DE3673483D1 - Hyperfrequenzschaltung mit schwachen parasitaeren kapazitaeten. - Google Patents

Hyperfrequenzschaltung mit schwachen parasitaeren kapazitaeten.

Info

Publication number
DE3673483D1
DE3673483D1 DE8686402026T DE3673483T DE3673483D1 DE 3673483 D1 DE3673483 D1 DE 3673483D1 DE 8686402026 T DE8686402026 T DE 8686402026T DE 3673483 T DE3673483 T DE 3673483T DE 3673483 D1 DE3673483 D1 DE 3673483D1
Authority
DE
Germany
Prior art keywords
parasitical
capacities
low
frequency circuit
hyper frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686402026T
Other languages
English (en)
Inventor
Alain Bert
Serge Malbe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Application granted granted Critical
Publication of DE3673483D1 publication Critical patent/DE3673483D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/759—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent discrete passive device
DE8686402026T 1985-09-20 1986-09-16 Hyperfrequenzschaltung mit schwachen parasitaeren kapazitaeten. Expired - Fee Related DE3673483D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8513952A FR2587844B1 (fr) 1985-09-20 1985-09-20 Circuit hyperfrequence a faibles capacites parasites

Publications (1)

Publication Number Publication Date
DE3673483D1 true DE3673483D1 (de) 1990-09-20

Family

ID=9323092

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686402026T Expired - Fee Related DE3673483D1 (de) 1985-09-20 1986-09-16 Hyperfrequenzschaltung mit schwachen parasitaeren kapazitaeten.

Country Status (5)

Country Link
US (1) US4792773A (de)
EP (1) EP0216699B1 (de)
JP (1) JPS6267841A (de)
DE (1) DE3673483D1 (de)
FR (1) FR2587844B1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0258008A (ja) * 1988-08-24 1990-02-27 Sumitomo Electric Ind Ltd 光モジュール
US5134247A (en) * 1989-02-21 1992-07-28 Cray Research Inc. Reduced capacitance chip carrier
WO1991009423A1 (en) * 1989-12-08 1991-06-27 Cray Research, Inc. Improved reduced capacitance chip carrier
US5369059A (en) * 1989-12-08 1994-11-29 Cray Research, Inc. Method for constructing a reduced capacitance chip carrier
JPH03201805A (ja) * 1989-12-28 1991-09-03 Nec Corp 電圧制御発振器
US5296735A (en) * 1991-01-21 1994-03-22 Mitsubishi Denki Kabushiki Kaisha Power semiconductor module with multiple shielding layers
US5161460A (en) * 1991-12-09 1992-11-10 Andersen Edward A Screen printing apparatus for multiple simultaneous printing with accurate registration
US6377464B1 (en) * 1999-01-29 2002-04-23 Conexant Systems, Inc. Multiple chip module with integrated RF capabilities
JP2006033349A (ja) * 2004-07-15 2006-02-02 Nippon Dempa Kogyo Co Ltd 逓倍型の水晶発振器
JP4940628B2 (ja) * 2005-10-31 2012-05-30 ソニー株式会社 光送信モジュール、光送受信モジュール及び光通信装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3659228A (en) * 1970-07-30 1972-04-25 Rca Corp Strip-type directional coupler having elongated aperture in ground plane opposite coupling region
JPS5423447A (en) * 1977-07-25 1979-02-22 Toshiba Corp Strip line coupling circuit
JPS5555601A (en) * 1978-10-20 1980-04-23 Hitachi Ltd Integrated circuit device for microwaves
US4375054A (en) * 1981-02-04 1983-02-22 Rockwell International Corporation Suspended substrate-3 dB microwave quadrature coupler
US4394633A (en) * 1981-04-28 1983-07-19 Westinghouse Electric Corp. Microstrip circuit with suspended substrate stripline regions embedded therein
FR2514562B1 (fr) * 1981-10-09 1985-06-07 Thomson Csf Circuit hybride multicouche a condensateurs et liaisons internes
FR2524712B1 (fr) * 1982-03-31 1985-06-07 Radiotechnique Compelec Circuit hyperfrequence a condensateur integre et application a un circuit d'alimentation

Also Published As

Publication number Publication date
FR2587844A1 (fr) 1987-03-27
JPS6267841A (ja) 1987-03-27
EP0216699B1 (de) 1990-08-16
US4792773A (en) 1988-12-20
EP0216699A1 (de) 1987-04-01
FR2587844B1 (fr) 1987-11-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee