DE3674380D1 - Einbettungsmasse aus epoxyharz. - Google Patents

Einbettungsmasse aus epoxyharz.

Info

Publication number
DE3674380D1
DE3674380D1 DE8686305783T DE3674380T DE3674380D1 DE 3674380 D1 DE3674380 D1 DE 3674380D1 DE 8686305783 T DE8686305783 T DE 8686305783T DE 3674380 T DE3674380 T DE 3674380T DE 3674380 D1 DE3674380 D1 DE 3674380D1
Authority
DE
Germany
Prior art keywords
epoxy resin
embedding dimensions
embedding
dimensions
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686305783T
Other languages
English (en)
Inventor
Munetomo C O Matsushita Torii
Yasuhiro C O Matsushit Kyotani
Hirohiko C O Matsushita Kagawa
Hideki C O Matsushita El Okabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Application granted granted Critical
Publication of DE3674380D1 publication Critical patent/DE3674380D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
DE8686305783T 1986-02-08 1986-07-28 Einbettungsmasse aus epoxyharz. Expired - Lifetime DE3674380D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2611586A JPS62184017A (ja) 1986-02-08 1986-02-08 エポキシ樹脂成形材料

Publications (1)

Publication Number Publication Date
DE3674380D1 true DE3674380D1 (de) 1990-10-25

Family

ID=12184581

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686305783T Expired - Lifetime DE3674380D1 (de) 1986-02-08 1986-07-28 Einbettungsmasse aus epoxyharz.

Country Status (3)

Country Link
EP (1) EP0234085B1 (de)
JP (1) JPS62184017A (de)
DE (1) DE3674380D1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62187721A (ja) * 1986-02-14 1987-08-17 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPS62243649A (ja) * 1986-04-15 1987-10-24 Nippon Retsuku Kk 電気絶縁用樹脂組成物
US4847154A (en) * 1987-05-29 1989-07-11 Basf Corporation Thermosetting resin systems containing secondary amine-terminated siloxane modifiers
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
TW430685B (en) * 1996-07-30 2001-04-21 Nippon Kayaku Kk Epoxy resin liquid composition for semiconductor encapsulation
GB2345802B (en) * 1997-08-19 2001-08-01 Taiyo Yuden Kk Wire wound electronic component
US6198373B1 (en) * 1997-08-19 2001-03-06 Taiyo Yuden Co., Ltd. Wire wound electronic component

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3516964A (en) * 1968-03-26 1970-06-23 Nasa Synthesis of siloxane-containing epoxy polymers
US4287326A (en) * 1980-03-03 1981-09-01 Toray Silicone Company, Ltd. Siloxane-modified epoxy resin compositions
JPS56136816A (en) * 1980-03-31 1981-10-26 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6031523A (ja) * 1983-07-29 1985-02-18 Toshiba Chem Corp 封止用樹脂組成物
JPS6069129A (ja) * 1983-09-27 1985-04-19 Toshiba Corp エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPH0321576B2 (de) 1991-03-25
EP0234085B1 (de) 1990-09-19
EP0234085A1 (de) 1987-09-02
JPS62184017A (ja) 1987-08-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)