DE3688611T2 - Detektorreihen. - Google Patents

Detektorreihen.

Info

Publication number
DE3688611T2
DE3688611T2 DE86309606T DE3688611T DE3688611T2 DE 3688611 T2 DE3688611 T2 DE 3688611T2 DE 86309606 T DE86309606 T DE 86309606T DE 3688611 T DE3688611 T DE 3688611T DE 3688611 T2 DE3688611 T2 DE 3688611T2
Authority
DE
Germany
Prior art keywords
detectors
rows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE86309606T
Other languages
English (en)
Other versions
DE3688611D1 (de
Inventor
Jagdish Chand Tandon
Mehdi Najm Araghi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Application granted granted Critical
Publication of DE3688611D1 publication Critical patent/DE3688611D1/de
Publication of DE3688611T2 publication Critical patent/DE3688611T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30608—Anisotropic liquid etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/1446—Devices controlled by radiation in a repetitive configuration

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Facsimile Heads (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DE86309606T 1985-12-13 1986-12-10 Detektorreihen. Expired - Fee Related DE3688611T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/808,797 US4668333A (en) 1985-12-13 1985-12-13 Image sensor array for assembly with like arrays to form a longer array

Publications (2)

Publication Number Publication Date
DE3688611D1 DE3688611D1 (de) 1993-07-29
DE3688611T2 true DE3688611T2 (de) 1993-10-07

Family

ID=25199769

Family Applications (1)

Application Number Title Priority Date Filing Date
DE86309606T Expired - Fee Related DE3688611T2 (de) 1985-12-13 1986-12-10 Detektorreihen.

Country Status (4)

Country Link
US (1) US4668333A (de)
EP (1) EP0226451B1 (de)
JP (1) JPH07120760B2 (de)
DE (1) DE3688611T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4830985A (en) * 1985-12-13 1989-05-16 Xerox Corporation Method of replacing an image sensor array
US5297260A (en) * 1986-03-12 1994-03-22 Hitachi, Ltd. Processor having a plurality of CPUS with one CPU being normally connected to common bus
US6379998B1 (en) * 1986-03-12 2002-04-30 Hitachi, Ltd. Semiconductor device and method for fabricating the same
EP0314494A3 (de) * 1987-10-30 1991-10-23 Seiko Epson Corporation Festkörper-Bildsensor
US4990462A (en) * 1989-04-12 1991-02-05 Advanced Micro Devices, Inc. Method for coplanar integration of semiconductor ic devices
US4999077A (en) * 1989-08-31 1991-03-12 Xerox Corporation Method of fabricating full width scanning or imaging arrays from subunits
US5053836A (en) * 1989-11-21 1991-10-01 Eastman Kodak Company Cleaving of diode arrays with scribing channels
US4997792A (en) * 1989-11-21 1991-03-05 Eastman Kodak Company Method for separation of diode array chips during fabrication thereof
US4997793A (en) * 1989-11-21 1991-03-05 Eastman Kodak Company Method of improving cleaving of diode arrays
US5119181A (en) * 1990-03-30 1992-06-02 Xerox Corporation Color array for use in fabricating full width arrays
US5031032A (en) * 1990-03-30 1991-07-09 Xerox Corporation Color array for use in fabricating full width arrays
DE4012080A1 (de) * 1990-04-14 1991-10-17 Bosch Gmbh Robert Verfahren zum aufbau von mikromechanischen sensoren
DE4031192A1 (de) * 1990-09-28 1992-04-09 Siemens Ag Kammartiger funktionsbaustein mit einem einzigen substrat aus einem einkristallinen silizium
US5148268A (en) * 1991-04-26 1992-09-15 Xerox Corporation Multiplexing arrangement for controlling data produced by a color images sensor array
US5977575A (en) * 1992-04-27 1999-11-02 Seiko Instruments Inc. Semiconductor sensor device comprised of plural sensor chips connected to function as a unit
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5474635A (en) * 1994-03-07 1995-12-12 United Technologies Corporation Joining non-coplanar panels and structures of fiber reinforced composites
US5599415A (en) * 1995-07-11 1997-02-04 Reynolds Consumer Products Inc. Method of thermally splicing zippers
WO1999031874A1 (en) * 1997-12-16 1999-06-24 Photobit Corporation Three-sided buttable cmos image sensor
US20030230377A1 (en) * 2002-06-14 2003-12-18 Turvey Robert R. Apparatus and method for automated splicing of closer tape
US8283566B2 (en) 2009-03-14 2012-10-09 Palo Alto Research Center Incorporated Printed circuit boards by massive parallel assembly

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL144778B (nl) * 1966-12-20 1975-01-15 Western Electric Co Werkwijze voor het vervaardigen van een halfgeleiderinrichting door anisotroop etsen alsmede aldus vervaardigde inrichting.
FR2123113B1 (de) * 1971-01-08 1976-05-28 Sescosem
US4029962A (en) * 1975-06-23 1977-06-14 Texas Instruments Incorporated Arrays for infrared image detection
US4063268A (en) * 1976-07-15 1977-12-13 The United States Of America As Represented By The Secretary Of The Army Silicon-polysilicon infrared image device with orientially etched detector
US4106046A (en) * 1977-01-26 1978-08-08 Westinghouse Electric Corp. Radiant energy sensor
JPS56145580A (en) * 1980-04-15 1981-11-12 Yumiba Nobuo Information recording system
US4418472A (en) * 1981-11-23 1983-12-06 Xerox Corporation Method of delineating thin film magnetic head arrays
US4690391A (en) * 1983-01-31 1987-09-01 Xerox Corporation Method and apparatus for fabricating full width scanning arrays
US4542397A (en) * 1984-04-12 1985-09-17 Xerox Corporation Self aligning small scale integrated circuit semiconductor chips to form large area arrays
JPH0654802B2 (ja) * 1985-04-05 1994-07-20 セイコーエプソン株式会社 固体撮像装置
JPS61234562A (ja) * 1985-04-11 1986-10-18 Seiko Epson Corp 固体撮像装置
US4604161A (en) * 1985-05-02 1986-08-05 Xerox Corporation Method of fabricating image sensor arrays

Also Published As

Publication number Publication date
JPS62141762A (ja) 1987-06-25
EP0226451A2 (de) 1987-06-24
EP0226451B1 (de) 1993-06-23
JPH07120760B2 (ja) 1995-12-20
EP0226451A3 (en) 1989-08-23
DE3688611D1 (de) 1993-07-29
US4668333A (en) 1987-05-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee