DE3686815D1 - Montage einer mikrowellenkomponente. - Google Patents
Montage einer mikrowellenkomponente.Info
- Publication number
- DE3686815D1 DE3686815D1 DE8686300398T DE3686815T DE3686815D1 DE 3686815 D1 DE3686815 D1 DE 3686815D1 DE 8686300398 T DE8686300398 T DE 8686300398T DE 3686815 T DE3686815 T DE 3686815T DE 3686815 D1 DE3686815 D1 DE 3686815D1
- Authority
- DE
- Germany
- Prior art keywords
- film
- circuit element
- metal film
- substrate
- membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03G—CONTROL OF AMPLIFICATION
- H03G11/00—Limiting amplitude; Limiting rate of change of amplitude ; Clipping in general
- H03G11/02—Limiting amplitude; Limiting rate of change of amplitude ; Clipping in general by means of diodes
- H03G11/025—Limiting amplitude; Limiting rate of change of amplitude ; Clipping in general by means of diodes in circuits having distributed constants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Waveguides (AREA)
- Semiconductor Integrated Circuits (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP86300398A EP0231560B1 (de) | 1986-01-21 | 1986-01-21 | Montage einer Mikrowellenkomponente |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3686815D1 true DE3686815D1 (de) | 1992-10-29 |
DE3686815T2 DE3686815T2 (de) | 1993-02-11 |
Family
ID=8195860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686300398T Expired - Fee Related DE3686815T2 (de) | 1986-01-21 | 1986-01-21 | Montage einer mikrowellenkomponente. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4581250A (de) |
EP (1) | EP0231560B1 (de) |
DE (1) | DE3686815T2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4754243A (en) * | 1984-09-13 | 1988-06-28 | M/A-Com, Inc. | Microwave component mounting |
US4581250A (en) * | 1984-09-13 | 1986-04-08 | M/A-Com, Inc. | Microwave component mounting |
US4965121A (en) * | 1988-09-01 | 1990-10-23 | The Boc Group, Inc. | Solar control layered coating for glass windows |
US5063177A (en) * | 1990-10-04 | 1991-11-05 | Comsat | Method of packaging microwave semiconductor components and integrated circuits |
US5170169A (en) * | 1991-05-31 | 1992-12-08 | Millitech Corporation | Quasi-optical transmission/reflection switch and millimeter-wave imaging system using the same |
US8240217B2 (en) * | 2007-10-15 | 2012-08-14 | Kavlico Corporation | Diaphragm isolation forming through subtractive etching |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6030102B2 (ja) * | 1980-07-14 | 1985-07-15 | ヤマハ株式会社 | 半導体装置の製法 |
FR2553583B1 (fr) * | 1983-10-14 | 1986-03-21 | Thomson Csf | Limiteur de puissance elevee a diodes pin pour ondes millimetriques et procede de realisation des diodes |
US4581250A (en) * | 1984-09-13 | 1986-04-08 | M/A-Com, Inc. | Microwave component mounting |
-
1984
- 1984-09-13 US US06/649,946 patent/US4581250A/en not_active Expired - Lifetime
-
1986
- 1986-01-21 EP EP86300398A patent/EP0231560B1/de not_active Expired
- 1986-01-21 DE DE8686300398T patent/DE3686815T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0231560B1 (de) | 1992-09-23 |
EP0231560A1 (de) | 1987-08-12 |
DE3686815T2 (de) | 1993-02-11 |
US4581250A (en) | 1986-04-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2039875A1 (en) | Process for forming the ridge structure of a self-aligned semiconductor laser | |
GB1532349A (en) | Forming holes through dielectric material | |
US5260169A (en) | Method for manufacturing semiconductor device | |
DE3686815D1 (de) | Montage einer mikrowellenkomponente. | |
IE801451L (en) | Semiconductor photoresist | |
EP0403936A3 (de) | Verfahren zur Herstellung einer Struktur aus leitfähigem Oxyd | |
DK0718906T3 (da) | Mikrostripfilter | |
JPS5441681A (en) | Manufacture for high frequency transistor | |
US5023994A (en) | Method of manufacturing a microwave intergrated circuit substrate including metal lined via holes | |
GB8515479D0 (en) | Providing electrical connections to planar semiconductor devices | |
JPH0612580Y2 (ja) | 薄型メンブレンスイツチ | |
US3411048A (en) | Semiconductor integrated circuitry with improved isolation between active and passive elements | |
JPS575372A (en) | Thin film diode and manufacture thereof | |
EP0100739A3 (de) | Akustische Oberflächenwellenanordnung und deren Herstellungsverfahren | |
EP0837510A3 (de) | Feldeffekttransistor und Verfahren zur Herstellung | |
CA2057123A1 (en) | Semiconductor device and method of making it | |
JPS6337713Y2 (de) | ||
KR0162757B1 (ko) | 분리절연막을 이용한 공중교각 금속의 형성방법 | |
JPH08148774A (ja) | マイクロ波基板 | |
JPS5727078A (en) | Semiconductor device having light receiving element | |
JPS572545A (en) | Manufacture of semiconductor device | |
JPS572546A (en) | Forming method for thick film infinitesimal metallic pattern | |
JPS5710225A (en) | Forming method for silicon single crystalline film | |
EP1014436A3 (de) | Herstellung eines Substrates | |
KR960026446A (ko) | 플레이티드 히트씽크 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |