DE3686695T2 - Halterung mit mehrschichtschaltung und hoher waermeableitung. - Google Patents

Halterung mit mehrschichtschaltung und hoher waermeableitung.

Info

Publication number
DE3686695T2
DE3686695T2 DE8686113255T DE3686695T DE3686695T2 DE 3686695 T2 DE3686695 T2 DE 3686695T2 DE 8686113255 T DE8686113255 T DE 8686113255T DE 3686695 T DE3686695 T DE 3686695T DE 3686695 T2 DE3686695 T2 DE 3686695T2
Authority
DE
Germany
Prior art keywords
bracket
high heat
heat extraction
layer switching
switching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686113255T
Other languages
English (en)
Other versions
DE3686695D1 (de
Inventor
Yuzo Shimada
Yasuhiro Kurokawa
Kazuaki Utsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE3686695D1 publication Critical patent/DE3686695D1/de
Publication of DE3686695T2 publication Critical patent/DE3686695T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE8686113255T 1985-09-27 1986-09-26 Halterung mit mehrschichtschaltung und hoher waermeableitung. Expired - Lifetime DE3686695T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60215351A JPS6273799A (ja) 1985-09-27 1985-09-27 多層セラミツク配線基板

Publications (2)

Publication Number Publication Date
DE3686695D1 DE3686695D1 (de) 1992-10-15
DE3686695T2 true DE3686695T2 (de) 1993-03-25

Family

ID=16670857

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686113255T Expired - Lifetime DE3686695T2 (de) 1985-09-27 1986-09-26 Halterung mit mehrschichtschaltung und hoher waermeableitung.

Country Status (4)

Country Link
US (1) US4724283A (de)
EP (1) EP0220508B1 (de)
JP (1) JPS6273799A (de)
DE (1) DE3686695T2 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62287658A (ja) * 1986-06-06 1987-12-14 Hitachi Ltd セラミックス多層回路板
US4858072A (en) * 1987-11-06 1989-08-15 Ford Aerospace & Communications Corporation Interconnection system for integrated circuit chips
DE68922118T2 (de) * 1988-01-25 1995-10-12 Toshiba Kawasaki Kk Schaltungsplatte.
US4920640A (en) * 1988-01-27 1990-05-01 W. R. Grace & Co.-Conn. Hot pressing dense ceramic sheets for electronic substrates and for multilayer electronic substrates
US4963697A (en) * 1988-02-12 1990-10-16 Texas Instruments Incorporated Advanced polymers on metal printed wiring board
US4882454A (en) * 1988-02-12 1989-11-21 Texas Instruments Incorporated Thermal interface for a printed wiring board
US5060371A (en) * 1988-10-05 1991-10-29 Applied Precision, Inc. Method of making probe cards
JPH02159797A (ja) * 1988-12-14 1990-06-19 Toshiba Corp セラミックス多層基板
US4899118A (en) * 1988-12-27 1990-02-06 Hughes Aircraft Company Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits
US5177668A (en) * 1989-07-15 1993-01-05 Diehl Gmbh & Co. Arrangement of an integrated circuit on a circuit board
JPH0797705B2 (ja) * 1989-07-17 1995-10-18 日本電気株式会社 多層セラミツク基板
US4996630A (en) * 1989-09-27 1991-02-26 Plessey Electronic Systems Corp. Hybrid module electronics package
USRE34291E (en) * 1989-09-27 1993-06-22 Gec-Marconi Electronic Systems Corp. Hybrid module electronics package
US5300809A (en) * 1989-12-12 1994-04-05 Sumitomo Special Metals Co., Ltd. Heat-conductive composite material
US5317344A (en) * 1989-12-22 1994-05-31 Eastman Kodak Company Light emitting diode printhead having improved signal distribution apparatus
US5132648A (en) * 1990-06-08 1992-07-21 Rockwell International Corporation Large array MMIC feedthrough
US5045824A (en) * 1990-09-04 1991-09-03 Motorola, Inc. Dielectric filter construction
US5158912A (en) * 1991-04-09 1992-10-27 Digital Equipment Corporation Integral heatsink semiconductor package
JP2555231B2 (ja) * 1991-05-21 1996-11-20 富士通株式会社 窒化アルミニウム多層回路基板の製造方法
DE69327666D1 (de) * 1992-07-17 2000-02-24 Vlt Corp Verpackung für elektronische Komponenten
US5650592A (en) * 1993-04-05 1997-07-22 Olin Corporation Graphite composites for electronic packaging
JP3520540B2 (ja) * 1993-12-07 2004-04-19 株式会社デンソー 多層基板
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US5644103A (en) * 1994-11-10 1997-07-01 Vlt Corporation Packaging electrical components having a scallop formed in an edge of a circuit board
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US5945130A (en) * 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
JP2732823B2 (ja) * 1995-02-02 1998-03-30 ヴィエルティー コーポレーション はんだ付け方法
US6031726A (en) * 1995-11-06 2000-02-29 Vlt Corporation Low profile mounting of power converters with the converter body in an aperture
JP3336913B2 (ja) * 1997-06-30 2002-10-21 株式会社村田製作所 電子部品のパッケージ構造
JP2000195720A (ja) * 1998-10-22 2000-07-14 Taiyo Yuden Co Ltd 積層電子部品
US6234842B1 (en) 1998-11-20 2001-05-22 Vlt Corporation Power converter connector assembly
US6690165B1 (en) 1999-04-28 2004-02-10 Hironori Takahashi Magnetic-field sensing coil embedded in ceramic for measuring ambient magnetic field
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6434005B1 (en) 2000-10-27 2002-08-13 Vlt Corporation Power converter packaging
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
US6985341B2 (en) * 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US8400539B2 (en) * 2008-11-12 2013-03-19 Bae Systems Information And Electronic Systems Integration Inc. High density composite focal plane array
US9006770B2 (en) * 2011-05-18 2015-04-14 Tsmc Solid State Lighting Ltd. Light emitting diode carrier
CN114566337B (zh) * 2022-01-23 2024-04-16 中国电子科技集团公司第十三研究所 一种热测试芯片

