DE3674009D1 - Transport- und positionierungsvorrichtung fuer leitersubstrate von leiterplatten. - Google Patents

Transport- und positionierungsvorrichtung fuer leitersubstrate von leiterplatten.

Info

Publication number
DE3674009D1
DE3674009D1 DE8686300313T DE3674009T DE3674009D1 DE 3674009 D1 DE3674009 D1 DE 3674009D1 DE 8686300313 T DE8686300313 T DE 8686300313T DE 3674009 T DE3674009 T DE 3674009T DE 3674009 D1 DE3674009 D1 DE 3674009D1
Authority
DE
Germany
Prior art keywords
transport
positioning device
pcb substrates
pcb
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686300313T
Other languages
English (en)
Inventor
Koichi Asai
Mamoru Tsuda
Jiro Kodama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Application granted granted Critical
Publication of DE3674009D1 publication Critical patent/DE3674009D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
  • Special Conveying (AREA)
DE8686300313T 1985-01-21 1986-01-17 Transport- und positionierungsvorrichtung fuer leitersubstrate von leiterplatten. Expired - Lifetime DE3674009D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60008808A JPS61168299A (ja) 1985-01-21 1985-01-21 プリント基板搬送位置決め装置

Publications (1)

Publication Number Publication Date
DE3674009D1 true DE3674009D1 (de) 1990-10-18

Family

ID=11703132

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686300313T Expired - Lifetime DE3674009D1 (de) 1985-01-21 1986-01-17 Transport- und positionierungsvorrichtung fuer leitersubstrate von leiterplatten.

Country Status (4)

Country Link
US (1) US4660280A (de)
EP (1) EP0189289B1 (de)
JP (1) JPS61168299A (de)
DE (1) DE3674009D1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06880Y2 (ja) * 1986-12-10 1994-01-05 三洋電機株式会社 基板支持装置
JPS647700A (en) * 1987-06-30 1989-01-11 Matsushita Electric Ind Co Ltd Printed board supporting device
JP2588203B2 (ja) * 1987-07-23 1997-03-05 松下電器産業株式会社 薄板の保持および位置決め装置
JPH01207998A (ja) * 1988-02-16 1989-08-21 Sanyo Electric Co Ltd 基板搬送装置
US6288561B1 (en) * 1988-05-16 2001-09-11 Elm Technology Corporation Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
JPH0646645B2 (ja) * 1988-08-25 1994-06-15 株式会社東芝 リードフレーム搬送装置
CA2012165C (en) * 1989-05-13 1996-09-03 Takeo Yoshiji Working line
JPH0828600B2 (ja) * 1990-04-24 1996-03-21 三洋電機株式会社 基板位置決め装置
JP2640581B2 (ja) * 1991-04-17 1997-08-13 富士写真フイルム株式会社 合成樹脂成形品の加工方法および装置
US5363785A (en) * 1992-08-24 1994-11-15 Mim Industries, Inc. Non-intrusive workpiece pallet locator
JP3789188B2 (ja) 1997-02-24 2006-06-21 富士機械製造株式会社 回路部品装着システム
DE19827459C1 (de) * 1998-06-19 1999-12-30 Helmuth Heigl Vorrichtung und Verfahren zum Fördern elektronischer Bauelemente
JP4564121B2 (ja) * 1999-12-15 2010-10-20 富士機械製造株式会社 電気部品装着システム
KR100373559B1 (ko) * 2000-01-19 2003-02-25 삼성전자주식회사 작업대 홀더와 컨베이어를 연결시키는 연결장치를 가진인쇄회로기판 생산장치
US20030221312A1 (en) * 2002-05-31 2003-12-04 Ta Liang Technology Co., Ltd. PCB auto-unloading mechanism
US7332374B2 (en) * 2005-11-09 2008-02-19 Northrop Grumman Corporation Prealignment and gapping for RF substrates
US7775513B2 (en) * 2006-08-21 2010-08-17 Goss International Americas, Inc. Mobile feeder system
JP5912764B2 (ja) * 2012-03-29 2016-04-27 平田機工株式会社 搬送ユニット及び搬送装置
JP7170174B2 (ja) * 2018-06-27 2022-11-14 パナソニックＩｐマネジメント株式会社 搬送システム、部品実装ライン及び搬送レール連結方法
CN113747668B (zh) * 2021-09-01 2023-01-24 西玛特易联（苏州）科技有限公司 一种pcb板对位装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3874497A (en) * 1971-07-12 1975-04-01 Kenneth G Carlson Sanitary side guide rail for conveyor
US3722062A (en) * 1971-11-04 1973-03-27 Warwick Electronics Inc Component insertion system
US3854688A (en) * 1972-09-01 1974-12-17 L Shuford Quick adjusting guide rail for conveyor
JPS5912565B2 (ja) * 1976-12-20 1984-03-24 松下電器産業株式会社 薄板の供給・取出し装置

Also Published As

Publication number Publication date
EP0189289A2 (de) 1986-07-30
EP0189289A3 (en) 1987-08-26
US4660280A (en) 1987-04-28
JPH0249560B2 (de) 1990-10-30
EP0189289B1 (de) 1990-09-12
JPS61168299A (ja) 1986-07-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee