Method and apparatus of making contact to a semiconductor component by use as a laser beam, and resulting device
US5250781A (en) * 1990-11-16 1993-10-05 Mitsubishi Denki Kabushiki Kaisha Laser bonding apparatus
EP0605055A3 (en) * 1992-12-29 1995-06-14 Philips Electronics Nv Pyrometer with emission meter.
EP0999729A3 (de) * 1998-11-03 2004-02-04 Hahn-Schickard-Gesellschaft Für Angewandte Forschung E.V. Verfahren zum Laserlöten und zur Temperaturüberwachung von halbleiterchips sowie nach diesem Verfahren hergestellte Chipkarte
US7023622B2 (en) 2002-08-06 2006-04-04 Dmetrix, Inc. Miniature microscope objective lens
US7113651B2 (en) 2002-11-20 2006-09-26 Dmetrix, Inc. Multi-spectral miniature microscope array
WO2016059552A1 (en) * 2014-10-14 2016-04-21 Spal Automotive S.R.L. Assembly process and station
DE102021101334A1 (de) 2021-01-22 2022-07-28 André LeGuin Verfahren zum Verbinden von zwei flächigen Bauteilen

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3926540A1 (de) * 1989-08-11 1991-02-14 Fraunhofer Ges Forschung Verfahren einer laserbestrahlung beschichteter werkstuecke und vorrichtug zur durchfuehrung des verfahrens
JPH0429338A (ja) * 1990-05-24 1992-01-31 Nippon Mektron Ltd Ｉｃの搭載用回路基板及びその搭載方法
DE4017286A1 (de) * 1990-05-29 1991-12-05 Cooper Ind Inc Verfahren und vorrichtung zum loeten und entloeten
DE4105874C1 (enExample) * 1991-02-25 1992-07-30 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De
DE4105875C1 (enExample) * 1991-02-25 1992-08-13 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4278867A (en) * 1978-12-29 1981-07-14 International Business Machines Corporation System for chip joining by short wavelength radiation
US4547652A (en) * 1982-12-21 1985-10-15 Siemens Aktiengesellschaft Process for the laser soldering of flexible wiring

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4278867A (en) * 1978-12-29 1981-07-14 International Business Machines Corporation System for chip joining by short wavelength radiation
US4547652A (en) * 1982-12-21 1985-10-15 Siemens Aktiengesellschaft Process for the laser soldering of flexible wiring

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
GB-Buch: R.J. Klein Wassink, "Soldering in Electronics" 1984, Electrochem. Publ. Ltd., Ayr, Schottland, S. 136 *
US-Z.: "Laser & Applications" 1986, S. 28,30 *

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3834147A1 (de) * 1988-10-07 1990-04-12 Systec Digital Analog Tech Loetverfahren zur verbindung elektronischer und/oder mechanischer bauteile mit einer leiterplatte, zusatzstoff sowie laserloetvorrichtung
EP0367624A3 (en) * 1988-11-03 1991-03-27 Lasa Industries, Inc. Method and apparatus for laser process control
EP0402831A1 (de) * 1989-06-15 1990-12-19 Siemens Nixdorf Informationssysteme Aktiengesellschaft Verfahren zur Führung des Temperaturverlaufes an Lötstellen beim Laserlöten
EP0405408A3 (en) * 1989-06-29 1992-07-22 Siemens Aktiengesellschaft Method and apparatus of making contact to a semiconductor component by use as a laser beam, and resulting device
FR2653367A1 (fr) * 1989-10-24 1991-04-26 Quantel Sa Procede et appareil de brasage au laser.
WO1991006389A1 (fr) * 1989-10-24 1991-05-16 Quantel S.A. Procede et appareil de brasage au laser
US5122635A (en) * 1989-12-01 1992-06-16 Messerschmitt-Bolkow-Blohm Gmbh Laser soldering system for smd-components
US5250781A (en) * 1990-11-16 1993-10-05 Mitsubishi Denki Kabushiki Kaisha Laser bonding apparatus
US5302801A (en) * 1990-11-16 1994-04-12 Mitsubishi Denki Kabushiki Kaisha Laser bonding apparatus
EP0605055A3 (en) * 1992-12-29 1995-06-14 Philips Electronics Nv Pyrometer with emission meter.
EP0999729A3 (de) * 1998-11-03 2004-02-04 Hahn-Schickard-Gesellschaft Für Angewandte Forschung E.V. Verfahren zum Laserlöten und zur Temperaturüberwachung von halbleiterchips sowie nach diesem Verfahren hergestellte Chipkarte
US7023622B2 (en) 2002-08-06 2006-04-04 Dmetrix, Inc. Miniature microscope objective lens
US7113651B2 (en) 2002-11-20 2006-09-26 Dmetrix, Inc. Multi-spectral miniature microscope array
WO2016059552A1 (en) * 2014-10-14 2016-04-21 Spal Automotive S.R.L. Assembly process and station
DE102021101334A1 (de) 2021-01-22 2022-07-28 André LeGuin Verfahren zum Verbinden von zwei flächigen Bauteilen