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits
FR2238688A1 (en) * 1973-07-27 1975-02-21 Hitachi Ltd Sintered laminated integrated circuit unit - mfd. from ceramic, and printed conducting assemblies on a ceramic substrate
JPS55130198A (en) * 1979-03-30 1980-10-08 Hitachi Ltd Hybrid integrated circuit board for tuner
US4336088A (en) * 1980-06-30 1982-06-22 International Business Machines Corp. Method of fabricating an improved multi-layer ceramic substrate
JPS57184296A (en) * 1981-05-09 1982-11-12 Hitachi Ltd Ceramic circuit board
JPS6014494A (ja) * 1983-07-04 1985-01-25 株式会社日立製作所 セラミツク多層配線基板およびその製造方法
JPS6028296A (ja) * 1983-07-27 1985-02-13 株式会社日立製作所 セラミツク多層配線回路板
EP0153737B1 (de) * 1984-02-27 1993-07-28 Kabushiki Kaisha Toshiba Schaltungssubstrat mit hoher Wärmeleitfähigkeit
JPS61111598A (ja) * 1984-10-13 1986-05-29 富士通株式会社 ガラスセラミツクス多層基板の製造方法
US4578365A (en) * 1984-11-26 1986-03-25 General Electric Company High thermal conductivity ceramic body of aluminum nitride
JPH0632376B2 (ja) * 1985-04-05 1994-04-27 松下電器産業株式会社 混成集積回路用多層基板

Also Published As

Publication number Publication date
EP0220508A3 (en) 1989-04-26
EP0220508A2 (de) 1987-05-06
US4724283A (en) 1988-02-09
JPS6273799A (ja) 1987-04-04
EP0220508B1 (de) 1992-09-09
DE3686695D1 (de) 1992-10-15
JPH0452000B2 (de) 1992-08-20

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Legal Events

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