Also Published As

Publication number Publication date
DE3701013C2 (enExample) 1989-02-16

Similar Documents

Publication Publication Date Title
DE3701013C2 (enExample)
DE19549635B4 (de) Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip
DE3201802A1 (de) Bondverfahren fuer elektronische bauelemente
EP0204224B1 (de) Verfahren und Vorrichtung zur Justage und Fixierung eines Festkörpers und damit hergestelltes Bauelement
DE68913524T2 (de) Laserüberschallöten.
DE19544929A1 (de) Verfahren und Vorrichtung zum flußmittelfreien Aufbringen eines Lötmittels auf ein Substrat oder einen Chip
DE69711014T2 (de) Verfahren zum gleichzeitigen Bonden einer Mehrzahl von Lötballen an ein Substrat während der Montage einer integrierten Schaltungspackung
EP3186032B1 (de) Verfahren zur herstellung einer lötverbindung
DE69110596T2 (de) Verfahren und Vorrichtung zum Betätigen einer elektronischen Vorrichtung.
DE69131068T2 (de) Verbindungsverfahren und Anordnung zur elektrischen Verbindung kleiner Teile
DE3606764A1 (de) Verfahren und vorrichtung zum mikroloeten
DE2735231A1 (de) Verfahren und vorrichtung zur herstellung von loetverbindungen mittels energiestrahlung
DE102017213930A1 (de) Verfahren zur Herstellung eines Leistungsmoduls
DE69905229T2 (de) Verfahren zum Löten eines D-pak Bauteiles auf einer gedruckten Schaltungsplatte
DE69009421T2 (de) Verfahren zum Simultananordnen und Verlöten von SMD-Bauteilen.
JPS60234768A (ja) レ−ザ−半田付装置
DE4201931C1 (enExample)
DE3137570A1 (de) Verfahren zum direkten verbinden von kupferteilen mit oxidkeramiksubstraten
DE3744764A1 (de) Verfahren zur herstellung von klebeverbindungen mittels laser
DE19907276C2 (de) Verfahren zur Herstellung einer Lötverbindung zwischen einem elektrischen Bauelement und einem Trägersubstrat
DE69203074T2 (de) Verfahren zum Verbindung von Bauelementen durch Laserlöten.
Spletter et al. A laser based system for tape automated bonding to integrated circuits
DE69817932T2 (de) Verfahren zum Verbinden von elektronischen Bauelementen auf einem Substrat
DE69534936T2 (de) Verfahren zum Verbinden integrierter Schaltungschips an Substraten
DE19746408B4 (de) Verfahren zum Anbringen eines Bauelements an einem plattenförmigen Träger

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8363 Opposition against the patent
8327 Change in the person/name/address of the patent owner

Owner name: DEUTSCHE AEROSPACE AG, 8000 MUENCHEN, DE

8365 Fully valid after opposition proceedings
8327 Change in the person/name/address of the patent owner

Owner name: TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILB

8320 Willingness to grant licenses declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 90411 NUERN

8339 Ceased/non-payment of the annual fee